1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interface 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 LED PWM Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 7.2 Bluetooth 5 (LE) Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Specifications 7.2.2 Bluetooth LE RF Receiver (RX) Specifications 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Reflow Profile 12.4 Ultrasonic Vibration Related Documentation and Resources Revision History ESP8684-MINI-1 ESP8684-MINI-1U Datasheet Version 1.1 Small-sized 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth ® 5 module Built around ESP8684 series of SoCs, RISC-V single-core microprocessor 14 GPIOs On-board PCB antenna or external antenna connector ESP8684-MINI-1 ESP8684-MINI-1U Notice: The ESP8684 SoC series belongs to the ESP32-C2 group. Currently, the ESP32-C2 group consists of only one series, the ESP8684. www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/documentation/esp8684-mini-1_mini-1u_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP8684H2X or ESP8684H4X embedded, 32-bit RISC-V single-core processor, up to 120 MHz • 576 KB ROM • 272 KB SRAM (16 KB for cache) • In-Package flash (see details in Table 1 and Table 2) • Access to flash accelerated by cache • Supports flash in-Circuit Programming (ICP) Wi-Fi • 802.11 b/g/n • Center frequency range of operating channel: 2412 ~ 2484 MHz • Supports 20 MHz bandwidth in 2.4 GHz band • 1T1R mode with data rate up to 72.2 Mbps • Wi-Fi Multimedia (WMM) • TX/RX A-MPDU, TX/RX A-MSDU • Immediate Block ACK • Fragmentation and defragmentation • Transmit opportunity (TXOP) • Automatic Beacon monitoring (hardware TSF) • 3 × virtual Wi-Fi interfaces • Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when ESP8684 series scans in Station mode, the SoftAP channel will change along with the Station channel Bluetooth ® • Bluetooth LE: Bluetooth 5.3 certified • High power mode (20 dBm) • Speed: 125 kbps, 500 kbps, 1 Mbps, 2 Mbps • Advertising extensions • Multiple advertisement sets • Channel selection algorithm #2 • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals • 14 GPIOs available for use – 2 strapping GPIOs • GPIO, SPI, UART, I2C, LED PWM controller, general DMA controller, SAR ADC, temperature sensor, general-purpose timers, system timers, and watchdog timers Note: * Please refer to ESP8684 Series Datasheet for de- tailed information about the module peripherals. Integrated Components on Module • 26 MHz crystal oscillator Espressif Systems 2 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 1 Module Overview Antenna Options • ESP8684-MINI-1: On-board PCB antenna • ESP8684-MINI-1U: External antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: –40 ~ 105 °C Certification • RF certification: See certificates • Green certification: RoHS/REACH Test • HTOL/HTSL/uHAST/TCT/ESD/Latch-up 1.2 Series Comparison ESP8684-MINI-1 and ESP8684-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. The series comparison for the two modules is as follows: Table 1: ESP8684-MINI-1 (ANT) Series Comparison 1 Ambient Temp. 5 Size 6 Ordering Code In-Package flash 2,3 Chip Revision 4 (°C) (mm) ESP8684-MINI-1-H2X 2 MB v2.0 –40 ~105 13.2 × 16.6 ×2.4 ESP8684-MINI-1-H4X 4 MB 1 This table shares the same notes presented in Table 2 below. Table 2: ESP8684-MINI-1U (CONN) Series Comparison Ambient Temp. 5 Size 6 Ordering Code In-Package flash 1 Chip Revision 4 (°C) (mm) ESP8684-MINI-1U-H2X 2 MB v2.0 -40 ~105 13.2 ×12.5 ×2.4 ESP8684-MINI-1U-H4X 4 MB 2 The in-package flash supports: - More than 100,000 program/erase cycles - More than 20 years data retention time 3 By default, the SPI flash on the module operates at a maximum clock frequency of 60 MHz and does not support the auto suspend feature. If you need the flash auto suspend feature, please contact us. 4 Compared to previous chip versions, chip version v2.0 provides an additional 20 KB of SRAM and ap- proximately 100 KB of flash memory (subject to actual application). 5 Ambient temperature specifies the recommended temperature range of the environment immediately out- side the Espressif module. 6 For details, refer to Section 10 Physical Dimensions. ESP8684-MINI-1 comes with a PCB antenna. ESP8684-MINI-1U comes with a connector for an external antenna. Both ESP8684-MINI-1 and ESP8684-MINI-1U are available in two variants that integrate the ESP8684H2X and ESP8684H4X chip respectively. Espressif Systems 3 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 1 Module Overview The ESP8684H2X and the ESP8684H4X chip fall into the same category, namely ESP8684 chip series. ESP8684 series of chips have a 32-bit RISC-V single-core processor. They integrate a rich set of peripherals including GPIO, SPI, UART, I2C, LED PWM controller, general DMA controller, SAR ADC, temperature sensor, general-purpose timers, system timers, and watchdog timers. ESP8684H2X and ESP8684H4X chip vary only in the size of system in package (SiP) flash. For details, please refer to ESP8684 Series Comparison in ESP8684 Series Datasheet. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers Espressif Systems 4 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 10 4 Boot Configurations 12 4.1 Chip Boot Mode Control 13 4.2 ROM Messages Printing Control 13 5 Peripherals 15 5.1 Peripheral Overview 15 5.2 Peripheral Description 15 5.2.1 Connectivity Interface 15 5.2.1.1 UART Controller 15 5.2.1.2 SPI Controller 16 5.2.1.3 I2C Controller 17 5.2.1.4 LED PWM Controller 17 5.2.2 Analog Signal Processing 17 5.2.2.1 SAR ADC 18 5.2.2.2 Temperature Sensor 18 6 Electrical Characteristics 19 6.1 Absolute Maximum Ratings 19 6.2 Recommended Operating Conditions 19 6.3 DC Characteristics (3.3 V, 25 °C) 19 6.4 Current Consumption Characteristics 20 6.4.1 Current Consumption in Active Mode 20 6.4.2 Current Consumption in Other Modes 20 7 RF Characteristics 22 7.1 Wi-Fi Radio 22 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 22 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 23 7.2 Bluetooth 5 (LE) Radio 24 7.2.1 Bluetooth LE RF Transmitter (TX) Specifications 24 7.2.2 Bluetooth LE RF Receiver (RX) Specifications 26 Espressif Systems 5 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 Contents 8 Module Schematics 28 9 Peripheral Schematics 30 10 Physical Dimensions 31 10.1 Module Dimensions 31 10.2 Dimensions of External Antenna Connector 32 11 PCB Layout Recommendations 34 11.1 PCB Land Pattern 34 11.2 Module Placement for PCB Design 35 12 Product Handling 36 12.1 Storage Conditions 36 12.2 Electrostatic Discharge (ESD) 36 12.3 Reflow Profile 36 12.4 Ultrasonic Vibration 37 Related Documentation and Resources 38 Revision History 39 Espressif Systems 6 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 List of Tables List of Tables 1 ESP8684-MINI-1 (ANT) Series Comparison 1 3 2 ESP8684-MINI-1U (CONN) Series Comparison 3 3 Pin Definitions 11 4 Default Configuration of Strapping Pins 12 5 Description of Timing Parameters for the Strapping Pins 12 6 Chip Boot Mode Control 13 7 UART0 ROM Message Printing Control 14 8 Absolute Maximum Ratings 19 9 Recommended Operating Conditions 19 10 DC Characteristics (3.3 V, 25 °C) 19 11 Current Consumption Depending on RF Modes 20 12 Current Consumption in Low-Power Modes 20 13 Current Consumption in Modem-sleep Mode 20 14 Wi-Fi RF Characteristics 22 15 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 22 16 TX EVM Test 1 22 17 RX Sensitivity 23 18 Maximum RX Level 23 19 RX Adjacent Channel Rejection 24 20 Transmitter General Specifications 24 21 Bluetooth LE - Transmitter Characteristics - 1 Mbps 24 22 Bluetooth LE - Transmitter Characteristics - 2 Mbps 25 23 Bluetooth LE - Transmitter Characteristics - 125 kbps 25 24 Bluetooth LE - Transmitter Characteristics - 500 kbps 25 25 Bluetooth LE - Receiver Characteristics - 1 Mbps 26 26 Bluetooth LE - Receiver Characteristics - 2 Mbps 26 27 Bluetooth LE - Receiver Characteristics - 125 kbps 27 28 Bluetooth LE - Receiver Characteristics - 500 kbps 27 Espressif Systems 7 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 List of Figures List of Figures 1 ESP8684-MINI-1 Block Diagram 9 2 ESP8684-MINI-1U Block Diagram 9 3 ESP8684-MINI-1 Pin Layout (Top View) 10 4 Visualization of Timing Parameters for the Strapping Pins 13 5 ESP8684-MINI-1 Schematics 28 6 ESP8684-MINI-1U Schematics 29 7 Peripheral Schematics 30 8 ESP8684-MINI-1 Dimensions 31 9 ESP8684-MINI-1U Dimensions 31 10 Dimensions of External Antenna Connector 32 11 ESP8684-MINI-1 Recommended PCB Land Pattern 34 12 ESP8684-MINI-1U Recommended PCB Land Pattern 35 13 Reflow Profile 36 Espressif Systems 8 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 2 Block Diagram 2 Block Diagram SPI Flash ESP8684 RF Matching 26 MHz Crystal 3V3 ESP8684-MINI-1 EN GPIOs Antenna SPI Flash ESP8684 26 MHz Crystal 3V3 ESP8684-MINI-1U EN GPIOs RF Matching Antenna Figure 1: ESP8684-MINI-1 Block Diagram SPI Flash ESP8684 RF Matching 26 MHz Crystal 3V3 ESP8684-MINI-1 EN GPIOs Antenna SPI Flash ESP8684 26 MHz Crystal 3V3 ESP8684-MINI-1U EN GPIOs RF Matching Antenna Figure 2: ESP8684-MINI-1U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10 Physical Dimensions. Pin 49 GND GND GND GND GNDGND GND GND GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 6 Pin 5 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 53 GND Pin 52 GND Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 