1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interface 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 LED PWM Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Standards 7.1.2 Wi-Fi RF Transmitter (TX) Specifications 7.1.3 Wi-Fi RF Receiver (RX) Specifications 7.2 Bluetooth LE Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Module Dimensions 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Soldering Profiles 12.3.1 Reflow Profile 12.3.2 Wave Profile 12.4 Ultrasonic Vibration Related Documentation and Resources Revision History ESP8684-WROOM-05 Datasheet Version 1.1 Small-sized 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth ® 5 module Built around ESP8684 series of SoCs, RISC-V single-core microprocessor 2 MB/4 MB flash in chip package 5 GPIOs On-board PCB antenna ESP8684-WROOM-05 www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/documentation/esp8684-wroom-05_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP8684H2X or ESP8684H4X embedded, 32-bit RISC-V single-core processor, up to 120 MHz • 576 KB ROM • 272 KB SRAM (16 KB for cache) • In-Package flash (see details in Table 1 Series Comparison) • Access to flash accelerated by cache • Supports flash in-Circuit Programming (ICP) Wi-Fi • 802.11 b/g/n • Center frequency range of operating channel: 2412 ~ 2484 MHz • Supports 20 MHz bandwidth in 2.4 GHz band • 1T1R mode with data rate up to 72.2 Mbps • Wi-Fi Multimedia (WMM) • TX/RX A-MPDU, TX/RX A-MSDU • Immediate Block ACK • Fragmentation and defragmentation • Transmit opportunity (TXOP) • Automatic Beacon monitoring (hardware TSF) • 3 × virtual Wi-Fi interfaces • Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when ESP8684 series scans in Station mode, the SoftAP channel will change along with the Station channel Bluetooth ® • Bluetooth LE: Bluetooth 5.3 certified • High power mode (20 dBm) • Speed: 125 kbps, 500 kbps, 1 Mbps, 2 Mbps • Advertising extensions • Multiple advertisement sets • Channel selection algorithm #2 • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals • Up to 5 GPIOs • GPIO, SPI, UART, I2C, LED PWM controller, general DMA controller, temperature sensor, SAR ADC, timers and watchdog Note: * Please refer to ESP8684 Series Datasheet for de- tailed information about the module peripherals. Integrated Components on Module • 26 MHz crystal oscillator Antenna Options • On-board PCB antenna Espressif Systems 2 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 1 Module Overview Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: –40 ~ 105 °C 1.2 Series Comparison ESP8684-WROOM-05 is a powerful, generic Wi-Fi and Bluetooth LE module. This module is an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. ESP8684-WROOM-05 comes with an on-board PCB antenna. It can be mounted onto the surface of a PCB board or connected to a PCB board via pin headers. The series comparison for ESP8684-WROOM-05 is as follows: Table 1: ESP8684-WROOM-05 Series Comparison Ambient Temp. 4 Size 5 Ordering Code In-Package Flash 1,2 Chip Revision 3 (°C) (mm) ESP8684-WROOM-05-H2X 2 MB v2.0 –40 ~105 15.0 × 17.3 × 2.8 ESP8684-WROOM-05-H4X 4 MB 1 The in-package flash supports: - More than 100,000 program/erase cycles - More than 20 years data retention time 2 By default, the SPI flash on the module operates at a maximum clock frequency of 60 MHz and does not support the auto suspend feature. If you need the flash auto suspend feature, please contact us. 3 Compared to previous chip versions, chip version v2.0 provides an additional 20 KB of SRAM and approximately 100 KB of flash memory (subject to actual application). 4 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espressif module. 5 For details, refer to Section 10 Module Dimensions. The ESP8684H2X and the ESP8684H4X chip fall into the same category, namely ESP8684 chip series. ESP8684 series of chips have a 32-bit RISC-V single-core processor. They integrate a rich set of peripherals including GPIO, SPI, UART, I2C, LED PWM controller, general DMA controller, SAR ADC, temperature sensor, general-purpose timers, system timers, and watchdog timers. Note: * For more information on ESP8684, please refer to ESP8684 Series Datasheet. For chip revision identification, ESP-IDF release that supports a specific chip revision, and other information on chip revisions, please refer to ESP8684 Errata > Section Chip Revision. