1 Module Overview1.1 Features1.2 Series Comparison1.3 Applications2 Block Diagram3 Pin Definitions3.1 Pin Layout3.2 Pin Description4 Boot Configurations4.1 Chip Boot Mode Control4.2 VDD_SPI Voltage Control4.3 ROM Messages Printing Control4.4 JTAG Signal Source Control4.5 Chip Power-up and Reset5 Peripherals5.1 Peripheral Overview5.2 Peripheral Description5.2.1 Connectivity Interface5.2.1.1 UART Controller5.2.1.2 I2C Interface5.2.1.3 I2S Interface5.2.1.4 LCD and Camera Controller5.2.1.5 Serial Peripheral Interface (SPI)5.2.1.6 Two-Wire Automotive Interface (TWAI®)5.2.1.7 USB 2.0 OTG Full-Speed Interface5.2.1.8 USB Serial/JTAG Controller5.2.1.9 SD/MMC Host Controller5.2.1.10 Motor Control PWM (MCPWM)5.2.1.11 Remote Control Peripheral (RMT)5.2.1.12 Pulse Count Controller (PCNT)5.2.2 Analog Signal Processing5.2.2.1 SAR ADC5.2.2.2 Temperature Sensor5.2.2.3 Touch Sensor6 Electrical Characteristics6.1 Absolute Maximum Ratings6.2 Recommended Operating Conditions6.3 DC Characteristics (3.3 V, 25 °C)6.4 Current Consumption Characteristics6.4.1 Current Consumption in Active Mode6.4.2 Current Consumption in Other Modes6.5 Memory Specifications7 RF Characteristics7.1 Wi-Fi Radio7.1.1 Wi-Fi RF Transmitter (TX) Characteristics7.1.2 Wi-Fi RF Receiver (RX) Characteristics7.2 Bluetooth LE Radio7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics7.2.2 Bluetooth LE RF Receiver (RX) Characteristics8 Module Schematics9 Peripheral Schematics10 Physical Dimensions10.1 Module Dimensions10.2 Dimensions of External Antenna Connector11 PCB Layout Recommendations11.1 PCB Land Pattern11.2 Module Placement for PCB Design12 Product Handling12.1 Storage Conditions12.2 Electrostatic Discharge (ESD)12.3 Reflow Profile12.4 Ultrasonic VibrationDatasheet VersioningRelated Documentation and ResourcesRevision History
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fi 5544332211D DC CB BA AThe values of L3, C5, C11, L2 and C12vary with the actual PCB board.The values of C1 and C4 vary withthe selection of the crystal.The value of R4 varies with theactual PCB board. R4 could be aresistor or inductor, the initialvalue is suggested to be 24 nH.ESP32-S3-WROOM-1(pin-out)ESP32-S3R2ESP32-S3NC: No component.ESP32-S3R850 ohm Impedance ControlESP32-S3R16VSPICLKSPICS0SPIHDSPIDSPIWPSPIQSPICS0LNA_INRF_ANTGPIO39GPIO41GPIO42U0RXDGPIO46GPIO45U0TXDSPICLKGPIO48SPIDSPIQSPIWPSPIHDGPIO21GPIO20GPIO19GPIO18GPIO17GPIO16GPIO15GPIO14GPIO13GPIO12GPIO11GPIO10GPIO9GPIO8GPIO7GPIO6GPIO5GPIO4GPIO3GPIO2GPIO1GPIO0CHIP_PUGPIO38GPIO37GPIO36GPIO35GPIO47GPIO40CHIP_PUGPIO4GPIO5GPIO6GPIO7GPIO15GPIO16GPIO17GPIO18GPIO3GPIO46GPIO9GPIO10GPIO11GPIO12GPIO13GPIO14GPIO21GPIO47GPIO48GPIO45GPIO0GPIO35GPIO36GPIO37GPIO38GPIO39GPIO40GPIO41GPIO42U0RXDU0TXDGPIO2GPIO1GPIO8GPIO19GPIO20VDD_SPIGND GND GNDVDD33GND GND GNDGNDGNDVDD33GNDGNDVDD33GNDVDD33GNDGNDGNDVDD_SPIGNDGNDVDD33GNDGNDGNDGNDGNDGNDVDD33GNDVDD33TitleSizePage Name Re vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-WROOM-1>V1.4A42 2Tuesday, November 21, 2023TitleSizePage Name Re vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-WROOM-1>V1.4A42 2Tuesday, November 21, 2023TitleSizePage Name Re vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-WROOM-1>V1.4A42 2Tuesday, November 21, 2023R16 0U3 ESP32-S3-WROOM-1GND13V32EN3IO44IO55IO66IO77IO158IO169IO1710IO1811IO1913IO2014IO812GND40IO139IO238TXD037RXD036IO4235IO4134IO4033IO3932IO3831IO3730IO3629IO3528IO027IO4616IO917IO1018IO1119IO1220IO1321IO1422IO2123IO4724IO4825IO315IO4526EPAD41C11TBDC130.1uFC12TBDC4TBDR3 499C150.1uFC141uFR13 0C31uFC90.1uFU1VDDA56LNA_IN1VDD3P32VDD3P33GPIO05GPIO16GPIO27GPIO38GPIO49GPIO510GPIO611GPIO712GPIO1015GPIO1116GPIO1217GPIO1318GPIO1419XTAL_32K_P21VDD3P3_RTC20XTAL_32K_N22GPIO1723GPIO1824GPIO1925GPIO2026VDD_SPI29SPIWP31SPICS032SPIQ34SPID35SPICLK33SPICLK_N36GND57SPICLK_P37GPIO3338GPIO3843GPIO4652XTAL_N53XTAL_P54MTMS48MTDO45U0TXD49VDD3P3_CPU46CHIP_PU4VDDA55MTDI47GPIO813GPIO914GPIO2127SPICS128SPIHD30GPIO3439GPIO3540GPIO3641U0RXD50GPIO4551GPIO3742MTCK44L1 2.0nH(0.1nH)C610uFR15 0Y140MHz(±10ppm)XIN1GND2XOUT3GND4C100.1uFU2 FLASHVDD8GND4/CS1CLK6/HOLD7/WP3DO2DI5R110K(NC)C71uFL2 TBDD1ESDANT1PCB_ANT12C1TBDR4 0C5TBDR10 0C210nFL3TBDC80.1uFR14 0
5544332211D DC CB BA AThe values of C11, L2 and C12vary with the actual PCB board.The values of C1 and C4 vary withthe selection of the crystal.The value of R4 varies with theactual PCB board. R4 could be aresistor or inductor, the initialvalue is suggested to be 24 nH.ESP32-S3-WROOM-1U(pin-out)ESP32-S3R2ESP32-S3NC: No component.ESP32-S3R850 ohm Impedance ControlESP32-S3R16VSPICLKSPICS0SPIHDSPIDSPIWPSPIQSPICS0LNA_INRF_ANTGPIO39GPIO41GPIO42U0RXDGPIO46GPIO45U0TXDSPICLKGPIO48SPIDSPIQSPIWPSPIHDGPIO21GPIO20GPIO19GPIO18GPIO17GPIO16GPIO15GPIO14GPIO13GPIO12GPIO11GPIO10GPIO9GPIO8GPIO7GPIO6GPIO5GPIO4GPIO3GPIO2GPIO1GPIO0CHIP_PUGPIO38GPIO37GPIO36GPIO35GPIO47GPIO40CHIP_PUGPIO4GPIO5GPIO6GPIO7GPIO15GPIO16GPIO17GPIO18GPIO3GPIO46GPIO9GPIO10GPIO11GPIO12GPIO13GPIO14GPIO21GPIO47GPIO48GPIO45GPIO0GPIO35GPIO36GPIO37GPIO38GPIO39GPIO40GPIO41GPIO42U0RXDU0TXDGPIO2GPIO1GPIO8GPIO19GPIO20VDD_SPIVDD33GND GNDVDD33GND GND GNDGNDGNDVDD33GNDGNDVDD33GNDVDD33GNDGNDGNDVDD_SPIGNDGNDVDD33GNDGNDGNDGNDGNDGNDGNDVDD33TitleSizePage Name Re vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-WROOM-1U>V1.5A42 2Tuesday, November 21, 2023TitleSizePage Name Re vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-WROOM-1U>V1.5A42 2Tuesday, November 21, 2023TitleSizePage Name Re vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-WROOM-1U>V1.5A42 2Tuesday, November 21, 2023C11TBDU3 ESP32-S3-WROOM-1UGND13V32EN3IO44IO55IO66IO77IO158IO169IO1710IO1811IO1913IO2014IO812GND40IO139IO238TXD037RXD036IO4235IO4134IO4033IO3932IO3831IO3730IO3629IO3528IO027IO4616IO917IO1018IO1119IO1220IO1321IO1422IO2123IO4724IO4825IO315IO4526EPAD41R16 0C12TBDANT1CONN123C130.1uFC4TBDD1ESDC150.1uFR3 499R13 0C141uFU1VDDA56LNA_IN1VDD3P32VDD3P33GPIO05GPIO16GPIO27GPIO38GPIO49GPIO510GPIO611GPIO712GPIO1015GPIO1116GPIO1217GPIO1318GPIO1419XTAL_32K_P21VDD3P3_RTC20XTAL_32K_N22GPIO1723GPIO1824GPIO1925GPIO2026VDD_SPI29SPIWP31SPICS032SPIQ34SPID35SPICLK33SPICLK_N36GND57SPICLK_P37GPIO3338GPIO3843GPIO4652XTAL_N53XTAL_P54MTMS48MTDO45U0TXD49VDD3P3_CPU46CHIP_PU4VDDA55MTDI47GPIO813GPIO914GPIO2127SPICS128SPIHD30GPIO3439GPIO3540GPIO3641U0RXD50GPIO4551GPIO3742MTCK44C90.1uFC31uFR15 0C610uFL1 2.0nH(0.1nH)R110K(NC)U2 FLASHVDD8GND4/CS1CLK6/HOLD7/WP3DO2DI5C100.1uFY140MHz(±10ppm)XIN1GND2XOUT3GND4L2 TBDC71uFC1TBDR10 0R4 0C210nFR14 0C80.1uF