51 GND Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32 Pin 33 Pin 34 Pin 35 Pin 50 GND Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 46 Pin 47 Pin 48 GND GND 3V3 NC IO2 IO3 NC EN NC NC GND IO0 IO1 GND NC IO10 NC IO4 IO5 IO6 IO7 IO8 IO9 NC NC IO18 NC NC NC RXD0 TXD0 NC NC NC NC GND GND GND GND GND GND GND GND GND GND GND GND GND Keepout Zone A Figure 3: ESP8684-MINI-1 Pin Layout (Top View) Note A: The zone marked with dotted lines is the antenna keepout zone. The pin layout of ESP8684-MINI-1U is the same as that of ESP8684-MINI-1, except that ESP8684-MINI-1U has no keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP8684 Hardware Design Guidelines > Section Positioning a Module on a Base Board. 3.2 Pin Description The module has 53 pins. See pin definitions in Table 3 Pin Description. For peripheral pin configurations, please refer to 5.2 Peripheral Description. Espressif Systems 10 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 3 Pin Definitions Table 3: Pin Definitions Name No. Type 1 Function GND 1, 2, 11, 14, 36-53 P Ground 3V3 3 P Power supply NC 4, 7, 9, 10, 15, 17, 24, 25, 27, 28, 29, 32-35 — Not connected IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, ADC1_CH3 EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO0 12 I/O/T GPIO0, ADC1_CH0 IO1 13 I/O/T GPIO1, ADC1_CH1 IO10 16 I/O/T GPIO10, FSPICS0 IO4 18 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS IO5 19 I/O/T GPIO5, FSPIWP, MTDI IO6 20 I/O/T GPIO6, FSPICLK, MTCK IO7 21 I/O/T GPIO7, FSPID, MTDO IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO18 26 I/O/T GPIO18 RXD0 30 I/O/T GPIO19, U0RXD TXD0 31 I/O/T GPIO20, U0TXD 1 P: power supply; I: input; O: output; T: high impedance. Note: IO0, IO1, IO3, IO5/MTDI pins have low-level glitches during chip power up. See details in section General Purpose Input / Output Interface (GPIO) of ESP8684 Series Datasheet. Espressif Systems 11 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP8684 Series Datasheet > Section Boot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter 8 Module Schematics. The module allows for configuring the following boot parameters through strapping pins and eFuse parameters at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO8 and GPIO9 • ROM message printing – Strapping pin: GPIO8 – eFuse parameter: EFUSE_UART_PRINT_CONTROL The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer to ESP8684 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO8 N/A - GPIO9 Internal weak pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP8684 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 5 and Figure 4. Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t 0 Setup time before CHIP_EN goes from low to high 0 t 1 Hold time after CHIP_EN goes high 3 Espressif Systems 12 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 4 Boot Configurations CHIP_EN t 1 t 0 Strapping pin V IL_nRST V IH Figure 4: Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO9 GPIO8 SPI boot mode 1 x 2 Joint download boot mode 3 0 1 1 Bold marks the default value and configuration. 2 Values that have no effect on the result and can therefore be ignored. 3 Joint Download Boot mode supports UART Download Boot. In addition to SPI Boot and Joint Download Boot modes, ESP8684 also supports SPI Download Boot mode. For details, please see ESP8684 Technical Reference Manual > Chapter Chip Boot Control. 4.2 ROM Messages Printing Control EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 7 UART0 ROM Message Printing Control. Espressif Systems 13 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 4 Boot Configurations Table 7: UART0 ROM Message Printing Control UART0 ROM Code Printing eFuse 1 GPIO8 Enabled 0 Ignored 1 0 2 1 Disabled 1 1 2 0 3 Ignored 1 EFUSE_UART_PRINT_CONTROL Espressif Systems 14 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP8684 integrates a rich set of peripherals including GPIO, SPI, UART, I2C, LED PWM controller, general DMA controller, SAR ADC, temperature sensor, general-purpose timers, system timers, and watchdog timers. To learn more about on-chip components, please refer to ESP8684 Series Datasheet > Section Functional Description. Note: The content below is sourced from ESP8684 Series Datasheet > Section Peripherals. Some information may not be ap- plicable to ESP8684-MINI-1 and ESP8684-MINI-1U, as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer to ESP8684 Technical Reference Manual > Section Peripheral Signal List. 5.2 Peripheral Description This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality. 