Product Overview Block Diagram Features Applications 1 ESP32-S3-PICO-1 Series Comparison 1.1 ESP32-S3-PICO-1 Series Nomenclature 1.2 Comparison 2 Pin Definition 2.1 Pin Layout 2.2 Pin Description 2.3 Strapping Pins 2.3.1 Chip Boot Mode Control 2.3.2 VDD_SPI Voltage Control 2.3.3 ROM Messages Printing Control 2.3.4 JTAG Signal Source Control 3 Electrical Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Power Supply Characteristics 3.3 VDD_SPI Output Characteristics 3.4 DC Characteristics (3.3 V, 25 °C) 3.5 ADC Characteristics 3.6 Current Consumption 3.6.1 RF Current Consumption in Active Mode 3.6.2 Current Consumption in Other Modes 3.7 Reliability 3.8 Wi-Fi Radio 3.8.1 Wi-Fi RF Transmitter (TX) Specifications 3.8.2 Wi-Fi RF Receiver (RX) Specifications 3.9 Bluetooth 5 (LE) Radio 3.9.1 Bluetooth LE RF Transmitter (TX) Characteristics 3.9.2 Bluetooth LE RF Receiver (RX) Characteristics 4 Schematics 5 Peripheral Schematics 6 Packaging 7 Product Handling 7.1 Storage Conditions 7.2 Reflow Profile 7.3 Ultrasonic Vibration 8 Related Documentation and Resources Revision History ESP32-S3-PICO-1 Series Datasheet Version 1.1 2.4 GHz Wi-Fi + Bluetooth ® LE SiP Supporting IEEE 802.11b/g/n (2.4 GHz Wi-Fi) and Bluetooth ® 5 (LE) Integrating all peripheral components in one single package Including: ESP32-S3-PICO-1-N8R2 ESP32-S3-PICO-1-N8R8 www.espressif.com Product Overview ESP32-S3-PICO-1 is a System-in-Package (SiP) device that is based on ESP32-S3 with integrated 2.4 GHz Wi-Fi and Bluetooth ® Low Energy (Bluetooth LE). It integrates an 8 MB SPI flash and an up to 8 MB SPI PSRAM. ESP32-S3-PICO-1 provides complete Wi-Fi and Bluetooth ® functionalities and is designed with the TSMC low-power 40 nm technology. It seamlessly integrates all peripheral components, including a crystal oscillator, decoupling capacitors, SPI flash/PSRAM, and RF matching links, within a single package. As a result, there is no need for additional peripheral components, simplifying the soldering and testing processes. It also streamlines the supply chain and enhances control and management efficiency. With its ultra-small size, robust performance, and low-energy consumption, ESP32-S3-PICO-1 is well suited for any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors and other IoT products. At the core of ESP32-S3-PICO-1 is the ESP32-S3 chip, a low-power MCU-based system on a chip (SoC) with integrated 2.4 GHz Wi-Fi and Bluetooth ® Low Energy (Bluetooth LE). It consists of high-performance dual-core microprocessor (Xtensa ® 32-bit LX7), a low-power coprocessor, a Wi-Fi baseband, a Bluetooth LE baseband, RF module, and numerous peripherals. For more details on ESP32-S3, please refer to ESP32-S3 Series Datasheet. Espressif Systems 2 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 Block Diagram The block diagram of ESP32-S3-PICO-1 is shown below. ESP32-S3 40 MHz Crystal 3V3 EN GPIOs SPIWP SPIQ SPID SPICS0 SPIHD VDD_SPI SPICLK ESP32-S3-PICO-1 QSPI FLASH SPIWP OSPI PSRAM(opt.) SPICS1 SPICLK SPID SPIQ SPIHD VDD_SPI SPIIO4 SPIIO5 SPIIO6 SPIIO7 SPIDQS RF Matching RF Matching Antenna GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 QSPI PSRAM(opt.) SPID SPIWP SPIHD SPIQ SPICLK SPICS1 VDD_SPI ESP32-S3-PICO-1 Block Diagram Features CPU and Memory • ESP32-S3 SoC embedded, Xtensa ® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • TX/RX A-MPDU, TX/RX A-MSDU • 0.4 µs guard interval support • Center frequency range of operating channel: 2412 ~ 2484 MHz Bluetooth • Bluetooth LE: Bluetooth 5, Bluetooth mesh • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • Advertising extensions • Multiple advertisement sets Espressif Systems 3 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 • Channel selection algorithm #2 • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals • GPIO, SPI, LCD interface, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB 1.1 OTG, USB Serial/JTAG controller, MCPWM, SD/MMC host, GDMA, TWAI ® controller (compatible with ISO 11898-1), ADC, touch sensor, temperature sensor, timers and watchdogs Note: * Please refer to ESP32-S3 Series Datasheet for detailed information about the peripherals. Integrated Components • 40 MHz crystal oscillator • 8 MB Quad SPI flash • Up to 8 MB PSRAM Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: – ESP32-S3-PICO-1-N8R2: –40 ~ 85 °C – ESP32-S3-PICO-1-N8R8: –40 ~ 65 °C Applications (A Nonexhaustive List) • Generic Low-power IoT Sensor Hub • Generic Low-power IoT Data Loggers • Cameras for Video Streaming • Over-the-top (OTT) Devices • USB Devices • Speech Recognition • Image Recognition • Mesh Network • Home Automation • Smart Building • Industrial Automation • Smart Agriculture • Audio Applications • Health Care Applications • Wi-Fi-enabled Toys • Wearable Electronics • Retail & Catering Applications Espressif Systems 4 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 Contents Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-s3-pico-1_datasheet_en.pdf Contents Product Overview 2 Block Diagram 3 Features 3 Applications 4 1 ESP32-S3-PICO-1 Series Comparison 9 1.1 ESP32-S3-PICO-1 Series Nomenclature 9 1.2 Comparison 9 2 Pin Definition 10 2.1 Pin Layout 10 2.2 Pin Description 11 2.3 Strapping Pins 14 2.3.1 Chip Boot Mode Control 15 2.3.2 VDD_SPI Voltage Control 15 2.3.3 ROM Messages Printing Control 16 