Product OverviewBlock DiagramFeaturesApplications1 ESP32-S3-PICO-1 Series Comparison1.1 ESP32-S3-PICO-1 Series Nomenclature1.2 Comparison2 Pin Definition2.1 Pin Layout2.2 Pin Description2.3 Strapping Pins2.3.1 Chip Boot Mode Control2.3.2 VDD_SPI Voltage Control2.3.3 ROM Messages Printing Control2.3.4 JTAG Signal Source Control3 Electrical Characteristics3.1 Absolute Maximum Ratings3.2 Recommended Power Supply Characteristics3.3 VDD_SPI Output Characteristics3.4 DC Characteristics (3.3 V, 25 °C)3.5 ADC Characteristics3.6 Current Consumption3.6.1 RF Current Consumption in Active Mode3.6.2 Current Consumption in Other Modes3.7 Reliability3.8 Wi-Fi Radio3.8.1 Wi-Fi RF Transmitter (TX) Specifications3.8.2 Wi-Fi RF Receiver (RX) Specifications3.9 Bluetooth 5 (LE) Radio3.9.1 Bluetooth LE RF Transmitter (TX) Characteristics3.9.2 Bluetooth LE RF Receiver (RX) Characteristics4 Schematics5 Peripheral Schematics6 Packaging7 Product Handling7.1 Storage Conditions7.2 Reflow Profile7.3 Ultrasonic Vibration8 Related Documentation and ResourcesRevision History
www
fl fl fi
ESP32-S340 MHzCrystal3V3ENGPIOsSPIWPSPIQSPIDSPICS0SPIHDVDD_SPISPICLKESP32-S3-PICO-1QSPI FLASHSPIWPOSPI PSRAM(opt.)SPICS1SPICLKSPIDSPIQSPIHDVDD_SPISPIIO4SPIIO5SPIIO6SPIIO7SPIDQSRF MatchingRF MatchingAntennaGPIO37GPIO36GPIO35GPIO34GPIO33QSPI PSRAM(opt.)SPIDSPIWPSPIHDSPIQSPICLKSPICS1VDD_SPI • • • • • • • • µ • ~ • • • •
• • • • • fl• • ~ • – ~ – ~ • • • • • • • • • • • • • • • • •
fi fi fi
fl fi
fi fi 1
fl fi
ESP32-S3-PICO-1xSiP seriesFlash size (MB)R xPSRAMPSRAM size (MB)HFlash temperatureH: High temperatureN: Normal temperature 1 fl 2 – ∼ – ∼ 1 2 fi
fi fi 12345678910GPIO20GPIO21GPIO19GPIO18GPIO17XTAL_32K_NXTAL_32K_PVDD3P3_RTCGPIO14GPIO13GPIO12GPIO11GPIO10GPIO9GPIO8GPIO7GPIO6GPIO5GPIO4GPIO3GPIO2GPIO1GPIO0CHIP_PUVDD3P3VDD3P3LNA_INVDDANCNCGPIO46GPIO45U0RXDU0TXDMTMSMTDIVDD3P3_CPUMTDOMTCKGPIO38VDDAGPIO37GPIO36GPIO35GPIO33SPICLK_PNCNCNCNCNCNCVDD_SPISPICS1SPICLK_N1112131415161718192021222324252627284241403938373635343332313029GPIO345655545352515049484746454443ESP32-S3-PICO-157 GND
fi 1 2, 5 fi A A fl A
fi 1 2, 5 4 D 3 3 3, 4 3, 4 3, 4 3, 4 3, 4 D
fi 1 2, 5 A A 1 A D 2 ∼ 3 ∼ fi 4 ∼ 5 fi
fi fi fl • • • • fi fi SU H