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines Espressif Systems 3 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 1 Module Overview • Service Robot • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers Espressif Systems 4 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 3 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 10 4 Boot Configurations 12 4.1 Chip Boot Mode Control 13 4.2 ROM Messages Printing Control 13 5 Peripherals 15 5.1 Peripheral Overview 15 5.2 Peripheral Description 15 5.2.1 Connectivity Interface 15 5.2.1.1 UART Controller 15 5.2.1.2 SPI Controller 16 5.2.1.3 I2C Controller 17 5.2.1.4 LED PWM Controller 17 5.2.2 Analog Signal Processing 17 5.2.2.1 SAR ADC 18 5.2.2.2 Temperature Sensor 18 6 Electrical Characteristics 19 6.1 Absolute Maximum Ratings 19 6.2 Recommended Operating Conditions 19 6.3 DC Characteristics (3.3 V, 25 °C) 19 6.4 Current Consumption Characteristics 20 6.4.1 Current Consumption in Active Mode 20 6.4.2 Current Consumption in Other Modes 21 7 RF Characteristics 22 7.1 Wi-Fi Radio 22 7.1.1 Wi-Fi RF Standards 22 7.1.2 Wi-Fi RF Transmitter (TX) Specifications 22 7.1.3 Wi-Fi RF Receiver (RX) Specifications 23 7.2 Bluetooth LE Radio 24 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 24 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 25 Espressif Systems 5 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 Contents 8 Module Schematics 28 9 Peripheral Schematics 29 10 Module Dimensions 30 11 PCB Layout Recommendations 31 11.1 PCB Land Pattern 31 11.2 Module Placement for PCB Design 31 12 Product Handling 32 12.1 Storage Conditions 32 12.2 Electrostatic Discharge (ESD) 32 12.3 Soldering Profiles 32 12.3.1 Reflow Profile 32 12.3.2 Wave Profile 33 12.4 Ultrasonic Vibration 33 Related Documentation and Resources 34 Revision History 35 Espressif Systems 6 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 List of Tables List of Tables 1 ESP8684-WROOM-05 Series Comparison 3 2 Pin Definitions 10 3 Test Point Definitions 11 4 Default Configuration of Strapping Pins 12 5 Description of Timing Parameters for the Strapping Pins 12 6 Chip Boot Mode Control 13 7 UART0 ROM Message Printing Control 14 8 Absolute Maximum Ratings 19 9 Recommended Operating Conditions 19 10 DC Characteristics (3.3 V, 25 °C) 19 11 Current Consumption Depending on RF Modes 20 12 Current Consumption in Low-Power Modes 21 13 Current Consumption in Modem-sleep Mode 21 14 Wi-Fi RF Standards 22 15 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 22 16 TX EVM Test 23 17 RX Sensitivity 23 18 Maximum RX Level 23 19 RX Adjacent Channel Rejection 24 20 Transmitter General Characteristics 24 21 Transmitter Characteristics - Bluetooth LE 1 Mbps 24 22 Transmitter Characteristics - Bluetooth LE 2 Mbps 25 23 Transmitter Characteristics - Bluetooth LE 125 kbps 25 24 Transmitter Characteristics - Bluetooth LE 500 kbps 25 25 Receiver Characteristics - Bluetooth LE 1 Mbps 26 26 Receiver Characteristics - Bluetooth LE 2 Mbps 26 27 Receiver Characteristics - Bluetooth LE 125 kbps 27 28 Receiver Characteristics - Bluetooth LE 500 kbps 27 Espressif Systems 7 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 List of Figures List of Figures 1 ESP8684-WROOM-05 Block Diagram 9 2 Pin Layout (Top View and Bottom View) 10 3 Visualization of Timing Parameters for the Strapping Pins 13 4 ESP8684-WROOM-05 Schematics 28 5 Peripheral Schematics 29 6 Physical Dimensions 30 7 Recommended PCB Land Pattern 31 8 Reflow Profile 32 9 Wave Soldering Profile 33 Espressif Systems 8 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 2 Block Diagram 2 Block Diagram SPI Flash ESP8684 RF Matching 26 MHz Crystal 3V3 GPIOs Antenna GND Figure 1: ESP8684-WROOM-05 Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10 Module Dimensions. Keepout Zone Pin Layout (Top) 1 2 3 4 5 6 7 IO3 IO7 IO6 IO4 IO5 GND 3V3 GND 3V3 RX TX IO9 EN EPAD Pin Layout (Bottom) Keepout Zone 7 6 5 4 3 2 1 3V3 GND IO5 IO4 IO6 IO7 IO3 8 9 10 11 12 13 14 A A Figure 2: Pin Layout (Top View and Bottom View) Note A: The zone marked with dotted lines is the antenna keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP8684 Hardware Design Guidelines > Section Positioning a Module on a Base Board. 