2.3.4 JTAG Signal Source Control 16 3 Electrical Characteristics 17 3.1 Absolute Maximum Ratings 17 3.2 Recommended Power Supply Characteristics 17 3.3 VDD_SPI Output Characteristics 18 3.4 DC Characteristics (3.3 V, 25 °C) 18 3.5 ADC Characteristics 19 3.6 Current Consumption 19 3.6.1 RF Current Consumption in Active Mode 19 3.6.2 Current Consumption in Other Modes 20 3.7 Reliability 21 3.8 Wi-Fi Radio 21 3.8.1 Wi-Fi RF Transmitter (TX) Specifications 22 3.8.2 Wi-Fi RF Receiver (RX) Specifications 22 3.9 Bluetooth 5 (LE) Radio 24 3.9.1 Bluetooth LE RF Transmitter (TX) Characteristics 24 3.9.2 Bluetooth LE RF Receiver (RX) Characteristics 25 4 Schematics 28 Espressif Systems 5 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 Contents 5 Peripheral Schematics 29 6 Packaging 30 7 Product Handling 31 7.1 Storage Conditions 31 7.2 Reflow Profile 31 7.3 Ultrasonic Vibration 31 8 Related Documentation and Resources 32 Revision History 33 Espressif Systems 6 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 List of Tables List of Tables 1-1 ESP32-S3-PICO-1 Series Comparison 9 2-1 Pin Description 11 2-2 Default Configuration of Strapping Pins 14 2-3 Description of Timing Parameters for the Strapping Pins 14 2-4 Chip Boot Mode Control 15 2-5 VDD_SPI Voltage Control 15 2-6 JTAG Signal Source Control 16 3-1 Absolute Maximum Ratings 17 3-2 Recommended Power Characteristics 17 3-3 VDD_SPI Internal and Output Characteristics 18 3-4 DC Characteristics (3.3 V, 25 °C) 18 3-5 ADC Characteristics 19 3-6 ADC Calibration Results 19 3-7 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 19 3-8 Current Consumption in Modem-sleep Mode 20 3-9 Current Consumption in Low-Power Modes 21 3-10 Reliability Qualifications 21 3-11 Wi-Fi RF Characteristics 21 3-12 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 22 3-13 TX EVM Test 1 22 3-14 RX Sensitivity 22 3-15 Maximum RX Level 23 3-16 RX Adjacent Channel Rejection 23 3-17 Bluetooth LE RF Characteristics 24 3-18 Bluetooth LE - Transmitter Characteristics - 1 Mbps 24 3-19 Bluetooth LE - Transmitter Characteristics - 2 Mbps 24 3-20 Bluetooth LE - Transmitter Characteristics - 125 Kbps 25 3-21 Bluetooth LE - Transmitter Characteristics - 500 Kbps 25 3-22 Bluetooth LE - Receiver Characteristics - 1 Mbps 25 3-23 Bluetooth LE - Receiver Characteristics - 2 Mbps 26 3-24 Bluetooth LE - Receiver Characteristics - 125 Kbps 27 3-25 Bluetooth LE - Receiver Characteristics - 500 Kbps 27 Espressif Systems 7 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 List of Figures List of Figures 1-1 ESP32-S3-PICO-1 Series Nomenclature 9 2-1 ESP32-S3-PICO-1 Pin Layout (Top View) 10 2-2 Visualization of Timing Parameters for the Strapping Pins 15 4-1 ESP32-S3-PICO-1 Schematics 28 5-1 ESP32-S3-PICO-1 Peripheral Schematics 29 6-1 LGA56 (7×7 mm) Package 30 7-1 Reflow Profile 31 Espressif Systems 8 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 1 ESP32-S3-PICO-1 Series Comparison 1 ESP32-S3-PICO-1 Series Comparison 1.1 ESP32-S3-PICO-1 Series Nomenclature ESP32-S3-PICO-1 x SiP series Flash size (MB) R x PSRAM PSRAM size (MB) H Flash temperature H: High temperature N: Normal temperature Figure 1-1. ESP32-S3-PICO-1 Series Nomenclature 1.2 Comparison Table 1-1. ESP32-S3-PICO-1 Series Comparison Ordering Code 1 In-Package flash In-Package PSRAM Ambient Temp. 2 (°C) SPI Voltage ESP32-S3-PICO-1-N8R2 8 MB (Quad SPI) 2 MB (Quad SPI) –40 ∼ 85 3.3 V ESP32-S3-PICO-1-N8R8 8 MB (Quad SPI) 8 MB (Octal SPI) –40 ∼ 65 3.3 V 1 For details on chip marking and packing, see Section 6 Packaging. 2 Ambient temperature specifies the recommended temperature range of the environment immediately outside an Espressif chip. For ESP32-S3-PICO-1-N8R8, if the PSRAM ECC function is enabled, the maximum ambient temperature can be improved to 85 °C, while the usable size of PSRAM will be reduced by 1/16. Espressif Systems 9 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition 2 Pin Definition 2.1 Pin Layout 1 2 3 4 5 6 7 8 9 10 GPIO20 GPIO21 GPIO19 GPIO18 GPIO17 XTAL_32K_N XTAL_32K_P VDD3P3_RTC GPIO14 GPIO13 GPIO12 GPIO11 GPIO10 GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GPIO4 GPIO3 GPIO2 GPIO1 GPIO0 CHIP_PU VDD3P3 VDD3P3 LNA_IN VDDA NC NC GPIO46 GPIO45 U0RXD U0TXD MTMS MTDI VDD3P3_CPU MTDO MTCK GPIO38 VDDA GPIO37 GPIO36 GPIO35 GPIO33 SPICLK_P NC NC NC NC NC NC VDD_SPI SPICS1 SPICLK_N 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GPIO34 56 55 54 53 52 51 50 49 48 47 46 45 44 43 ESP32-S3-PICO-1 57 GND Figure 2-1. ESP32-S3-PICO-1 Pin Layout (Top View) Espressif Systems 10 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition 2.2 Pin Description Table 2-1. Pin Description Name No. Type 1 Power Domain Function 2, 5 LNA_IN 1 I/O — Low Noise Amplifier (RF LNA) input and output signal VDD3P3 2 P A — Analog power supply VDD3P3 3 P A — Analog power supply CHIP_PU 4 I VDD3P3_RTC High: on, enables ESP32-S3-PICO-1. Low: off, ESP32-S3-PICO-1 powers off. Note: Do not leave the CHIP_PU pin floating. GPIO0 5 I/O/T VDD3P3_RTC RTC_GPIO0, GPIO0 GPIO1 6 I/O/T VDD3P3_RTC RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 GPIO2 7 I/O/T VDD3P3_RTC RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 GPIO3 8 I/O/T VDD3P3_RTC RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 GPIO4 9 I/O/T VDD3P3_RTC RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 