fiStrapping pinVIL_nRSTVIHSUH fi 1 1 1 2 SP I SP I1 2
fi • • • fi abc a b c
– output1 ST OR E – 1 1 2 3 V DD4 1 SP I 2 3
1 SP I SP I fl2 Ω1 fl fl SP I• fl fl• fl fl IN IH 1 1 IL – 1IH IL OH2 1 OL2 1OH 1 OH OL 1 OL P U ΩP D ΩIHnRST fi 1 1 ILnRST fi – 11 2OH OL
1– – 21 fi 2 ~ – ~ – ~ – ~ –
123 1 2 3 fl fl
µ1 1 µ µ fi 1 2 max fl – – 1 2 ~
fi 1 – – – – – – – – – – – – – – – –1 fi fi – – – – – – – –
– – – – – – – – – – – – – – – – – – – –
~ – ~ |fn|n=0, 1, 2, 3, ...k |f0 −fn|n=2, 3, 4, ...k |fn −fn−5|n=6, 7, 8, ...k |f1 −f0| ∆ F 1 ∆ F 2 ∆ F 2 ∆ F 2∆ F 1 – – – |fn|n=0, 1, 2, 3, ...k |f0 −fn|n=2, 3, 4, ...k |fn −fn−5|n=6, 7, 8, ...k |f1 −f0| ∆ F 1
∆ F 2 ∆ F 2 ∆ F 2∆ F 1 – – – |fn|n=0, 1, 2, 3, ...k |f0 −fn|n=1, 2, 3, ...k |f0 −f3| |fn −fn−3|n=7, 8, 9, ...k ∆ F 1 ∆ F 1 ∆ F 1 – – – |fn|n=0, 1, 2, 3, ...k |f0 −fn|n=1, 2, 3, ...k |f0 −f3| |fn −fn−3|n=7, 8, 9, ...k ∆ F 2 ∆ F 2 ∆ F 2 – – – –
– – – – ≥ – ≤ – – image – image – ~ – ~ – ~ – ~ – – – – – – – ≥ – ≤ – – image – image ~ – ~ – ~ – ~ – –
– – – – – ≥ – ≤ – – image – image – – – – – – ≥ – ≤ – – image – image –
5544332211D DC CB BA ANC: No component.ESP32-S3Pin MappingESP32-S3 ESP32-S3-PICO-1LNA_INVDD3P3VDD3P3CHIP_PUGPIO0GPIO1GPIO2GPIO3GPIO4GPIO5GPIO6GPIO7GPIO8GPIO9GPIO10GPIO11GPIO12GPIO13GPIO14VDD3P3_RTCXTAL_32K_PXTAL_32K_NGPIO17GPIO18GPIO19GPIO20GPIO21SPICS1VDD_SPISPIHDSPIWPSPICS0SPICLKSPIQSPIDSPICLK_NSPICLK_PGPIO33GPIO34GPIO35GPIO36GPIO37GPIO38MTCKMTDOVDD3P3_CPUMTDIMTMSU0TXDU0RXDGPIO45GPIO46XTAL_NXTAL_PVDDAVDDALNA_INVDD3P3CHIP_PUGPIO0VDD3P3GPIO1GPIO2GPIO3GPIO4GPIO5GPIO6GPIO7GPIO8GPIO9GPIO10GPIO11GPIO12GPIO13GPIO14VDD3P3_RTCXTAL_32K_PGPIO17GPIO18GPIO19GPIO20XTAL_32K_NGPIO21SPICS1VDD_SPINCNCNCNCNCNCSPICLK_NSPICLK_PGPIO33GPIO34GPIO35GPIO36GPIO37GPIO38MTCKMTDOMTDIVDD3P3_CPUMTMSU0TXDU0RXDGPIO45GPIO46NCNCVDDAVDDAESP32-S3-PICO-1-N8R2: U3 is used and U4 is NC.ESP32-S3-PICO-1-N8R8: U4 is used and U3 is NC.50 ohm Impedance ControlLNA_INGPIO21GPIO45U0TXDGPIO46GPIO38MTDOMTDIMTMSU0RXDMTCKSPICLK_PSPICLK_NGPIO0GPIO1GPIO2GPIO3GPIO4GPIO5GPIO6GPIO7GPIO8GPIO9CHIP_PUGPIO20GPIO19GPIO18GPIO17XTAL_32K_NXTAL_32K_PGPIO14GPIO13GPIO12GPIO11GPIO10GPIO37GPIO36GPIO35GPIO34GPIO33SPICS1SPIDSPIQSPICLKSPICS0SPIWPSPIHDSPICLKSPICS0SPIHDSPIDSPIWPSPIQGPIO35GPIO36GPIO34SPI_HDGPIO33SPI_QSPI_DSPI_CLKSPI_WPSPI_CS1GPIO37SPIWPSPIDSPIQSPICS1SPICLKSPIHDGND