3.2 Pin Description The module has 7 pins and 6 test points. See definitions in Table 2 Pin Description and Table 3 Pin Description. For peripheral pin configurations, please refer to ESP8684 Series Datasheet. Table 2: Pin Definitions Name No. Type 1 Function IO3 1 I/O/T GPIO3, ADC1_CH3, LED PWM IO7 2 I/O/T GPIO7, FSPID, MTDO, LED PWM IO6 3 I/O/T GPIO6, FSPICLK, MTCK, LED PWM IO4 4 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS, LED PWM Cont’d on next page Espressif Systems 10 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 3 Pin Definitions Table 2 – cont’d from previous page Name No. Type 1 Function IO5 5 I/O/T GPIO5, FSPIWP, MTDI, LED PWM GND 6 P Ground 3V3 7 P Power supply 1 P: power supply; I: input; O: output; T: high impedance. Table 3: Test Point Definitions Name No. Type 1 Function GND 8 P Ground 3V3 9 P Power supply RX 10 I/O/T GPIO19, U0RXD TX 11 I/O/T GPIO20, U0TXD IO9 12 I/O/T GPIO9 EN 13 I High: on, enables the chip. Low: off, the chip powers off. Default: internally pulled-up. 1 P: power supply; I: input; O: output; T: high impedance. Note: IO0, IO1, IO3, IO5/MTDI pins have low-level glitches during chip power up. See details in section General Purpose Input / Output Interface (GPIO) of ESP8684 Series Datasheet. Espressif Systems 11 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP8684 Series Datasheet > Section Boot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter 8 Module Schematics. The module allows for configuring the following boot parameters through strapping pins and eFuse parameters at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO8 and GPIO9 • ROM message printing – Strapping pin: GPIO8 – eFuse parameter: EFUSE_UART_PRINT_CONTROL The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer to ESP8684 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO8 N/A - GPIO9 Internal weak pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP8684 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 5 and Figure 3. Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t 0 Setup time before CHIP_EN goes from low to high 0 t 1 Hold time after CHIP_EN goes high 3 Espressif Systems 12 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 4 Boot Configurations CHIP_EN t 1 t 0 Strapping pin V IL_nRST V IH Figure 3: Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO9 GPIO8 SPI boot mode 1 x 2 Joint download boot mode 3 0 1 1 Bold marks the default value and configuration. 2 Values that have no effect on the result and can therefore be ignored. 3 Joint Download Boot mode supports UART Download Boot. In addition to SPI Boot and Joint Download Boot modes, ESP8684 also supports SPI Download Boot mode. For details, please see ESP8684 Technical Reference Manual > Chapter Chip Boot Control. 4.2 ROM Messages Printing Control EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 7 UART0 ROM Message Printing Control. Espressif Systems 13 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 4 Boot Configurations Table 7: UART0 ROM Message Printing Control UART0 ROM Code Printing eFuse 1 GPIO8 Enabled 0 Ignored 1 0 2 1 Disabled 1 1 2 0 3 Ignored 1 EFUSE_UART_PRINT_CONTROL Espressif Systems 14 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP8684 integrates a rich set of peripherals including GPIO, SPI, UART, I2C, LED PWM controller, general DMA controller, SAR ADC, temperature sensor, general-purpose timers, system timers, and watchdog timers. To learn more about on-chip components, please refer to ESP8684 Series Datasheet > Section Functional Description. Note: The content below is sourced from ESP8684 Series Datasheet > Section Peripherals. Some information may not be ap- plicable to ESP8684-WROOM-05 as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer to ESP8684 Technical Reference Manual > Section Peripheral Signal List. 5.2 Peripheral Description This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality. 