5.2.1 Connectivity Interface This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks. 5.2.1.1 UART Controller The UART Controller in the ESP8684 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It supports two UART interfaces. Feature List • Full-duplex asynchronous communication • Configurable baud rate, up to 2.5 Mbaud • Automatic baud rate detection of input signals • Data frame format: – a START bit – data bits, ranging from 5 ~ 8 – a parity bit – stop bits, whose length can be 1, 1.5, or 2 bits • Special character AT_CMD detection • Supported protocols: RS485, IrDA Espressif Systems 15 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 5 Peripherals • UART as wake-up source • Software and hardware flow control • Three clock sources that can be divided: – 40 MHz PLL_F40M_CLK – internal fast RC oscillator RC_FAST_CLK – external crystal clock XTAL_CLK • 512 x 8-bit RAM shared by TX FIFOs and RX FIFOs of the two UART controllers Pin Assignment For UART, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.2 SPI Controller ESP8684 series features three SPI interfaces (SPI0, SPI1, and SPI2). SPI0 and SPI1 can be configured to operate in SPI memory mode and SPI2 can be configured to operate in general-purpose SPI mode. SPI0 and SPI1 are reserved for system use, and only SPI2 is available for users. Features of SPI0 and SPI1 • Data is transferred in bytes • Up to four-line STR reads and writes are supported • The clock frequency is configurable to a maximum of 60 MHz in STR mode Features of SPI2 General-purpose SPI (GP-SPI) • It can operate in master and slave modes • It supports two-line full-duplex communication and single-/two-/four-line half-duplex communication in both master and slave modes • The host’s clock frequency of SPI2 is configurable. The clock frequency is 40 MHz at most • Data is transferred in bytes • The clock polarity (CPOL) and phase (CPHA) are also configurable • The SPI2 interface can connect to GDMA Pin Assignment For SPI2, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. Espressif Systems 16 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 5 Peripherals 5.2.1.3 I2C Controller The I2C Controller supports communication between the master and slave devices using the I2C bus. Feature List • one I2C controller operating in master mode • Standard mode (100 Kbit/s) and fast mode (400 Kbit/s) • Up to 800 Kbit/s (constrained by SCL and SDA pull-up strength) • Support for 7-bit and 10-bit addressing, as well as dual address mode • 7-bit broadcast address Pin Assignment For I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.4 LED PWM Controller The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List • Six independent PWM generators • Maximum PWM duty cycle resolution of 14 bits • Four independent timers with 14-bit counters, configurable fractional clock dividers and counter overflow values • Adjustable phase of PWM signal output • PWM duty cycle dithering • Automatic duty cycle fading • PWM signal output in low-power mode (Light-sleep mode) Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2 Analog Signal Processing This subsection describes components on the chip that sense and process real-world data. Espressif Systems 17 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 5 Peripherals 5.2.2.1 SAR ADC ESP8684 integrates a Successive Approximation Analog-to-Digital Converter (SAR ADC) to convert analog signals into digital representations. Feature List • 12-bit sampling resolution • Analog voltage sampling from up to five pins • One DIG ADC controller – Provides separate control modules for one-time sampling and multi-channel scanning – Supports one-time sampling and multi-channel scanning working simultaneously – User-defined scanning sequence in multi-channel scanning mode – Provides two filters with configurable filter coefficient – Supports threshold monitoring Pin Assignment The pins for the SAR ADC are multiplexed with GPIO0 ~ GPIO4, JTAG. For more information about the pin assignment, see ESP8684 Series Datasheet > Section IO Pins and ESP8684 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2.2 Temperature Sensor The Temperature Sensor in the ESP8684 chip allows for real-time monitoring of temperature changes inside the chip. Feature List • Measurement range: –40 °C ~ 125 °C • Software triggering, wherein the data can be read continuously once triggered • Configurable temperature offset based on the environment to improve the accuracy • Adjustable measurement range Espressif Systems 18 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 6 Electrical Characteristics 6 Electrical Characteristics The values presented in this section are preliminary and may change with the final release of this datasheet. 