GNDVDD3P3GND GNDGNDVDDAGND GNDGNDVDD3P3_RTCVDD3P3_CPUGNDGNDGNDGNDGNDGNDVDD_SPIGNDVDD_SPIVDD_SPIGNDGNDVDD_SPITitleSizePage Name R e vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-PICO-1>V1.0A32 2Friday, July 07, 2023TitleSizePage Name R e vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-PICO-1>V1.0A32 2Friday, July 07, 2023TitleSizePage Name R e vDate: Sheeto fConfidential and Proprietary<02_ESP32-S3-PICO-1>V1.0A32 2Friday, July 07, 2023C112.4pFC122.0pFC130.1uFU4 PSRAM(opt.)RSUC2RST#A4DQSC3CE#A3CLKB2NC1A2NC2B1NC5C5NC4B5NC3A5ADQ0D3ADQ1D2ADQ2C4ADQ3D4ADQ5E3ADQ7E1ADQ4D5ADQ6E2VCC1B4VCCQ2D1VCCQ3E4VSSQ3E5VSSQ2C1VSS1B3C141uFU2 FLASHVDD8GND4/CS1CLK6/HOLD7/WP3DO2DI5U1VDDA56LNA_IN1VDD3P32VDD3P33GPIO05GPIO16GPIO27GPIO38GPIO49GPIO510GPIO611GPIO712GPIO1015GPIO1116GPIO1217GPIO1318GPIO1419XTAL_32K_P21VDD3P3_RTC20XTAL_32K_N22GPIO1723GPIO1824GPIO1925GPIO2026VDD_SPI29SPIWP31SPICS032SPIQ34SPID35SPICLK33SPICLK_N36GND57SPICLK_P37GPIO3338GPIO3843GPIO4652XTAL_N53XTAL_P54MTMS48MTDO45U0TXD49VDD3P3_CPU46CHIP_PU4VDDA55MTDI47GPIO813GPIO914GPIO2127SPICS128SPIHD30GPIO3439GPIO3540GPIO3641U0RXD50GPIO4551GPIO3742MTCK44C93.0pFC31uFU3 PSRAM(opt.)VDD8VSS4CS1SCLK6SIO37SIO23SO/SIO12SI/SIO05L1 2.0nHY140MHz(±10ppm)XIN1GND2XOUT3GND4L2 2.4nHC210nFC416pFC118pFL3 24nHR3 0C100.1uFC82.2uF
5544332211D DC CB BA ANC: No component.X1: ESR = Max. 70 KESP32-S3-PICO-1-N8R2: SPICS1 connect to the QSPI PSRAM and are not available for other use.ESP32-S3-PICO-1-N8R8: SPICS1 and IO33~IO37 connect to the OSPIPSRAM and are not available for other use.50 ohm Impedance ControlENTCKIO2IO3IO10X32K_PX32K_NIO5IO6IO7RXD0TXD0IO1IO8IO9ENLNA_INIO4IO46IO45IO42IO41IO40IO39IO38IO37IO36IO35IO34IO33IO47IO48IO11IO12IO13IO14IO17IO18IO19IO20IO21TMSTDITDOIO15IO16IO0USB_D+USB_D-GNDGNDGNDGNDGND GNDVDD33VDD33GNDGNDGND GNDGNDGNDGND GNDR4 0R3 0C6TBDJP2Boot Option12C12TBDR4 NCC7 12pF(NC)C122uFC4 0.1uFJP1UART11223344C3 TBDC5TBDC4 12pF(NC)L2 TBDANT112U1 