5.2.1 Connectivity Interface This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks. 5.2.1.1 UART Controller The UART Controller in the ESP8684 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It supports two UART interfaces. Feature List • Full-duplex asynchronous communication • Configurable baud rate, up to 2.5 Mbaud • Automatic baud rate detection of input signals • Data frame format: – a START bit – data bits, ranging from 5 ~ 8 – a parity bit – stop bits, whose length can be 1, 1.5, or 2 bits • Special character AT_CMD detection • Supported protocols: RS485, IrDA Espressif Systems 15 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 5 Peripherals • UART as wake-up source • Software and hardware flow control • Three clock sources that can be divided: – 40 MHz PLL_F40M_CLK – internal fast RC oscillator RC_FAST_CLK – external crystal clock XTAL_CLK • 512 x 8-bit RAM shared by TX FIFOs and RX FIFOs of the two UART controllers Pin Assignment For UART, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.2 SPI Controller ESP8684 series features three SPI interfaces (SPI0, SPI1, and SPI2). SPI0 and SPI1 can be configured to operate in SPI memory mode and SPI2 can be configured to operate in general-purpose SPI mode. SPI0 and SPI1 are reserved for system use, and only SPI2 is available for users. Features of SPI0 and SPI1 • Data is transferred in bytes • Up to four-line STR reads and writes are supported • The clock frequency is configurable to a maximum of 60 MHz in STR mode Features of SPI2 General-purpose SPI (GP-SPI) • It can operate in master and slave modes • It supports two-line full-duplex communication and single-/two-/four-line half-duplex communication in both master and slave modes • The host’s clock frequency of SPI2 is configurable. The clock frequency is 40 MHz at most • Data is transferred in bytes • The clock polarity (CPOL) and phase (CPHA) are also configurable • The SPI2 interface can connect to GDMA Pin Assignment For SPI2, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. Espressif Systems 16 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 5 Peripherals 5.2.1.3 I2C Controller The I2C Controller supports communication between the master and slave devices using the I2C bus. Feature List • one I2C controller operating in master mode • Standard mode (100 Kbit/s) and fast mode (400 Kbit/s) • Up to 800 Kbit/s (constrained by SCL and SDA pull-up strength) • Support for 7-bit and 10-bit addressing, as well as dual address mode • 7-bit broadcast address Pin Assignment For I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.4 LED PWM Controller The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List • Six independent PWM generators • Maximum PWM duty cycle resolution of 14 bits • Four independent timers with 14-bit counters, configurable fractional clock dividers and counter overflow values • Adjustable phase of PWM signal output • PWM duty cycle dithering • Automatic duty cycle fading • PWM signal output in low-power mode (Light-sleep mode) Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2 Analog Signal Processing This subsection describes components on the chip that sense and process real-world data. Espressif Systems 17 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 5 Peripherals 5.2.2.1 SAR ADC ESP8684 integrates a Successive Approximation Analog-to-Digital Converter (SAR ADC) to convert analog signals into digital representations. Feature List • 12-bit sampling resolution • Analog voltage sampling from up to five pins • One DIG ADC controller – Provides separate control modules for one-time sampling and multi-channel scanning – Supports one-time sampling and multi-channel scanning working simultaneously – User-defined scanning sequence in multi-channel scanning mode – Provides two filters with configurable filter coefficient – Supports threshold monitoring Pin Assignment The pins for the SAR ADC are multiplexed with GPIO0 ~ GPIO4, JTAG. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2.2 Temperature Sensor The Temperature Sensor in the ESP8684 chip allows for real-time monitoring of temperature changes inside the chip. Feature List • Measurement range: –40 °C ~ 125 °C • Software triggering, wherein the data can be read continuously once triggered • Configurable temperature offset based on the environment to improve the accuracy • Adjustable measurement range Espressif Systems 18 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 6 Electrical Characteristics 6 Electrical Characteristics The values presented in this section are preliminary and may change with the final release of this datasheet. 6.1 Absolute Maximum Ratings Stresses above those listed in Table 8 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 9 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 8: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST OR E Storage temperature –40 105 °C 6.2 Recommended Operating Conditions Table 9: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature –40 — 105 °C 6.3 DC Characteristics (3.3 V, 25 °C) Table 10: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Pull-up resistor — 45 — kΩ R P D Pull-down resistor — 45 — kΩ Espressif Systems 19 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 6 Electrical Characteristics V IH_nRST Chip reset release voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage –0.3 — 0.25 × VDD 1 V 1 VDD is the I/O voltage for a particular power domain of pins. 2 V OH and V OL are measured using high-impedance load. 6.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section Low Power Management in ESP8684 Series Datasheet. 6.4.1 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 11: Current Consumption Depending on RF Modes Work mode Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, @21 dBm 350 802.11g, 54 Mbps, @19 dBm 300 802.11n, HT20, MCS7, @18 dBm 280 RX 802.11b/g/n, HT20 65 Espressif Systems 20 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 6 Electrical Characteristics Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP8684 Series Datasheet. 6.4.2 Current Consumption in Other Modes Table 12: Current Consumption in Low-Power Modes Work mode Description Typ Unit Light-sleep — 140 µA Deep-sleep Only RTC timer is powered on 5 µA Power off CHIP_EN is set to low level, and the chip is powered off 1 µA Table 13: Current Consumption in Modem-sleep Mode Work mode Frequency (MHz) Description Typ 1 (mA) Typ 2 (mA) Modem-sleep 3 80 WFI (Wait-for-Interrupt) 9.4 10.3 CPU run at full speed 12.1 13.0 120 WFI (Wait-for-Interrupt) 10.7 11.5 CPU run at full speed 14.7 15.6 1 Current consumption when all peripheral clocks are disabled. 2 Current consumption when all peripheral clocks are enabled. In practice, the current consumption might be different depending on which peripherals are enabled. 3 In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Espressif Systems 21 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Standards Table 14: Wi-Fi RF Standards Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n Data rate (20 MHz) 11b: 1, 2, 5.5, 11 Mbps 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.2 Mbps (Max) Antenna type PCB antenna 7.1.2 Wi-Fi RF Transmitter (TX) Specifications Target TX power is configurable based on device or certification requirements. The default characteristics are provided in Table 15. Table 15: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 21 — 802.11b, 11 Mbps — 21 — 802.11g, 6 Mbps — 21 — 802.11g, 54 Mbps — 19 — 802.11n, HT20, MCS0 — 19 — 802.11n, HT20, MCS7 — 18 — Espressif Systems 22 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 7 RF Characteristics Table 16: TX EVM Test Min Typ SL 1 Rate (dB) (dB) (dB) 802.11b, 1 Mbps, @21 dBm — –24 –10 802.11b, 11 Mbps, @21 dBm — –24 –10 802.11g, 6 Mbps, @21 dBm — –23 –5 802.11g, 54 Mbps, @19 dBm — –30 –25 802.11n, HT20, MCS0, @20 dBm — –27 –5 802.11n, HT20, MCS7, @18 dBm — –31 –27 1 SL stands for standard limit value. 