GPIO5 10 I/O/T VDD3P3_RTC RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 GPIO6 11 I/O/T VDD3P3_RTC RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 GPIO7 12 I/O/T VDD3P3_RTC RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6 GPIO8 13 I/O/T VDD3P3_RTC RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1 GPIO9 14 I/O/T VDD3P3_RTC RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, SUBSPIHD, FSPIHD GPIO10 15 I/O/T VDD3P3_RTC RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPIIO4, SUBSPICS0, FSPICS0 GPIO11 16 I/O/T VDD3P3_RTC RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPIIO5, SUBSPID, FSPID GPIO12 17 I/O/T VDD3P3_RTC RTC_GPIO12, GPIO12 , TOUCH12, ADC2_CH1, FSPIIO6, SUBSPICLK, FSPICLK GPIO13 18 I/O/T VDD3P3_RTC RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIIO7, SUBSPIQ, FSPIQ GPIO14 19 I/O/T VDD3P3_RTC RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIDQS, SUBSPIWP, FSPIWP VDD3P3_RTC 20 P A — Analog power supply XTAL_32K_P 21 I/O/T VDD3P3_RTC RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P XTAL_32K_N 22 I/O/T VDD3P3_RTC RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N GPIO17 23 I/O/T VDD3P3_RTC RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6 Espressif Systems 11 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition Name No. Type 1 Power Domain Function 2, 5 GPIO18 24 I/O/T VDD3P3_RTC RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3 GPIO19 25 I/O/T VDD3P3_RTC RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D- GPIO20 26 I/O/T VDD3P3_RTC RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ GPIO21 27 I/O/T VDD3P3_RTC RTC_GPIO21, GPIO21 SPICS1 4 28 I/O/T VDD_SPI SPICS1, GPIO26 VDD_SPI 29 P D — Output power supply: VDD3P3_RTC NC 30 — — NC NC 31 — — NC NC 32 — — NC NC 33 — — NC NC 34 — — NC NC 35 — — NC SPICLK_N 3 36 I/O/T VDD3P3_CPU / VDD_SPI SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF SPICLK_P 3 37 I/O/T VDD3P3_CPU / VDD_SPI SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF GPIO33 3, 4 38 I/O/T VDD3P3_CPU / VDD_SPI SPIIO4, GPIO33, FSPIHD, SUBSPIHD GPIO34 3, 4 39 I/O/T VDD3P3_CPU / VDD_SPI SPIIO5, GPIO34, FSPICS0, SUBSPICS0 GPIO35 3, 4 40 I/O/T VDD3P3_CPU / VDD_SPI SPIIO6, GPIO35, FSPID, SUBSPID GPIO36 3, 4 41 I/O/T VDD3P3_CPU / VDD_SPI SPIIO7, GPIO36, FSPICLK, SUBSPICLK GPIO37 3, 4 42 I/O/T VDD3P3_CPU / VDD_SPI SPIDQS, GPIO37, FSPIQ, SUBSPIQ GPIO38 43 I/O/T VDD3P3_CPU GPIO38, FSPIWP, SUBSPIWP MTCK 44 I/O/T VDD3P3_CPU MTCK, GPIO39, CLK_OUT3, SUBSPICS1 MTDO 45 I/O/T VDD3P3_CPU MTDO, GPIO40, CLK_OUT2 VDD3P3_CPU 46 P D — Input power supply for CPU IO MTDI 47 I/O/T VDD3P3_CPU MTDI, GPIO41, CLK_OUT1 MTMS 48 I/O/T VDD3P3_CPU MTMS, GPIO42 U0TXD 49 I/O/T VDD3P3_CPU U0TXD, GPIO43, CLK_OUT1 U0RXD 50 I/O/T VDD3P3_CPU U0RXD, GPIO44, CLK_OUT2 GPIO45 51 I/O/T VDD3P3_CPU GPIO45 GPIO46 52 I/O/T VDD3P3_CPU GPIO46 Espressif Systems 12 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition Name No. Type 1 Power Domain Function 2, 5 NC 53 — — NC NC 54 — — NC VDDA 55 P A — Analog power supply VDDA 56 P A — Analog power supply GND 57 G — Ground 1 P: power pin; P A : analog power pin; P D : digital power pin; I: input; O: output; T: high impedance; NC: no component. 2 Pin functions in bold font are the default pin functions in SPI Boot mode. For pins No.38 ∼ 42, the default function is decided by eFuse bit. 3 Power supply for GPIO33 ∼ GPIO37, GPIO47 and GPIO48 is configurable to be either VDD3P3_CPU (default) or VDD_SPI. 4 For ESP32-S3-PICO-1-N8R2, SPICS1 is connected to the Quad SPI PSRAM and is not available for other uses. For ESP32-S3-PICO-1-N8R8, SPICS1 and GPIO33 ∼ GPIO37 are connected to the Octal SPI PSRAM and are not available for other uses. 5 The pin function in this table refers only to some fixed settings and do not cover all cases for signals that can be input and output through the GPIO matrix. For more information on the GPIO matrix, please refer to ESP32-S3 Technical Reference Manual. Espressif Systems 13 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition 2.3 Strapping Pins At each startup or reset, the ESP32-S3-PICO-1 requires some initial configuration parameters, such as in which boot mode to load the SiP, voltage of flash memory, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins operate as regular IO pins. The parameters controlled by the given strapping pins at SiP reset are as follows: • Chip boot mode – GPIO0 and GPIO46 • VDD_SPI voltage – GPIO45 • ROM messages printing – GPIO46 • JTAG signal source – GPIO3 GPIO0, GPIO45, and GPIO46 are connected to the chip’s internal weak pull-up/pull-down resistors at chip reset. These resistors determine the default bit values of the strapping pins. Also, these resistors determine the bit values if the strapping pins are connected to an external high-impedance circuit. Table 2-2. Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Pull-up 1 GPIO3 Floating – GPIO45 Pull-down 0 GPIO46 Pull-down 0 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-S3-PICO-1 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold time. For more information, see Table 2-3 and Figure 2-2. Table 2-3. Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_PU pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. 