1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 VDD_SPI Voltage Control 4.3 ROM Messages Printing Control 4.4 JTAG Signal Source Control 4.5 Chip Power-up and Reset 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interface 5.2.1.1 UART Controller 5.2.1.2 I2C Interface 5.2.1.3 I2S Interface 5.2.1.4 LCD and Camera Controller 5.2.1.5 Serial Peripheral Interface (SPI) 5.2.1.6 Two-Wire Automotive Interface (TWAI®) 5.2.1.7 USB 2.0 OTG Full-Speed Interface 5.2.1.8 USB Serial/JTAG Controller 5.2.1.9 SD/MMC Host Controller 5.2.1.10 LED PWM Controller 5.2.1.11 Motor Control PWM (MCPWM) 5.2.1.12 Remote Control Peripheral (RMT) 5.2.1.13 Pulse Count Controller (PCNT) 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 5.2.2.3 Touch Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 6.5 Memory Specifications 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 7.2 Bluetooth LE Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Reflow Profile 12.4 Ultrasonic Vibration Datasheet Versioning Related Documentation and Resources Revision History ESP32-S3-MINI-1 ESP32-S3-MINI-1U Datasheet Version 1.6 Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth ® 5 Built around ESP32-S3 series of SoCs, Xtensa ® dual-core 32-bit LX7 microprocessor Flash up to 8 MB, optional 2 MB PSRAM in chip package 39 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector ESP32-S3-MINI-1 ESP32-S3-MINI-1U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-S3 embedded, Xtensa ® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz • 384 KB ROM • 512 KB SRAM • 16 KB SRAM in RTC • Up to 8 MB Quad SPI flash • 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support • Center frequency range of operating channel: 2412 ~ 2484 MHz Bluetooth • Bluetooth LE: Bluetooth 5, Bluetooth mesh • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • Advertising extensions • Multiple advertisement sets • Channel selection algorithm #2 • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals • 39 GPIOs – 4 strapping GPIOs • SPI, LCD interface, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, full-speed USB 2.0 OTG, USB Serial/JTAG controller, MCPWM, SD/MMC host controller, GDMA, TWAI ® controller (compatible with ISO 11898-1, i.e. CAN Specification 2.0), ADC, touch sensor, temperature sensor, timers and watchdogs Integrated Components on Module • 40 MHz crystal oscillator Antenna Options • ESP32-S3-MINI-1: On-board PCB antenna • ESP32-S3-MINI-1U: External antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: –40 ~ 85 °C Certification • RF certification: See certificates • Green certification: RoHS/REACH Test • HTOL/HTSL/uHAST/TCT/ESD Espressif Systems 2 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 1 Module Overview 1.2 Series Comparison ESP32-S3-MINI-1 and ESP32-S3-MINI-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that feature a rich set of peripherals, yet an optimized size. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics, etc. ESP32-S3-MINI-1 comes with a PCB antenna. ESP32-S3-MINI-1U comes with a connector for an external antenna. They feature an up to 8 MB SPI flash and an optional 2 MB SPI Pseudo static RAM (PSRAM). Both ESP32-S3-MINI-1 and ESP32-S3-MINI-1U come in two versions, with the ordering code ending with -N8 and -N4R2 respectively. The two versions only vary in flash and PSRAM size. The series comparison for the two modules is as follows: Table 1-1. ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison Ambient Temp. 3 Size 4 Ordering Code Flash 1, 2 PSRAM 1 (°C) (mm) ESP32-S3-MINI-1-N8 8 MB (Quad SPI) - –40 ∼ 85 15.4 × 20.5 × 2.4 ESP32-S3-MINI-1-N4R2 4 MB (Quad SPI) 2 MB (Quad SPI) ESP32-S3-MINI-1U-N8 8 MB (Quad SPI) - 15.4 × 15.4 × 2.4 ESP32-S3-MINI-1U-N4R2 4 MB (Quad SPI) 2 MB (Quad SPI) 1 For specifications, refer to Section 6.5 Memory Specifications. 2 By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does not support the auto suspend feature. If you have a requirement for a higher flash clock frequency of 120 MHz or if you need the flash auto suspend feature, please contact us. 3 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espressif module. 