6.1 Absolute Maximum Ratings Stresses above those listed in Table 8 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 9 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 8: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST OR E Storage temperature –40 105 °C 6.2 Recommended Operating Conditions Table 9: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Voltage applied to power supply pin 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature -40 — 105 °C 6.3 DC Characteristics (3.3 V, 25 °C) Table 10: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Pull-up resistor — 45 — kΩ R P D Pull-down resistor — 45 — kΩ Espressif Systems 19 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 6 Electrical Characteristics V IH_nRST Chip reset release voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage –0.3 — 0.25 × VDD 1 V 1 VDD is the I/O voltage for a particular power domain of pins. 2 V OH and V OL are measured using high-impedance load. 6.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section Low Power Management in ESP8684 Series Datasheet. 6.4.1 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 11: Current Consumption Depending on RF Modes Work mode Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, @21 dBm 370 802.11g, 54 Mbps, @19 dBm 320 802.11n, HT20, MCS7, @18 dBm 300 RX 802.11b/g/n, HT20 65 Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP8684 Series Datasheet. 6.4.2 Current Consumption in Other Modes Table 12: Current Consumption in Low-Power Modes Work mode Description Typ Unit Light-sleep — 140 µA Deep-sleep Only RTC timer is powered on 5 µA Power off CHIP_EN is set to low level, and the chip is powered off 1 µA Table 13: Current Consumption in Modem-sleep Mode Work mode Frequency (MHz) Description Typ 1 (mA) Typ 2 (mA) Modem-sleep 3 80 WFI (Wait-for-Interrupt) 9.4 10.3 CPU run at full speed 12.1 13.0 Cont’d on next page Espressif Systems 20 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 6 Electrical Characteristics Table 13 – cont’d from previous page Work mode Frequency (MHz) Description Typ 1 (mA) Typ 2 (mA) 120 WFI (Wait-for-Interrupt) 10.7 11.5 CPU run at full speed 14.7 15.6 1 Current consumption when all peripheral clocks are disabled. 2 Current consumption when all peripheral clocks are enabled. In practice, the current consumption might be different depending on which peripherals are enabled. 3 In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Espressif Systems 21 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio Table 14: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n Data rate (20 MHz) 11b: 1, 2, 5.5 and 11 Mbps 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.2 Mbps (Max) Antenna type PCB antenna and external antenna connector 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics Table 15: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 21 — 802.11b, 11 Mbps — 21 — 802.11g, 6 Mbps — 21 — 802.11g, 54 Mbps — 19 — 802.11n, HT20, MCS0 — 19 — 802.11n, HT20, MCS7 — 18 — Table 16: TX EVM Test 1 Min Typ SL 1 Rate (dB) (dB) (dB) 802.11b, 1 Mbps, @21 dBm — -24 –10 802.11b, 11 Mbps, @21 dBm — -24 –10 802.11g, 6 Mbps, @21 dBm — -23 –5 Cont’d on next page Espressif Systems 22 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 7 RF Characteristics Table 16 – cont’d from previous page Min Typ SL 2 Rate (dB) (dB) (dB) 802.11g, 54 Mbps, @19 dBm — -30 –25 802.11n, HT20, MCS0, @20 dBm — -27 –5 802.11n, HT20, MCS7, @18 dBm — -31 –27 1 EVM is measured at the corresponding typical TX power provided in Table 15 Wi-Fi RF Transmitter (TX) Characteristics above. 2 SL stands for standard limit value. 7.1.2 Wi-Fi RF Receiver (RX) Characteristics Table 17: RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — -98.0 — 802.11b, 2 Mbps — -96.5 — 802.11b, 5.5 Mbps — –94.0 — 802.11b, 11 Mbps — –90.0 — 802.11g, 6 Mbps — –94.0 — 802.11g, 9 Mbps — –92.0 — 802.11g, 12 Mbps — –91.0 — 802.11g, 18 Mbps — –89.0 — 802.11g, 24 Mbps — –86.0 — 802.11g, 36 Mbps — –83.0 — 802.11g, 48 Mbps — –78.5 — 802.11g, 54 Mbps — –77.0 — 802.11n, HT20, MCS0 — –92.5 — 802.11n, HT20, MCS1 — –90.5 — 802.11n, HT20, MCS2 — –87.5 — 802.11n, HT20, MCS3 — –84.5 — 802.11n, HT20, MCS4 — –81.5 — 802.11n, HT20, MCS5 — –77.5 — 802.11n, HT20, MCS6 — –75.5 — 802.11n, HT20, MCS7 — –74.0 — Table 18: Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — Cont’d on next page Espressif Systems 23 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 7 RF Characteristics Table 18 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — Table 19: RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 20 — 802.11n, HT20, MCS0 — 16 — 802.11n, HT20, MCS7 — 25 — 7.2 Bluetooth 5 (LE) Radio Table 20: Transmitter General Specifications Parameter Min Typ Max Unit RF