3 Espressif Systems 14 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition Strapping pin VIL_nRST VIH t SU t H CHIP_PU Figure 2-2. Visualization of Timing Parameters for the Strapping Pins 2.3.1 Chip Boot Mode Control GPIO0 and GPIO46 control the boot mode after the reset is released. See Table 2-4 Chip Boot Mode Control. Table 2-4. Chip Boot Mode Control Boot Mode GPIO0 GPIO46 Default Configuration 1 (Pull-up) 0 (Pull-down) SPI Boot (default) 1 Any value Download Boot 0 0 Invalid combination 1 0 1 1 This combination triggers unexpected behavior and should be avoided. 2.3.2 VDD_SPI Voltage Control The required VDD_SPI voltage for ESP32-S3-PICO-1 can be found in Table 1-1 Comparison. Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways. Table 2-5. VDD_SPI Voltage Control EFUSE_VDD_SPI_FORCE GPIO45 eFuse 1 Voltage VDD_SPI power source 2 0 0 Ignored 3.3 V VDD3P3_RTC via R SP I 1 1.8 V Flash Voltage Regulator 1 Ignored 0 1.8 V Flash Voltage Regulator 1 3.3 V VDD3P3_RTC via R SP I 1 eFuse: EFUSE_VDD_SPI_TIEH 2 See ESP32-S3 Series Datasheet > Section Power Scheme Espressif Systems 15 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 2 Pin Definition 2.3.3 ROM Messages Printing Control During boot process the messages by the ROM code can be printed to: • (Default) UART and USB Serial/JTAG controller. • USB Serial/JTAG controller. • UART. The ROM messages printing to UART or USB Serial/JTAG controller can be respectively disabled by configuring registers and eFuse. For detailed information, please refer to ESP32-S3 Technical Reference Manual > Chapter Chip Boot Control. 2.3.4 JTAG Signal Source Control The strapping pin GPIO3 can be used to control the source of JTAG signals during the early boot process. This pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that cannot be in a high impedance state. As Table 2-6 shows, GPIO3 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_STRAP_JTAG_SEL. Table 2-6. JTAG Signal Source Control eFuse 1 a eFuse 2 b eFuse 3 c GPIO3 JTAG Signal Source 0 0 0 Ignored USB Serial/JTAG Controller 1 0 JTAG pins MTDI, MTCK, MTMS, and MTDO 1 USB Serial/JTAG Controller 0 1 Ignored Ignored JTAG pins MTDI, MTCK, MTMS, and MTDO 1 0 Ignored Ignored USB Serial/JTAG Controller 1 1 Ignored Ignored JTAG is disabled a eFuse 1: EFUSE_DIS_PAD_JTAG b eFuse 2: EFUSE_DIS_USB_JTAG c eFuse 3: EFUSE_STRAP_JTAG_SEL Espressif Systems 16 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Stresses above those listed in Table 3-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and normal operation of the device at these or any other conditions beyond those indicated in Section 3.2 Recommended Power Supply Characteristics is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 3-1. Absolute Maximum Ratings Parameter Description Min Max Unit VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDD_SPI Allowed input voltage –0.3 3.6 V I output 1 Cumulative IO output current — 1500 mA T ST OR E Storage temperature –40 150 °C 1 The product proved to be fully functional after all its IO pins were pulled high while being con- nected to ground for 24 consecutive hours at ambient temperature of 25 °C. 3.2 Recommended Power Supply Characteristics For recommended ambient temperature, see Section 1 ESP32-S3-PICO-1 Series Comparison. Table 3-2. Recommended Power Characteristics Parameter 1 Description Min Typ Max Unit VDDA, VDD3P3 Recommended input voltage 3.0 3.3 3.6 V VDD3P3_RTC 2 Recommended input voltage 3.0 3.3 3.6 V VDD_SPI (as input) — 1.8 3.3 3.6 V VDD3P3_CPU 3 Recommended input voltage 3.0 3.3 3.6 V I V DD 4 Cumulative input current 0.5 — — A 1 If VDD3P3_RTC is used to power VDD_SPI, the voltage drop on R SP I should be accounted for. See also Section 3.3 VDD_SPI Output Characteristics. 2 If writing to eFuses, the voltage on VDD3P3_CPU should not exceed 3.3 V as the circuits responsible for burning eFuses are sensitive to higher voltages. 3 If you use a single power supply, the recommended output current is 500 mA or more. Espressif Systems 17 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics 3.3 VDD_SPI Output Characteristics Table 3-3. VDD_SPI Internal and Output Characteristics Parameter Description 1 Typ Unit R SP I VDD_SPI powered by VDD3P3_RTC via R SP I for 3.3 V flash/PSRAM 2 14 Ω 1 VDD3P3_RTC must be more than VDD_flash_min + I_flash_max * R SP I ; where • VDD_flash_min – minimum operating voltage of flash/PSRAM • I_flash_max – maximum operating current of flash/PSRAM 3.4 DC Characteristics (3.3 V, 25 °C) Table 3-4. DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Internal weak pull-up resistor — 45 — kΩ R P D Internal weak pull-down resistor — 45 — k Ω V IH_nRST SiP reset release voltage (CHIP_PU voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST SiP reset voltage (CHIP_PU voltage is within the specified range) –0.3 — 0.25 × VDD 1 V 1 VDD is the I/O voltage for a particular power domain of pins. 2 V OH and V OL are measured using high-impedance load. Espressif Systems 18 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics 3.5 ADC Characteristics The measurements in this section are taken with an external 100 nF capacitor connected to the ADC, using DC signals as input, and at an ambient temperature of 25 °C with disabled Wi-Fi. Table 3-5. ADC Characteristics Symbol Min Max Unit DNL (Differential nonlinearity) 1 –4 4 LSB INL (Integral nonlinearity) –8 8 LSB Sampling rate — 100 kSPS 2 1 To get better DNL results, you can sample multiple times and apply a filter, or calculate the average value. 