7.1.3 Wi-Fi RF Receiver (RX) Specifications Table 17: RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — -98.0 — 802.11b, 2 Mbps — -96.5 — 802.11b, 5.5 Mbps — -94.0 — 802.11b, 11 Mbps — -90.0 — 802.11g, 6 Mbps — -94.0 — 802.11g, 9 Mbps — -92.0 — 802.11g, 12 Mbps — -91.0 — 802.11g, 18 Mbps — -89.0 — 802.11g, 24 Mbps — -86.0 — 802.11g, 36 Mbps — -83.0 — 802.11g, 48 Mbps — -78.5 — 802.11g, 54 Mbps — -77.0 — 802.11n, HT20, MCS0 — -92.5 — 802.11n, HT20, MCS1 — -90.5 — 802.11n, HT20, MCS2 — -87.5 — 802.11n, HT20, MCS3 — -84.5 — 802.11n, HT20, MCS4 — -81.5 — 802.11n, HT20, MCS5 — -77.5 — 802.11n, HT20, MCS6 — -75.5 — 802.11n, HT20, MCS7 — -74.0 — Table 18: Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — Cont’d on next page Espressif Systems 23 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 7 RF Characteristics Table 18 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — Table 19: RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 20 — 802.11n, HT20, MCS0 — 16 — 802.11n, HT20, MCS7 — 25 — 7.2 Bluetooth LE Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 20: Transmitter General Characteristics Parameter Min Typ Max Unit RF transmit power — 3 — dBm Gain control step — 3 — dB RF power control range –24 — 20 dBm Table 21: Transmitter Characteristics - Bluetooth LE 1 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –32.0 — dBm F = F0 ± 3 MHz — –38.0 — dBm F = F0 ± > 3 MHz — –41.0 — dBm Modulation characteristics ∆ f1 avg — 249.0 — kHz ∆ f2 max — 246.0 — kHz ∆ f2 avg /∆ f1 avg — 1.1 — — Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 2.0 — kHz Carrier frequency drift Max |f 0 − f n | n=2, 3, 4, ..k — 1.0 — kHz Max |f 0 − f 1 | — 0.5 — kHz Max |f n − f n−5 | n=6, 7, 8, ..k — 1.0 — kHz Espressif Systems 24 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 7 RF Characteristics Table 22: Transmitter Characteristics - Bluetooth LE 2 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 4 MHz — –40.0 — dBm F = F0 ± 5 MHz — –43.0 — dBm F = F0 ± > 5 MHz — –44.0 — dBm Modulation characteristics ∆ f1 avg — 498.0 — kHz ∆ f2 max — 589.0 — kHz ∆ f2 avg /∆ f1 avg — 1.2 — — Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 1.0 — kHz Carrier frequency drift Max |f 0 − f n | n=2, 3, 4, ..k — 3.0 — kHz Max |f 0 − f 1 | — 2.4 — kHz Max |f n − f n−5 | n=6, 7, 8, ..k — 1.2 — kHz Table 23: Transmitter Characteristics - Bluetooth LE 125 kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –32.0 — dBm F = F0 ± 3 MHz — –38.0 — dBm F = F0 ± > 3 MHz — –41.0 — dBm Modulation characteristics ∆ f1 avg — 248.0 — kHz ∆ f1 max — 224.0 — kHz Carrier frequency offset Max |f n | n =0 , 1 , 2 , ..k — 0.5 — kHz Carrier frequency drift Max |f 0 − f n | n=1, 2, 3, ..k — 0.7 — kHz Max |f 0 − f 3 | — 0.2 — kHz Max |f n − f n−3 | n=7, 8, 9, ..k — 0.7 — kHz Table 24: Transmitter Characteristics - Bluetooth LE 500 kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –32.0 — dBm F = F0 ± 3 MHz — –38.0 — dBm F = F0 ± > 3 MHz — –41.0 — dBm Modulation characteristics ∆ f2 avg — 273.0 — kHz ∆ f2 max — 243.0 — kHz Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 0.5 — kHz Carrier frequency drift Max |f 0 − f n | n=1, 2, 3, ..k — 0.7 — kHz Max |f 0 − f 3 | — 0.7 — kHz Max |f n − f n−3 | n=7, 8, 9, ..k — 0.2 — kHz 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics Espressif Systems 25 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 7 RF Characteristics Table 25: Receiver Characteristics - Bluetooth LE 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –98 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I — — 8 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –1 — dB F = F0 – 1 MHz — –3 — dB F = F0 + 2 MHz — –26 — dB F = F0 – 2 MHz — –28 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –31 — dB Image frequency — — –33 — dB Adjacent channel to image frequency