transmit power — 3 — dBm Gain control step — 3 — dB RF power control range –24 — 20 dBm 7.2.1 Bluetooth LE RF Transmitter (TX) Specifications Table 21: Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –32.0 — dBm F = F0 ± 3 MHz — –38.0 — dBm F = F0 ± > 3 MHz — –41.0 — dBm Modulation characteristics ∆ f1 avg — 249.0 — kHz ∆ f2 max — 246.0 — kHz ∆ f2 avg /∆ f1 avg — 1.1 — — Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 2.0 — kHz Carrier frequency drift Max |f 0 − f n | n=2, 3, 4, ..k — 1.0 — kHz Max |f 0 − f 1 | — 0.5 — kHz Max |f n − f n−5 | n=6, 7, 8, ..k — 1.0 — kHz Espressif Systems 24 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 7 RF Characteristics Table 22: Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 4 MHz — –40.0 — dBm F = F0 ± 5 MHz — –43.0 — dBm F = F0 ± > 5 MHz — –44.0 — dBm Modulation characteristics ∆ f1 avg — 498.0 — kHz ∆ f2 max — 589.0 — kHz ∆ f2 avg /∆ f1 avg — 1.2 — — Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 1.0 — kHz Carrier frequency drift Max |f 0 − f n | n=2, 3, 4, ..k — 3.0 — kHz Max |f 0 − f 1 | — 2.4 — kHz Max |f n − f n−5 | n=6, 7, 8, ..k — 1.2 — kHz Table 23: Bluetooth LE - Transmitter Characteristics - 125 kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –32.0 — dBm F = F0 ± 3 MHz — –38.0 — dBm F = F0 ± > 3 MHz — –41.0 — dBm Modulation characteristics ∆ f1 avg — 248.0 — kHz ∆ f1 max — 224.0 — kHz Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 0.5 — kHz Carrier frequency drift Max |f 0 − f n | n=1, 2, 3, ..k — 0.7 — kHz Max |f 0 − f 3 | — 0.2 — kHz Max |f n − f n−3 | n=7, 8, 9, ..k — 0.7 — kHz Table 24: Bluetooth LE - Transmitter Characteristics - 500 kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –32.0 — dBm F = F0 ± 3 MHz — –38.0 — dBm F = F0 ± > 3 MHz — –41.0 — dBm Modulation characteristics ∆ f2 avg — 273.0 — kHz ∆ f2 max — 243.0 — kHz Carrier frequency offset Max |f n | n=0, 1, 2, ..k — 0.5 — kHz Carrier frequency drift Max |f 0 − f n | n=1, 2, 3, ..k — 0.7 — kHz Max |f 0 − f 3 | — 0.7 — kHz Max |f n − f n−3 | n=7, 8, 9, ..k — 0.2 — kHz Espressif Systems 25 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 7 RF Characteristics 7.2.2 Bluetooth LE RF Receiver (RX) Specifications Table 25: Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –98 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I — — 8 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –1 — dB F = F0 – 1 MHz — –3 — dB F = F0 + 2 MHz — –26 — dB F = F0 – 2 MHz — –28 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –31 — dB Image frequency — — –33 — dB Adjacent channel to image frequency F = F image + 1 MHz — –32 — dB F = F image – 1 MHz — –34 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –23 — dBm 2003 MHz ~ 2399 MHz — –30 — dBm 2484 MHz ~ 2997 MHz — –10 — dBm 3000 MHz ~ 12.75 GHz — –17 — dBm Intermodulation — — –31 — dBm 1 Refer to the value of adjacent channel to image frequency when F = F image – 1 MHz. Table 26: Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –95 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 9 — dB Adjacent channel selectivity C/I F = F0 + 2 MHz — –11 — dB F = F0 – 2 MHz — –7 — dB F = F0 + 4 MHz (1) — — — dB F = F0 – 4 MHz — –30 — dB F ≥ F0 + 6 MHz — –35 — dB F ≤ F0 – 6 MHz — –29 — dB Image frequency — — –35 — dB Adjacent channel to image frequency F = F image + 2 MHz — –35 — dB F = F image – 2 MHz (2) — — — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –30 — dBm 2003 MHz ~ 2399 MHz — –34 — dBm 2484 MHz ~ 2997 MHz — –19 — dBm 3000 MHz ~ 12.75 GHz — –28 — dBm Intermodulation — — –33 — dBm 1 Refer to the value of Image frequency. 2 Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz. Espressif Systems 26 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 7 RF Characteristics Table 27: Bluetooth LE - Receiver Characteristics - 125 kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –106 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 3 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –7 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — -35 — dB F = F0 – 2 MHz — –34 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –37 — dB Image frequency — — –41 — dB Adjacent channel to image frequency F = F image + 1 MHz — –43 — dB F = F image – 1 MHz — –38 — dB 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Table 28: Bluetooth LE - Receiver Characteristics - 500 kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –102 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –6 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –29 — dB F = F0 – 2 MHz — –32 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –36 — dB Image frequency — — –34 — dB Adjacent channel to image frequency F = F image + 1 