2 kSPS means kilo samples-per-second. Table 3-6. ADC Calibration Results Parameter Description Min Max Unit Total error ATTEN0, effective measurement range of 0 ~ 850 –5 5 mV ATTEN1, effective measurement range of 0 ~ 1100 –6 6 mV ATTEN2, effective measurement range of 0 ~ 1600 –10 10 mV ATTEN3, effective measurement range of 0 ~ 2900 –50 50 mV 3.6 Current Consumption 3.6.1 RF Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle. Table 3-7. Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, DSSS @ 20.0dBm 350 802.11g, 54 Mbps, OFDM @ 17.0dBm 287 802.11n, HT20, MCS7 @ 16.5dBm 282 802.11n, HT40, MCS7 @ 16.5dBm 280 RX 802.11b/g/n, HT20 100 802.11n, HT40 105 Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP32-S3 Series Datasheet. Espressif Systems 19 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics 3.6.2 Current Consumption in Other Modes Please note that since the SiP has in-package PSRAM, the current consumption might be higher compared to the measurements below. Table 3-8. Current Consumption in Modem-sleep Mode Work mode Frequency (MHz) Description Typ 1 (mA) Typ 2 (mA) Modem-sleep 3 40 WAITI (Dual core in idle state) 13.2 18.8 Single core running 32-bit data access instructions, the other core in idle state 16.2 21.8 Dual core running 32-bit data access instructions 18.7 24.4 Single core running 128-bit data access instructions, the other core in idle state 19.9 25.4 Dual core running 128-bit data access instructions 23.0 28.8 80 WAITI 22.0 36.1 Single core running 32-bit data access instructions, the other core in idle state 28.4 42.6 Dual core running 32-bit data access instructions 33.1 47.3 Single core running 128-bit data access instructions, the other core in idle state 35.1 49.6 Dual core running 128-bit data access instructions 41.8 56.3 160 WAITI 27.6 42.3 Single core running 32-bit data access instructions, the other core in idle state 39.9 54.6 Dual core running 32-bit data access instructions 49.6 64.1 Single core running 128-bit data access instructions, the other core in idle state 54.4 69.2 Dual core running 128-bit data access instructions 66.7 81.1 240 WAITI 32.9 47.6 Single core running 32-bit data access instructions, the other core in idle state 51.2 65.9 Dual core running 32-bit data access instructions 66.2 81.3 Single core running 128-bit data access instructions, the other core in idle state 72.4 87.9 Dual core running 128-bit data access instructions 91.7 107.9 1 Current consumption when all peripheral clocks are disabled. 2 Current consumption when all peripheral clocks are enabled. In practice, the current consumption might be different depending on which peripherals are enabled. 3 In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Espressif Systems 20 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics Table 3-9. Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep 1 VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance. 240 Deep-sleep RTC memory and RTC peripherals are powered up. 8 RTC memory is powered up. RTC peripherals are powered down. 7 Power off CHIP_PU is set to low level. The SiP is shut down. 1 1 In Light-sleep mode, all related SPI pins are pulled up. Please add corresponding PSRAM consumption values, e.g., 140 µA for 8 MB 8-line PSRAM (3.3 V) and 40 µA for 2 MB 4-line PSRAM (3.3 V). 3.7 Reliability Table 3-10. Reliability Qualifications Test Item Test Conditions Test Standard ESD (Electro-Static Discharge Sensitivity) HBM (Human Body Mode) 1 ± 2000 V JS-001 CDM (Charge Device Mode) 2 ± 1000 V JS-002 Latch up Current trigger ± 200 mA JESD78 Voltage trigger 1.5 × VDD max Preconditioning Bake 24 hours @125 °C Moisture soak (level 3: 192 hours @30 °C, 60% RH) IR reflow solder: 260 + 0 °C, 20 seconds, three times J-STD-020, JESD47, JESD22-A113 TCT (Temperature Cycling Test) –65 °C / 150 °C, 500 cycles JESD22-A104 uHAST (Highly Accelerated Stress Test, unbiased) 130 °C, 85% RH, 96 hours JESD22-A118 HTSL (High Temperature Storage Life) 150 °C, 1000 hours JESD22-A103 LTSL (Low Temperature Storage Life) –40 °C, 1000 hours JESD22-A119 1 JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process. 2 JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process. 3.8 Wi-Fi Radio Table 3-11. Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n Espressif Systems 21 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics 3.8.1 Wi-Fi RF Transmitter (TX) Specifications Table 3-12. TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 20.0 — 802.11b, 11 Mbps, CCK — 20.0 — 802.11g, 6 Mbps, OFDM — 19.0 — 802.11g, 54 Mbps, OFDM — 17.0 — 802.11n, HT20, MCS0 — 18.5 — 802.11n, HT20, MCS7 — 16.5 — 802.11n, HT40, MCS0 — 18.0 — 802.11n, HT40, MCS7 — 16.5 — Table 3-13. TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –25.0 –10.0 802.11b, 11 Mbps, CCK — –25.0 –10.0 802.11g, 6 Mbps, OFDM — –23.0 –5.0 802.11g, 54 Mbps, OFDM — –30.0 –25.0 802.11n, HT20, MCS0 — –23.5 –5.0 802.11n, HT20, MCS7 — –31.5 –27.0 802.11n, HT40, MCS0 — –25.5 –5.0 802.11n, HT40, MCS7 — –31.0 –27.0 1 EVM is measured at the corresponding typical TX power provided in Table 3-12 Wi-Fi RF Transmitter (TX) Specifications above. 