ESP32-S3-PICO-1LNA_IN1VDD3P32VDD3P33GPIO05GPIO16GPIO27GPIO38GPIO49GPIO510GPIO611GPIO712GPIO1015GPIO1116GPIO1217GPIO1318GPIO1419XTAL_32K_P21VDD3P3_RTC20XTAL_32K_N22GPIO1723GPIO1824GPIO1925GPIO2026VDD_SPI29SPICS128NC31NC32NC34NC35NC33GPIO3338GND57GPIO3439GPIO3540MTCK44GPIO4652VDDA55NC53NC54MTMS48MTDO45U0TXD49VDD3P3_CPU46CHIP_PU4VDDA56MTDI47GPIO813GPIO914GPIO2127NC30GPIO3641GPIO3742GPIO3843U0RXD50GPIO4551SPICLK_N36SPICLK_P37C11TBDJP4USB12JP3JTAG11223344R5 0SW1R6 0R2 0C20.1uFX132.768KHz(NC)12R1TBD Ω µ fi
1141528294243 5657APPROVECHECKDESIGNAPPROVEPROCESSSTAND.DRAWING NO.REV.DIMENSION AND TOLERANCES SCALEPACKAGE OUTLINE DRAWING[产品外形图]PAGEASME Y14.5MTITLE:DESIGNPROJECTIONA3SIZEMMSIGNATURE AREAUNIT甬矽电子 FOREHOPE ELECTRONICFOREHOPE CONFIDENTIAL-BThis document and its information herein are the property of Forehope and all unauthorized use and reproduction are prohibited.QB Huang 2022.03.28XiongYing 2022.03.28LGA-7×7-57(P0.4 T1.06)PO-ALGA770X17A10:11 OF 1 TECHNOLOGY SPECIFICATION[技术要求]1.BAN TO USE THE LEVEL 1 ENVIRONMENT-RELATED SUBSTANCES； [禁止使用一级环境管理物质；]symbolDimension in mm Dimension in inchMIN NOM MAX MIN NOM MAXA 0.860 0.960 1.060 0.034 0.038 0.042c 0.220 0.260 0.300 0.009 0.010 0.012D 6.900 7.000 7.100 0.272 0.276 0.280E 6.900 7.000 7.100 0.272 0.276 0.280D1 3.900 4.000 4.100 0.154 0.157 0.161E1 3.900 4.000 4.100 0.154 0.157 0.161H --- 0.300 --- --- 0.012 ---H1 --- 0.300 --- --- 0.012 ---L 0.250 0.325 0.400 0.010 0.013 0.016L1 0.050 0.075 0.100 0.002 0.003 0.004e --- 0.400 --- --- 0.016 ---b0.150 0.200 0.250 0.006 0.008 0.010aaa 0.100 0.004bbb 0.150 0.006ccc 0.100 0.004ddd0.080 0.003eee 0.150 0.006Top ViewBottom ViewSide ViewAD2Xaaa CPIN #1CORNEREBaaa C2XPIN #1D1eee C A Beeee C A BE1HH156×b4×L156×Lbbb C A Bddd CCAVITYccc CcASEATING PLANEC • •
fl fi fl501500251 ~ 3 ℃/s0200250200–1 ~ –5 ℃/sCooling zone10021750100 250Reflow zone 217 ℃ 60 ~ 90 sTemperature (℃)Preheating zone150 ~ 200 ℃ 60 ~ 120 sRamp-up zonePeak Temp. 235 ~ 250 ℃Soldering time> 30 sTime (sec.)Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/sPreheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 sReflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 sCooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/sSolder — Sn-Ag-Cu (SAC305) lead-free solder alloy fl fi
• fi • • • • fifi• fi • • fi • • • • • • • • • fi •
• • • • • • • • • • •
www