MHz — –37 — dB F = F image – 1 MHz — –31 — dB 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Espressif Systems 27 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 8 Module Schematics 8 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. The initial value could be 24 nH. ESP8684-MINI-1(pin-out) ESP8684 Note: This is not another chip, it is module pinout. CHIP_EN GPIO4 GPIO5 GPIO6 U0RXD ANT GPIO0 GPIO1 GPIO2 GPIO3 RF_ANT U0TXD GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO10 GPIO6 GPIO7 GPIO8 GPIO9 GPIO18 U0RXD U0TXD GPIO4 GPIO5 GPIO7 GPIO8 GPIO9 GPIO10 GPIO18 GND VDD33 GND GNDGND GND GND GND GND VDD33 GND GNDGND VDD33 VDD33 GND GND GND GND GND VDD33 GND GND VDD33 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP8684-MINI-1> V1.0 A4 2 2Tuesday, July 12, 2022 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP8684-MINI-1> V1.0 A4 2 2Tuesday, July 12, 2022 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP8684-MINI-1> V1.0 A4 2 2Tuesday, July 12, 2022 C1 TBD R1 TBD R2 499 Y1 26MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 L1 2.0nH D1 ESD C6 0.1uF U2 ANT 1 VDDA3P3 2 VDDA3P3 3 GPIO0 4 GPIO1 5 GPIO2 6 CHIP_EN 7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17 U0RXD 19 U0TXD 20 XTAL_N 22 XTAL_P 23 GND 25 GPIO3 8 VDDA 24 VDDA 21 GPIO18 18 C9 TBD C3 1uF C10 0.1uF C4 10nF U3 ESP8684-MINI-1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 NC 9 NC 10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 NC 27 IO7 21 IO8 22 IO0 12 IO1 13 GND 52 IO6 20 NC 35 NC 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 ANT1 PCB_ANT 1 2 C7 0.1uF C8 TBD C2 TBD C12 0.1uF C5 10uF L2 TBD Figure 5: ESP8684-MINI-1 Schematics Espressif Systems 28 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 8 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. The initial value could be 24 nH. ESP8684-MINI-1U(pin-out) ESP8684 Note: This is not another chip, it is module pinout. CHIP_EN GPIO4 GPIO5 GPIO6 U0RXD ANT GPIO0 GPIO1 GPIO2 GPIO3 RF_ANT U0TXD GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO10 GPIO6 GPIO7 GPIO8 GPIO9 GPIO18 U0RXD U0TXD GPIO4 GPIO5 GPIO7 GPIO8 GPIO9 GPIO10 GPIO18 GND VDD33 GND GNDGND GND GND GND GND VDD33 GND GNDGND VDD33 VDD33 GND GND GND GND GND VDD33 GND GND VDD33 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP8684-MINI-1U> V1.1 A4 2 2Tuesday, July 12, 2022 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP8684-MINI-1U> V1.1 A4 2 2Tuesday, July 12, 2022 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP8684-MINI-1U> V1.1 A4 2 2Tuesday, July 12, 2022 C1 TBD R2 499 Y1 26MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 L1 2.0nH C9 TBD U2 ANT 1 VDDA3P3 2 VDDA3P3 3 GPIO0 4 GPIO1 5 GPIO2 6 CHIP_EN 7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17 U0RXD 19 U0TXD 20 XTAL_N 22 XTAL_P 23 GND 25 GPIO3 8 VDDA 24 VDDA 21 GPIO18 18 C6 0.1uF D1 ESD C3 1uF C4 10nF C10 0.1uF C7 0.1uF U3 ESP8684-MINI-1U GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 NC 9 NC 10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 NC 27 IO7 21 IO8 22 IO0 12 IO1 13 GND 52 IO6 20 NC 35 NC 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 C2 TBD C8 TBD C12 0.1uF L2 TBD C5 10uF ANT1 IPEX_III 1 4 2 3 R1 TBD Figure 6: ESP8684-MINI-1U Schematics Espressif Systems 29 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A ESP8684-MINI-1 ESP8684-MINI-1U IO4 IO5 IO6 IO7 IO8 IO2 IO3 EN IO9 IO0 IO1 IO10 RXD0 TXD0 EN TMS TDI TCK TDO IO18 GND VDD33 GND GND GND GND GND VDD33 VDD33 GND C3 TBD C4 0.1uF R2 0JP2 Boot Option 1 1 2 2 U1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 NC 9 NC 10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 NC 27 IO7 21 IO8 22 IO0 12 IO1 13 GND 52 IO6 20 NC 35 NC 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 C1 10uF C2 0.1uF SW1 JP1 JTAG 1 1 2 2 3 3 4 4 JP4 UART 1 1 2 2 3 3 4 4 R8 10K R1 TBD Figure 7: Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP8684 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP8684’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP8684 Series Datasheet. • JTAG interface is optional. • Boot Option, TXD0 and RXD0 are used as firmware download and debug port. Espressif Systems 30 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 5.4 16.6±0.15 0.813.2±0.15 Top view Side view Bottom view 2.4±0.15 11.2 0.6 1.45 1.45 8.4 9.2 10 11.2 12.6 6.8 7.6 8.4 9 10.6 0.62 0.62 11.95 9.95 0.6 5.4 9.2 11 Ø0.5 Unit: mm Figure 8: ESP8684-MINI-1 Dimensions 5.4 12.5±0.15 0.813.2±0.15 Top view Side view Bottom view 0.6 1.45 1.45 8.4 9.2 10 11.2 12.6 6.8 7.6 8.4 9 10.6 12.25 0.6 5.4 9.2 11 Unit: mm 1.55 1.7 8.7 0.47 0.48 9.18 11.55 2.4±0.15 0.85 5.6 12.5 Figure 9: ESP8684-MINI-1U Dimensions Note: For information