3.8.2 Wi-Fi RF Receiver (RX) Specifications Table 3-14. RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –97.8 — 802.11b, 2 Mbps, DSSS — –95.8 — 802.11b, 5.5 Mbps, CCK — –93.6 — 802.11b, 11 Mbps, CCK — –88.4 — 802.11g, 6 Mbps, OFDM — –93.0 — 802.11g, 9 Mbps, OFDM — –91.8 — 802.11g, 12 Mbps, OFDM — –90.4 — 802.11g, 18 Mbps, OFDM — –88.0 — Cont’d on next page Espressif Systems 22 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics Table 3-14 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11g, 24 Mbps, OFDM — –85.0 — 802.11g, 36 Mbps, OFDM — –82.0 — 802.11g, 48 Mbps, OFDM — –77.6 — 802.11g, 54 Mbps, OFDM — –76.0 — 802.11n, HT20, MCS0 — –92.8 — 802.11n, HT20, MCS1 — – 90.2 — 802.11n, HT20, MCS2 — –87.6 — 802.11n, HT20, MCS3 — –84.6 — 802.11n, HT20, MCS4 — –81.4 — 802.11n, HT20, MCS5 — –77.0 — 802.11n, HT20, MCS6 — –75.2 — 802.11n, HT20, MCS7 — –74.2 — 802.11n, HT40, MCS0 — –89.4 — 802.11n, HT40, MCS1 — –87.2 — 802.11n, HT40, MCS2 — –84.4 — 802.11n, HT40, MCS3 — –81.4 — 802.11n, HT40, MCS4 — –78.2 — 802.11n, HT40, MCS5 — –73.8 — 802.11n, HT40, MCS6 — –72.4 — 802.11n, HT40, MCS7 — –71.0 — Table 3-15. Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 5 — 802.11b, 11 Mbps, CCK — 5 — 802.11g, 6 Mbps, OFDM — 5 — 802.11g, 54 Mbps, OFDM — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — Table 3-16. RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 35 — 802.11b, 11 Mbps, CCK — 35 — Cont’d on next page Espressif Systems 23 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics Table 3-16 – cont’d from previous page Min Typ Max Rate (dB) (dB) (dB) 802.11g, 6 Mbps, OFDM — 31 — 802.11g, 54 Mbps, OFDM — 14 — 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 13 — 802.11n, HT40, MCS0 — 19 — 802.11n, HT40, MCS7 — 8 — 3.9 Bluetooth 5 (LE) Radio Table 3-17. Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402 ~ 2480 MHz RF transmit power range –24.0 ~ 20.0 dBm 3.9.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 3-18. Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 1.7 — kHz Max. |f 0 − f n | n=2, 3, 4, ...k — 1.6 — kHz Max. | f n − f n−5 | n=6, 7, 8, ...k — 1.1 — kHz |f 1 − f 0 | — 0.4 — kHz Modulation characteristics ∆ F 1 avg — 250.5 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 198.5 — kHz ∆ F 2 avg /∆ F 1 avg — 0.85 — — In-band emissions ± 2 MHz offset — –37 — dBm ± 3 MHz offset — –42 — dBm > ± 3 MHz offset — –44 — dBm Table 3-19. Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 2.5 — kHz Max. |f 0 − f n | n=2, 3, 4, ...k — 1.3 — kHz Max. |f n − f n−5 | n=6, 7, 8, ...k — 1.0 — kHz |f 1 − f 0 | — 0.4 — kHz Modulation characteristics ∆ F 1 avg — 498.0 — kHz Cont’d on next page Espressif Systems 24 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics Table 3-19 – cont’d from previous page Parameter Description Min Typ Max Unit Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 429.0 — kHz ∆ F 2 avg /∆ F 1 avg — 0.91 — — In-band emissions ± 4 MHz offset — –42 — dBm ± 5 MHz offset — –44 — dBm > ± 5 MHz offset — –47 — dBm Table 3-20. Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 0.5 — kHz Max. |f 0 − f n | n=1, 2, 3, ...k — 0.2 — kHz |f 0 − f 3 | — 0.2 — kHz Max. |f n − f n−3 | n=7, 8, 9, ...k — 0.7 — kHz Modulation characteristics ∆ F 1 avg — 250.4 — kHz Min. ∆ F 1 max (for at least 99.9% of all ∆ F 1 max ) — 240.8 — kHz In-band emissions ± 2 MHz offset — –37 — dBm ± 3 MHz offset — –42 — dBm > ± 3 MHz offset — –44 — dBm Table 3-21. Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 0.5 — kHz Max. |f 0 − f n | n=1, 2, 3, ...k — 0.5 — kHz |f 0 − f 3 | — 0.2 — kHz Max. |f n − f n−3 | n=7, 8, 9, ...k — 0.7 — kHz Modulation characteristics ∆ F 2 avg — 211.5 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 198.1 — kHz In-band emissions ± 2 MHz offset — –37 — dBm ± 3 MHz offset — –42 — dBm > ± 3 MHz offset — –44 — dBm 3.9.2 Bluetooth LE RF Receiver (RX) Characteristics Table 3-22. Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –96.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm Cont’d on next page Espressif Systems 25 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics Table 3-22 – cont’d from previous page Parameter Description Min Typ Max Unit C/I and receiver selectivity performance Co-channel F = F0 MHz — 8 — dB Adjacent channel F = F0 + 1 MHz — 4 — dB F = F0 – 1 MHz — 4 — dB F = F0 + 2 MHz — –23 — dB F = F0 – 2 MHz — –23 — dB F = F0 + 3 MHz — –34 — dB F = F0 – 3 MHz — –34 — dB F ≥ F0 + 4 MHz — –36 — dB F ≤ F0 – 4 MHz — –37 — dB Image frequency — — –36 — dB Adjacent channel to image frequency F = F image + 1 MHz — –39 — dB F = F image – 1 MHz — –34 — dB 30 MHz ~ 2000 MHz — –12 — dBm Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –18 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –10 — dBm Intermodulation — — –29 — dBm Table 3-23. Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –91.5 — dBm Maximum received signal @30.8% PER — — 3 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 8 — dB Adjacent channel F = F0 + 2 MHz — 4 — dB F = F0 – 2 MHz — 4 — dB F = F0 + 4 MHz — –27 — dB F = F0 – 4 MHz — –27 — dB F = F0 + 6 MHz — –38 — dB F = F0 – 6 MHz — –38 — dB F ≥ F0 + 8 MHz — –41 — dB F ≤ F0 – 8 MHz — –41 — dB Image frequency — — –27 — dB Adjacent channel to image frequency F = F image + 2 MHz — –38 — dB F = F image – 2 MHz — 4 — dB 30 MHz ~ 2000 MHz — –15 — dBm Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –21 — dBm 2484 MHz ~ 2997 MHz — –21 — dBm 3000 MHz ~ 12.75 GHz — –9 — dBm Intermodulation — — –29 — dBm Espressif Systems 26 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 3 Electrical Characteristics Table 3-24. Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –102.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 4 — dB Adjacent channel F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –26 — dB F = F0 – 2 MHz — –26 — dB F = F0 + 3 MHz — –36 — dB F = F0 – 3 MHz — –39 — dB F ≥ F0 + 4 MHz — –42 — dB F ≤ F0 – 4 MHz — –43 — dB Image frequency — — –42 — dB Adjacent channel to image frequency F = F image + 1 MHz — –43 — dB F = F image – 1 MHz — –36 — dB Table 3-25. Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –99.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 4 — dB Adjacent channel F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 0 — dB F = F0 + 2 MHz — –24 — dB F = F0 – 2 MHz — –24 — dB F = F0 + 3 MHz — –37 — dB F = F0 – 3 MHz — –39 — dB F ≥ F0 + 4 MHz — –38 — dB F ≤ F0 – 4 MHz — –42 — dB Image frequency — — –38 — dB Adjacent channel to image frequency F = F image + 1 MHz — –42 — dB F = F image – 1 MHz — –37 — dB Espressif Systems 27 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 4 Schematics 4 Schematics This is the reference designs of ESP32-S3-PICO-1. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. ESP32-S3 Pin Mapping ESP32-S3 ESP32-S3-PICO-1 LNA_IN VDD3P3 VDD3P3 CHIP_PU GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 VDD3P3_RTC XTAL_32K_P XTAL_32K_N GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 SPICS1 VDD_SPI SPIHD SPIWP SPICS0 SPICLK SPIQ SPID SPICLK_N SPICLK_P GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 MTCK MTDO VDD3P3_CPU MTDI MTMS U0TXD U0RXD GPIO45 GPIO46 XTAL_N XTAL_P VDDA VDDA LNA_IN VDD3P3 CHIP_PU GPIO0 VDD3P3 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 VDD3P3_RTC XTAL_32K_P GPIO17 GPIO18 GPIO19 GPIO20 XTAL_32K_N GPIO21 SPICS1 VDD_SPI NC NC NC NC NC NC SPICLK_N SPICLK_P GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 MTCK MTDO MTDI VDD3P3_CPU MTMS U0TXD U0RXD GPIO45 GPIO46 NC NC VDDA VDDA ESP32-S3-PICO-1-N8R2: U3 is used and U4 is NC. ESP32-S3-PICO-1-N8R8: U4 is used and U3 is NC. 50 ohm Impedance Control LNA_IN GPIO21 GPIO45 U0TXD GPIO46 GPIO38 MTDO MTDI MTMS U0RXD MTCK SPICLK_P SPICLK_N GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 CHIP_PU GPIO20 GPIO19 GPIO18 GPIO17 XTAL_32K_N XTAL_32K_P GPIO14 GPIO13 GPIO12 GPIO11 GPIO10 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 SPICS1 SPID SPIQ SPICLK SPICS0 SPIWP SPIHD SPICLK SPICS0 SPIHD SPID SPIWP SPIQ GPIO35 GPIO36 GPIO34 SPI_HD GPIO33 SPI_Q SPI_D SPI_CLK SPI_WP SPI_CS1 GPIO37 SPIWP SPID SPIQ SPICS1 SPICLK SPIHD GND GND VDD3P3 GND GND GND VDDA GND GND GND VDD3P3_RTC VDD3P3_CPU GND GND GND GND GND GND VDD_SPI GND VDD_SPI VDD_SPI GNDGND VDD_SPI Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-PICO-1> V1.0 A3 2 2Friday, July 07, 2023 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-PICO-1> V1.0 A3 2 2Friday, July 07, 2023 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-PICO-1> V1.0 A3 2 2Friday, July 07, 2023 C11 2.4pF C12 2.0pF C13 0.1uF U4 PSRAM(opt.) RSU C2 RST# A4 DQS C3 CE# A3 CLK B2 NC1 A2 NC2 B1 NC5 C5 NC4 B5 NC3 A5 ADQ0 D3 ADQ1 D2 ADQ2 C4 ADQ3 D4 ADQ5 E3 ADQ7 E1 ADQ4 D5 ADQ6 E2 VCC1 B4 VCCQ2 D1 VCCQ3 E4 VSSQ3 E5 VSSQ2 C1 VSS1 B3 C14 1uF U2 FLASH VDD 8 GND 4 /CS 1 CLK 6 /HOLD 7 /WP 3 DO 2 DI 5 U1 VDDA 56 LNA_IN 1 VDD3P3 2 VDD3P3 3 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 GPIO17 23 GPIO18 24 GPIO19 25 GPIO20 26 VDD_SPI 29 SPIWP 31 SPICS0 32 SPIQ 34 SPID 35 SPICLK 33 SPICLK_N 36 GND 57 SPICLK_P 37 GPIO33 38 GPIO38 43 GPIO46 52 XTAL_N 53 XTAL_P 54 MTMS 48 MTDO 45 U0TXD 49 VDD3P3_CPU 46 CHIP_PU 4 VDDA 55 MTDI 47 GPIO8 13 GPIO9 14 GPIO21 27 SPICS1 28 SPIHD 30 GPIO34 39 GPIO35 40 GPIO36 41 U0RXD 50 GPIO45 51 GPIO37 42 MTCK 44 C9 3.0pF C3 1uF U3 PSRAM(opt.) VDD 8 VSS 4 CS 1 SCLK 6 SIO3 7 SIO2 3 SO/SIO1 2 SI/SIO0 5 L1 2.0nH Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 L2 2.4nH C2 10nF C4 16pF C1 18pF L3 24nH R3 0 C10 0.1uF C8 2.2uF Figure 4-1. ESP32-S3-PICO-1 Schematics Espressif Systems 28 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 5 Peripheral Schematics 5 Peripheral Schematics This is the typical application circuit of ESP32-S3-PICO-1 connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. X1: ESR = Max. 70 K ESP32-S3-PICO-1-N8R2: SPICS1 connect to the QSPI PSRAM and are not available for other use. ESP32-S3-PICO-1-N8R8: SPICS1 and IO33~IO37 connect to the OSPI PSRAM and are not available for other use. 50 ohm Impedance Control EN TCK IO2 IO3 IO10 X32K_P X32K_N IO5 IO6 IO7 RXD0 TXD0 IO1 IO8 IO9 EN LNA_IN IO4 IO46 IO45 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 IO34 IO33 IO47 IO48 IO11 IO12 IO13 IO14 IO17 IO18 IO19 IO20 IO21 TMS TDI TDO IO15 IO16 IO0 USB_D+ USB_D- GND GND GND GND GND GND VDD33 VDD33 GND GND GND GNDGND GND GND GND R4 0 R3 0 C6 TBD JP2 Boot Option 1 2 C12 TBD R4 NC C7 12pF(NC) C1 22uF C4 0.1uF JP1 UART 1 1 2 2 3 3 4 4 C3 TBD C5 TBD C4 12pF(NC) L2 TBD ANT1 1 2 U1 ESP32-S3-PICO-1 LNA_IN 1 VDD3P3 2 VDD3P3 3 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 GPIO17 23 GPIO18 24 GPIO19 25 GPIO20 26 VDD_SPI 29 SPICS1 28 NC 31 NC 32 NC 34 NC 35 NC 33 GPIO33 38 GND 57 GPIO34 39 GPIO35 40 MTCK 44 GPIO46 