5544332211DDCCBBAANC: No component.X1: ESR = Max. 70 KFor ESP32-S3-WROOM-1-N16R16V and ESP32-S3-WROOM-1U-N16R16V, IO47/IO48 operates in the 1.8V voltage domain.ENIO42 TMSIO41 TDIIO37IO36IO38IO40 TDOIO39 TCKTXD0RXD0IO35IO48IO47IO12IO13IO3IO6IO7IO9IO10IO11IO15IO16IO14IO21IO17IO18USB_D-USB_D+IO1IO2IO45IO4IO5IO0ENIO19IO20IO46IO8GNDGND GNDVDD33 GND GNDGNDGNDGNDVDD33GNDGNDGNDGNDC30.1uFJP4Boot Option1122SW1C4 12pF(NC)U1ESP32-S3-WROOM-1/ESP32-S3-WROOM-1UGND13V32EN3IO44IO55IO66IO77IO158IO169IO1710IO1811IO1913IO2014IO812GND40IO139IO238TXD037RXD036IO4235IO4134IO4033IO3932IO3831IO3730IO3629IO3528IO027IO4616IO917IO1018IO1119IO1220IO1321IO1422IO2123IO4724IO4825IO315IO4526EPAD41R7 0R4 0C2 TBDX132.768KHz(NC)12R2 NCR5 0(NC)R1 TBDC5TBDR3 0(NC)JP1UART11223344C122uFC8 0.1uFR6 0JP3USB OTG1122JP2JTAG11223344C7 12pF(NC)C6TBD • • Ω µ fi
25.5±0.21.51.2716.5140 x 0.940 x 0.93.1±0.15Top ViewSide ViewBottom View18±0.215.817.640 x 0.4511.050.840 x 0.850.53.740 x Ø0.5560.9Ø0.5Unit: mm13.971.272.015ESP32-S3-WROOM-1U Dimensions1.51.2716.5140 x 0.9Top ViewBottom View18±0.240 x 0.4540 x 0.850.53.710.7515.6517.50.9Side View40 x 0.919.2±0.240 x Ø0.550.81.081.12.4631.273.2±0.15Unit: mm13.972.01513.1Ø0.57.510.290.93.70.93.710.297.5 25.5±0.21.51.2716.5140 x 0.940 x 0.93.1±0.15Top ViewSide ViewBottom View18±0.215.817.640 x 0.4511.050.840 x 0.850.53.740 x Ø0.5560.9Ø0.5Unit: mm13.971.272.015ESP32-S3-WROOM-1U Dimensions1.51.2716.5140 x 0.9Top ViewBottom View18±0.240 x 0.4540 x 0.850.53.710.7515.6517.50.9Side View40 x 0.919.2±0.240 x Ø0.550.81.081.12.4631.273.2±0.15Unit: mm13.972.01513.1Ø0.57.510.290.93.70.93.710.297.5
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• • fi fi • fi Antenna Area115 26401825.540 x1.540 x0.91.53.70.90.93.77.51.2760.5ESP32-S3-WROOM-1U Land Pattern11518261.519.240 x1.51.2740 x0.9400.50.53.73.70.90.97.50.5Unit: mmCopperVia for thermal padUnit: mmCopperVia for thermal pad7.4910.290.50.52.0152.0151.2717.510.2916.511.272.015 2.01517.516.511.19
Antenna Area115 26401825.540 x1.540 x0.91.53.70.90.93.77.51.2760.5ESP32-S3-WROOM-1U Land Pattern11518261.519.240 x1.51.2740 x0.9400.50.53.73.70.90.97.50.5Unit: mmCopperVia for thermal padUnit: mmCopperVia for thermal pad7.4910.290.50.52.0152.0151.2717.510.2916.511.272.015 2.01517.516.511.19
• • fl fi fl50 100015020025020010050150 250 Time (s)21725Preheating150 – 200 °C60 – 120 sRamp-up25 – 150 °C60 – 90 s1 – 3 °C/sSoldering＞ 217 °C60 – 90 sPeak temperature: 235 – 250 °CPeak time: 30 – 70 sSoldering time: ＞ 30 sSolder: Sn-Ag-Cu (SAC305) lead-free solderTemperature (°C)180230Cooling＜ 180 °C–5 ~ –1 °C/s fl fi
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