about tape, reel, and product marking, please refer to ESP8684 Module Packaging Information. Espressif Systems 31 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP8684-MINI-1U uses the third generation external antenna connector as shown in Figure 10 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 10: Dimensions of External Antenna Connector The external antenna used for ESP8684-MINI-1U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance Espressif Systems 32 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 10 Physical Dimensions • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 10 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 33 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11 ESP8684-MINI-1 Recommended PCB Land Pattern and Figure 12 ESP8684-MINI-1U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11 and Figure 12 . You can view the source files for ESP8684-MINI-1 and ESP8684-MINI-1U with Autodesk Viewer. • 3D models of ESP8684-MINI-1 and ESP8684-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). Unit: mm : Pad 5.4 11.2 0.6 8.4 9.2 10 11 12.6 6.8 7.6 8.4 9.2 10.6 Antenna Area Pin 1 13.2 16.6 1.45 5.4 1.450.6 9 11.2 Top view Figure 11: ESP8684-MINI-1 Recommended PCB Land Pattern Espressif Systems 34 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 11 PCB Layout Recommendations 10 6.8 9.2 Pin 1 0.6 10.6 9.2 7.6 8.4 5.4 11 12.6 8.4 13.2 5.6 1.45 5.4 1.450.6 11.2 9 Unit: mm : Pad 12.5 Figure 12: ESP8684-MINI-1U Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP8684 Hardware Design Guidelines > Section Positioning a Module on a Base Board. Espressif Systems 35 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 13: Reflow Profile Espressif Systems 36 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 37 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP8684 Series Datasheet – Specifications of the ESP8684 hardware. • ESP8684 Technical Reference Manual – Detailed information on how to use the ESP8684 memory and peripherals. • ESP8684 Hardware Design Guidelines – Guidelines on how to integrate the ESP8684 into your hardware product. • ESP8684 Series SoC Errata – Descriptions of known errors in ESP8684 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP8684 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP8684 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP8684 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP8684 Series SoCs – Browse through all ESP8684 SoCs. https://espressif.com/en/products/socs?id=ESP8684 • ESP8684 Series Modules – Browse through all ESP8684-based modules. https://espressif.com/en/products/modules?id=ESP8684 • ESP8684 Series DevKits – Browse through all ESP8684-based devkits. https://espressif.com/en/products/devkits?id=ESP8684 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 38 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 Revision History Revision History Date Version Release notes 2025-07-15 v1.1 • Updated Chapter 10.2 Dimensions of External Antenna Connector 2025-03-10 v1.0 • Added Certification and Test related information in Section 1 Module Overview • Updated Table 15 Wi-Fi RF Transmitter (TX) Characteristics and Table 16 Wi- Fi RF Transmitter (TX) Characteristics 2025-01-20 v0.9 • Table 1 Series Comparison and table 2 Series Comparison: – Update Ordering Code from ESP8684-MINI-1-H2 to ESP8684-MINI- 1-H2X – Update Ordering Code from ESP8684-MINI-1-H4 to ESP8684-MINI- 1-H4X – Update Ordering Code from ESP8684-MINI-1U-H2 to ESP8684- MINI-1U-H2X – Update Ordering Code from ESP8684-MINI-1U-H4 to ESP8684- MINI-1U-H4X 2024-12-23 v0.8 • In Chapter 1 Module Overview, renamed 1.2 Description to 1.2 Series Com- parison • In Chapter 3.1 Pin Layout, Add annotations to the antenna keepout zone • Improved the structure, formatting, and wording in: – Chapter 4 Boot Configurations (use to be Section 3.3 Strapping Pins) – Chapter 6 Electrical Characteristics and 7 RF Characteristics (used to be Chapter 4 Electrical Characteristics) – Chapter 10 Physical Dimensions and 11 PCB Layout Recommenda- tions (used to be Chapter 7 Physical Dimensions and PCB Land Pat- tern) • Added Chapter 5 Peripherals • Added Chapter 11.2 Module Placement for PCB Design 2024-01-09 v0.7 • Added an item about Bluetooth 5.3 certification in Section 1.1 Features. • Updated Section 10.2 Dimensions of External Antenna Connector 2022-12-27 v0.6 Added a note to table 3 Pin Description 2021-08-22 v0.5 Updated Chapter 6 Electrical Characteristics based on 26 MHz crystal 2022-02-16 v0.1 Preliminary release Espressif Systems 39 Submit Documentation Feedback ESP8684-MINI-1 & MINI-1U Datasheet v1.1 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com