F = F image + 1 MHz — –32 — dB F = F image – 1 MHz — –34 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –23 — dBm 2003 MHz ~ 2399 MHz — –30 — dBm 2484 MHz ~ 2997 MHz — –10 — dBm 3000 MHz ~ 12.75 GHz — –17 — dBm Intermodulation — — –31 — dBm 1 Refer to the value of adjacent channel to image frequency when F = F image – 1 MHz. Table 26: Receiver Characteristics - Bluetooth LE 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –95 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 9 — dB Adjacent channel selectivity C/I F = F0 + 2 MHz — –11 — dB F = F0 – 2 MHz — –7 — dB F = F0 + 4 MHz (1) — — — dB F = F0 – 4 MHz — –30 — dB F ≥ F0 + 6 MHz — –35 — dB F ≤ F0 – 6 MHz — –29 — dB Image frequency — — –35 — dB Adjacent channel to image frequency F = F image + 2 MHz — –35 — dB F = F image – 2 MHz (2) — — — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –30 — dBm 2003 MHz ~ 2399 MHz — –34 — dBm 2484 MHz ~ 2997 MHz — –19 — dBm 3000 MHz ~ 12.75 GHz — –28 — dBm Intermodulation — — –33 — dBm 1 Refer to the value of Image frequency. 2 Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz. Espressif Systems 26 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 7 RF Characteristics Table 27: Receiver Characteristics - Bluetooth LE 125 kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –106 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 3 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –7 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — -35 — dB F = F0 – 2 MHz — –34 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –37 — dB Image frequency — — –41 — dB Adjacent channel to image frequency F = F image + 1 MHz — –43 — dB F = F image – 1 MHz — –38 — dB 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Table 28: Receiver Characteristics - Bluetooth LE 500 kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –102 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –6 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –29 — dB F = F0 – 2 MHz — –32 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –36 — dB Image frequency — — –34 — dB Adjacent channel to image frequency F = F image + 1 MHz — –37 — dB F = F image – 1 MHz — –31 — dB 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Espressif Systems 27 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 8 Module Schematics 8 Module Schematics This is the reference design of the module. GPIO3 GPIO7 GPIO6 GPIO4 GPIO5 CHIP_EN GND VDD33 GPIO9 U0TXD U0RXD GPIO3 CHIP_EN GPIO4 GPIO5 GPIO6 GPIO9 GPIO8 GPIO7 LNA_IN U0TXD U0RXD GPIO2 RF_ANT CHIP_EN VDD33 GND VDD33 GNDGND VDD33 GND GND GND GND GNDGND GND VDD33 GND GND GND GND GND GND GND GND VDD33 VDD33 VDD33 GND VDD33 GND ESP8684-WROOM-05(pin-out) PWM2 PWM1 PWM0 PWM5 PWM4 GND 3V3 Test Point The values of C9, L2, C8, C15 and L3 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. NC: No component. ESP8684 Core C5 10uF L2 TBD C14 1uF C7 0.1uF(NC) TP4 C12 0.1uF C4 10nF R9 10K R2 499 C1 TBD C10 0.1uF R3 10K(NC) TP1 C3 1uF TP5 TP6 U2 ESP8684 ANT 1 VDDA3P3 2 VDDA3P3 3 GPIO0 4 GPIO1 5 GPIO2 6 CHIP_EN 7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17 U0RXD 19 U0TXD 20 XTAL_N 22 XTAL_P 23 GND 25 GPIO3 8 VDDA 24 VDDA 21 GPIO18 18 C6 0.1uF R11 10K C13 10uF(NC) L1 2.0nH(0.1nH) C8 TBD C15 TBD C9 TBD D1 ESD U1 26MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 TP3 R1 TBD J2 PORT 6 1 3 2 4 5 7 TP2 C2 TBD L3 TBD ANT1 PCB_ANT 1 2 Figure 4: ESP8684-WROOM-05 Schematics Espressif Systems 28 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). Figure 5: Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP8684 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF (such RC delay circuit has already been built into the module). However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP8684’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP8684 Series Datasheet. Espressif Systems 29 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 10 Module Dimensions 10 Module Dimensions Top View 15.00±0.2 5.47 14.05 8.25 Ø0.50 17.30±0.2 1.44 1.20 1.58 Ø1.30 Ø0.80 Ø0.60 12.00 