1 Module Overview1.1 Features1.2 Description1.3 Applications2 Block Diagram3 Pin Definitions3.1 Pin Layout3.2 Pin Description3.3 Strapping Pins4 Electrical Characteristics4.1 Absolute Maximum Ratings4.2 Recommended Operating Conditions4.3 DC Characteristics (3.3 V, 25 °C)4.4 Current Consumption Characteristics4.5 Wi-Fi RF Characteristics4.5.1 Wi-Fi RF Standards4.5.2 Transmitter Characteristics4.5.3 Receiver Characteristics4.6 Bluetooth Radio4.6.1 Receiver – Basic Data Rate4.6.2 Transmitter – Basic Data Rate4.6.3 Receiver – Enhanced Data Rate4.6.4 Transmitter – Enhanced Data Rate4.7 Bluetooth LE Radio4.7.1 Receiver4.7.2 Transmitter5 Module Schematics6 Peripheral Schematics7 Physical Dimensions and PCB Land Pattern7.1 Physical Dimensions7.2 Recommended PCB Land Pattern8 Product Handling8.1 Storage Conditions8.2 Electrostatic Discharge (ESD)8.3 Reflow Profile8.4 Ultrasonic VibrationRelated Documentation and ResourcesRevision History
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CHIP_PUSENSOR_VPSENSOR_VNGPIO34GPIO35GPIO32GPIO33GPIO26GPIO27GPIO14GPIO12GPIO13GPIO15GPIO0GPIO4GPIO16GPIO17GPIO5GPIO18GPIO19GPIO21U0RXDU0TXDGPIO22GPIO23ESP32_ANTCHIP_PUGPIO35SCK/CLKSCS/CMDSENSOR_VPSHD/SD2 SWP/SD3SDI/SD1SDO/SD0SENSOR_VNGPIO34GPIO33GPIO25GPIO26GPIO27GPIO32GPIO14GPIO12GPIO15GPIO13GPIO2GPIO0GPIO4GPIO16GPIO17SDO/SD0SDI/SD1SCK/CLKSWP/SD3SCS/CMDSHD/SD2GPIO18GPIO5GPIO23GPIO19U0TXDGPIO22U0RXDGPIO21CTL2GPIO25GPIO2 CTL1CTL2RF1RF2ESP32_ANTCTL1CTL2 RF2RF1GNDVDD33GNDGNDGNDGND GNDVDD_SDIOVDD33GNDGNDGNDVDD_SDIOGND GNDGNDGNDGNDGNDVDD33GND GNDGNDGNDGNDGNDGNDVDD33VDD33VDD33GNDGNDVDD33VDD33GNDGNDGNDGNDGNDGNDGNDGNDGNDESP32-WROOM-DA(pin-out)The values of C15, L4 and C14vary with the actual PCB board.The values of C1 and C2 vary withthe selection of the crystal.The value of R2 varies with the actualPCB board.NC: No component.RF Switch:The values of C38, L3,C37,C40,L6 and C39 vary with the actual PCB board.C21100pF/50V(10%)C410.1uF(NC)C111uF/6.3V(20%)C63.3nF/6.3V(10%)C3100pF/50V(10%)R3 499(1%)U8SN74AUP1G04(NC)NC11A2GND3Y4VCC6NC25C38TBDC1310uF/6.3V(20%)C190.1uF/6.3V(10%)L6 TBDR14 0U140MHz(±10ppm)XIN1GND2XOUT3GND4U4ESP32-WROOM-DAGND113V32EN3SENSOR_VP4SENSOR_VN5IO346IO357IO328IO339IO2510IO2611IO2712IO1413IO1214GND340IO2339IO2238TXD037RXD036IO2135NC34IO1933IO1832IO531IO1730IO1629IO428IO027GND216IO1317SD218SD319CMD20CLK21SD022SD123IO1524IO225NC15NC26C4522pFC15TBDR1310KC4622pFC37TBDC40.1uF/6.3V(10%)R2 TBDR15 0C44 100pFC14TBDC40TBDD1ESDR1210KC90.1uF/6.3V(10%)C39TBDC43 100pFL4 TBDTP11U3 FLASH/CS1DO2/WP3GND4DI5CLK6/HOLD7VCC8R1 20K(5%)C1TBDU2ESP32-D0WD-V3VDDA1LNA_IN2VDD3P33VDD3P34SENSOR_VP5SENSOR_CAPP6SENSOR_CAPN7SENSOR_VN8CHIP_PU9VDET_110VDET_21132K_XP1232K_XN13GPIO2514GPIO2615GPIO2716MTMS17MTDI18VDD3P3_RTC19MTCK20MTDO21GPIO222GPIO023GPIO424VDD_SDIO26GPIO1625GPIO1727SD_DATA_228SD_DATA_329SD_CMD30SD_CLK31SD_DATA_032GND49SD_DATA_133GPIO534GPIO1835GPIO1938CAP247VDDA43XTAL_N44XTAL_P45GPIO2336U0TXD41GPIO2239GPIO2142VDD3P3_CPU37CAP148VDDA46U0RXD40C42 100pFANT1PCB ANT12C181uF/6.3V(20%)C100.1uF/6.3V(10%)L5 2.0nH(±0.1nH)L3 TBDC510nF/6.3V(10%)TP21U9RTC6603SPRF11GND2RF23VC24RFC5VC16C201uF/6.3V(20%)C2TBDANT2PCB ANT12
GNDENSENSOR_VPGPI36SENSOR_VNGPI39GPI34GPI35GPIO32GPIO33GPIO26GPIO27GPIO14GPIO22TXD0RXD0GPIO21GPIO19GPIO18GPIO4GPIO0GPIO5GPIO23GNDGPIO12ENGPIO14GPIO12GPIO13GPIO15GPIO13GNDGPIO15GPIO16GPIO17GNDVDD33GNDVDD33GNDGNDGNDMTMSMTDIMTCKMTDOSW1R110KR2 0RJP2Boot Option1122C20.1uFJP3JTAG11223344JP1UART11223344C31uFU1ESP32-WROOM-DAGND113V32EN3SENSOR_VP4SENSOR_VN5IO346IO357IO328IO339NC10IO2611IO2712IO1413IO1214NC15GND216IO1317NC18NC19IO027IO428IO1629IO1730IO531IO1832IO1933NC34IO2135RXD036TXD037IO2238IO2339GND340P_GND43NC22NC21NC23IO1524NC25NC26NC20C4 0.1uFC122uF • • Ω µ fi
Top ViewSide ViewBottom View34.40±0.1518.0019.2023.4027.2013.9715.8035.60±0.1511.4316.511.501.271.00±0.103.50±0.1510.6710.503.703.700.500.50Unit: mmTolerance: +/-0.10 mm0.850.900.450.9024.55R0.501.08
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• • fl fi fl501500251 ~ 3 ℃/s0200250200–1 ~ –5 ℃/sCooling zone10021750100 250Reflow zone 217 ℃ 60 ~ 90 sTemperature (℃)Preheating zone150 ~ 200 ℃ 60 ~ 120 sRamp-up zonePeak Temp. 235 ~ 250 ℃Soldering time> 30 sTime (sec.)Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/sPreheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 sReflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 sCooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/sSolder — Sn-Ag-Cu (SAC305) lead-free solder alloy fl fi
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