52 VDDA 55 NC 53 NC 54 MTMS 48 MTDO 45 U0TXD 49 VDD3P3_CPU 46 CHIP_PU 4 VDDA 56 MTDI 47 GPIO8 13 GPIO9 14 GPIO21 27 NC 30 GPIO36 41 GPIO37 42 GPIO38 43 U0RXD 50 GPIO45 51 SPICLK_N 36 SPICLK_P 37 C11 TBD JP4 USB 1 2 JP3 JTAG 1 1 2 2 3 3 4 4 R5 0 SW1 R6 0 R2 0 C2 0.1uF X1 32.768KHz(NC) 12 R1 TBD Figure 5-1. ESP32-S3-PICO-1 Peripheral Schematics To ensure that the power supply to ESP32-S3-PICO-1 is stable during power-up, it is advised to add an RC delay circuit at the CHIP_PU pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the SiP and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence timing diagram, please refer to ESP32-S3 Series Datasheet > Section Power Supply. Espressif Systems 29 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 6 Packaging 6 Packaging 1 14 15 28 29 42 43 56 57 APPROVE CHECK DESIGN APPROVE PROCESS STAND. DRAWING NO. REV. DIMENSION AND TOLERANCES SCALE PACKAGE OUTLINE DRAWING [产品外形图] PAGE ASME Y14.5M TITLE: DESIGN PROJECTION A3 SIZE MM SIGNATURE AREA UNIT 甬矽电子 FOREHOPE ELECTRONIC FOREHOPE CONFIDENTIAL-B This document and its information herein are the property of Forehope and all unauthorized use and reproduction are prohibited. QB Huang 2022.03.28 XiongYing 2022.03.28 LGA-7×7-57 (P0.4 T1.06) PO-ALGA770X17 A 10:11 OF 1 TECHNOLOGY SPECIFICATION[技术要求] 1.BAN TO USE THE LEVEL 1 ENVIRONMENT-RELATED SUBSTANCES； [禁止使用一级环境管理物质；] symbol Dimension in mm Dimension in inch MIN NOM MAX MIN NOM MAX A 0.860 0.960 1.060 0.034 0.038 0.042 c 0.220 0.260 0.300 0.009 0.010 0.012 D 6.900 7.000 7.100 0.272 0.276 0.280 E 6.900 7.000 7.100 0.272 0.276 0.280 D1 3.900 4.000 4.100 0.154 0.157 0.161 E1 3.900 4.000 4.100 0.154 0.157 0.161 H --- 0.300 --- --- 0.012 --- H1 --- 0.300 --- --- 0.012 --- L 0.250 0.325 0.400 0.010 0.013 0.016 L1 0.050 0.075 0.100 0.002 0.003 0.004 e --- 0.400 --- --- 0.016 --- b 0.150 0.200 0.250 0.006 0.008 0.010 aaa 0.100 0.004 bbb 0.150 0.006 ccc 0.100 0.004 ddd 0.080 0.003 eee 0.150 0.006 Top View Bottom View Side View A D 2X aaa C PIN #1 CORNER E B aaa C 2X PIN #1 D1 eee C A B e eee C A B E1 H H1 56×b 4×L1 56×L bbb C A B ddd C CAVITY ccc C c A SEATING PLANE C Figure 6-1. LGA56 (7×7 mm) Package Note: • The pins of the ESP32-S3-PICO-1 series are numbered in an anti-clockwise direction from Pin 1 in the top view. • For information about tape, reel, and product marking, please refer to ESP32-S3 Chip Packaging Information. Espressif Systems 30 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 7 Product Handling 7 Product Handling 7.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and /90%RH. The SiP is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the SiP must be soldered within 168 hours with the factory conditions 25±5 °C and /60%RH. If the above conditions are not met, the SiP needs to be baked. 7.2 Reflow Profile Solder the SiP in a single reflow. 50 150 0 25 1 ~ 3 ℃/s 0 200 250 200 –1 ~ –5 ℃/s Cooling zone 100 217 50 100 250 Reflow zone 217 ℃ 60 ~ 90 s Temperature (℃) Preheating zone 150 ~ 200 ℃ 60 ~ 120 s Ramp-up zone Peak Temp. 235 ~ 250 ℃ Soldering time > 30 s Time (sec.) Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 7-1. Reflow Profile 7.3 Ultrasonic Vibration Avoid exposing Espressif SiPs to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-SiP crystal and lead to its malfunction or even failure. As a consequence, the SiP may stop working or its performance may deteriorate. Espressif Systems 31 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 8 Related Documentation and Resources 8 Related Documentation and Resources Related Documentation • ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware. • ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals. • ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product. • ESP32-S3 Series SoC Errata – Descriptions of known errors in ESP32-S3 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-S3 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-S3 • ESP32-S3 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-S3 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs. https://espressif.com/en/products/socs?id=ESP32-S3 • ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules. https://espressif.com/en/products/modules?id=ESP32-S3 • ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits. https://espressif.com/en/products/devkits?id=ESP32-S3 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 32 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 Revision History Revision History Date Version Release notes 2024-01-29 v1.1 • Updated the second table note in Table 1-1 Comparison • Removed the sample statue for ESP32-S3-PICO-1-N8R8 2023-07-21 v1.0 Added the following sections: • Section 3.4 DC Characteristics (3.3 V, 25 °C) • Section 3.5 ADC Characteristics • Section 3.6 Current Consumption • Section 3.7 Reliability • Section 3.8 Wi-Fi Radio • Section 3.9 Bluetooth 5 (LE) Radio Updated the following section: • Updated Section 2.3 Strapping Pins • Updated Section 4 Schematics • Updated Section 5 Peripheral Schematics Other minor updates 2023-03-30 v0.2 Updated Figure Peripheral Schematics 2022-09-23 v0.1 Preliminary Espressif Systems 33 Submit Documentation Feedback ESP32-S3-PICO-1 Series Datasheet v1.1 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. 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