0.48 3.35 2.8±0.15 0.8 Side View GND 3V3 RX TX IO9 EN Bottom View 2.00 7.05 1.20 1.56 1.49 6.21 4.57 8.38 3.56 4.57 10.19 4.57 13.08 13.08 6.87 5.33 6.86 6xØ1.00 2.00 Unit: mm 0.6x0.60 2.8x2.80 0.50 Figure 6: Physical Dimensions Note: For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information. Espressif Systems 30 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figure for the recommended PCB land pattern with all the dimensions needed for PCB design. See Figure 7 Recommended PCB Land Pattern. • Source file of the recommended PCB land pattern to measure dimensions not covered in Figure 7. You can view the source files for ESP8684-WROOM-05 with Autodesk Viewer. Figure 7: Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP8684 Hardware Design Guidelines > Section Positioning a Module on a Base Board. Espressif Systems 31 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Soldering Profiles 12.3.1 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 8: Reflow Profile Espressif Systems 32 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 12 Product Handling 12.3.2 Wave Profile 50 100 0 200150 250 Temperature (°C) Time (s) 80 Peak temperature: 230 – 260 °C Component Temperature Preheating Component temperature: 90 – 120 °C PCB soak time: 2 – 5 s PCB ramp-up rate: ≤ 5 °C/s Soldering Solder point temperature: 245 ± 10 °C Cooling Exit temperature: ＜ 100 °C Solder Point Temperature 150 200 250 120 50 160 260 90 230 100 Figure 9: Wave Soldering Profile 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 33 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP8684 Series Datasheet – Specifications of the ESP8684 hardware. • ESP8684 Technical Reference Manual – Detailed information on how to use the ESP8684 memory and peripherals. • ESP8684 Hardware Design Guidelines – Guidelines on how to integrate the ESP8684 into your hardware product. • ESP8684 Series SoC Errata – Descriptions of known errors in ESP8684 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP8684 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP8684 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP8684 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP8684 Series SoCs – Browse through all ESP8684 SoCs. https://espressif.com/en/products/socs?id=ESP8684 • ESP8684 Series Modules – Browse through all ESP8684-based modules. https://espressif.com/en/products/modules?id=ESP8684 • ESP8684 Series DevKits – Browse through all ESP8684-based devkits. https://espressif.com/en/products/devkits?id=ESP8684 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 34 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 Revision History Revision History Date Version Release notes 2025-03-14 v1.1 Updated Table 15 Wi-Fi RF Transmitter (TX) Specifications and Table 16 Wi-Fi RF Transmitter (TX) Specifications 2025-01-20 v1.0 • Table 1 Series Comparison: – Update the Ordering Code from ESP8684-WROOM-05-H2 to ESP8684-WROOM-05-H2X – Update the Ordering Code from ESP8684-WROOM-05-H4 to ESP8684-WROOM-05-H4X 2024-12-23 v0.9 • In Chapter 1 Module Overview, renamed 1.2 Description to 1.2 Series Com- parison • In Chapter 3.1 Pin Layout, Add annotations to the antenna keepout zone • Improved the structure, formatting, and wording in: – Chapter 4 Boot Configurations (used to be Section 3.3 Strapping Pins) – Chapter 6 Electrical Characteristics and 7 RF Characteristics (used to be Chapter 4 Electrical Characteristics) – Chapter 10 Module Dimensions and 11 PCB Layout Recommendations (used to be Chapter 7 Physical Dimensions and PCB Land Pattern) • Added Chapter 5 Peripherals • Added Chapter 11.2 Module Placement for PCB Design 2024-01-09 v0.8 Added an item about Bluetooth 5.3 certification in Section 1.1 Features. 2023-XX-XX v0.7 • Updated 8 Module Schematics • Updated 10 Module Dimensions 2022-12-27 v0.6 Added a note to table 2 Pin Description 2022-09-15 v0.5 First release 2022-04-15 v0.1 Draft Espressif Systems 35 Submit Documentation Feedback ESP8684-WROOM-05 Datasheet v1.1 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com