4 For details, refer to Section 10.1 Module Dimensions. At the core of the modules is an ESP32-S3 series of SoC, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. Note: For more information on ESP32-S3, please refer to ESP32-S3 Series Datasheet. For chip revision identification, ESP-IDF release that supports a specific chip revision, and other information on chip revisions, please refer to ESP32-S3 Series SoC Errata > Section Chip Revision Identification. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Audio Devices • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers Espressif Systems 3 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 1 Module Overview • Cameras for Video Streaming • USB Devices • Speech Recognition • Image Recognition • Wi-Fi + Bluetooth Networking Card • Touch and Proximity Sensing Espressif Systems 4 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 3 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 11 4 Boot Configurations 13 4.1 Chip Boot Mode Control 14 4.2 VDD_SPI Voltage Control 15 4.3 ROM Messages Printing Control 15 4.4 JTAG Signal Source Control 15 4.5 Chip Power-up and Reset 16 5 Peripherals 17 5.1 Peripheral Overview 17 5.2 Peripheral Description 17 5.2.1 Connectivity Interface 17 5.2.1.1 UART Controller 17 5.2.1.2 I2C Interface 18 5.2.1.3 I2S Interface 19 5.2.1.4 LCD and Camera Controller 19 5.2.1.5 Serial Peripheral Interface (SPI) 19 5.2.1.6 Two-Wire Automotive Interface (TWAI ® ) 22 5.2.1.7 USB 2.0 OTG Full-Speed Interface 23 5.2.1.8 USB Serial/JTAG Controller 24 5.2.1.9 SD/MMC Host Controller 25 5.2.1.10 LED PWM Controller 25 5.2.1.11 Motor Control PWM (MCPWM) 26 5.2.1.12 Remote Control Peripheral (RMT) 26 5.2.1.13 Pulse Count Controller (PCNT) 27 5.2.2 Analog Signal Processing 27 5.2.2.1 SAR ADC 28 5.2.2.2 Temperature Sensor 28 5.2.2.3 Touch Sensor 28 6 Electrical Characteristics 29 6.1 Absolute Maximum Ratings 29 6.2 Recommended Operating Conditions 29 Espressif Systems 5 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Contents 6.3 DC Characteristics (3.3 V, 25 °C) 29 6.4 Current Consumption Characteristics 30 6.4.1 Current Consumption in Active Mode 30 6.4.2 Current Consumption in Other Modes 30 6.5 Memory Specifications 32 7 RF Characteristics 33 7.1 Wi-Fi Radio 33 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 33 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 34 7.2 Bluetooth LE Radio 35 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 36 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 37 8 Module Schematics 40 9 Peripheral Schematics 42 10 Physical Dimensions 43 10.1 Module Dimensions 43 10.2 Dimensions of External Antenna Connector 44 11 PCB Layout Recommendations 46 11.1 PCB Land Pattern 46 11.2 Module Placement for PCB Design 47 12 Product Handling 48 12.1 Storage Conditions 48 12.2 Electrostatic Discharge (ESD) 48 12.3 Reflow Profile 48 12.4 Ultrasonic Vibration 49 Datasheet Versioning 50 Related Documentation and Resources 51 Revision History 52 Espressif Systems 6 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 List of Tables List of Tables 1-1 ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison 3 3-1 Pin Definitions 11 4-1 Default Configuration of Strapping Pins 13 4-2 Description of Timing Parameters for the Strapping Pins 14 4-3 Chip Boot Mode Control 14 4-4 VDD_SPI Voltage Control 15 4-5 JTAG Signal Source Control 16 4-6 Description of Timing Parameters for Power-up and Reset 16 6-1 Absolute Maximum Ratings 29 6-2 Recommended Operating Conditions 29 6-3 DC Characteristics (3.3 V, 25 °C) 29 6-4 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 30 6-5 Current Consumption for Bluetooth LE in Active Mode 30 6-6 Current Consumption in Modem-sleep Mode 31 6-7 Current Consumption in Low-Power Modes 31 6-8 Flash Specifications 32 6-9 PSRAM Specifications 32 7-1 Wi-Fi RF Characteristics 33 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 33 7-3 TX EVM Test 1 33 7-4 RX Sensitivity 34 7-5 Maximum RX Level 35 7-6 RX Adjacent Channel Rejection 35 7-7 Bluetooth LE RF Characteristics 35 7-8 Bluetooth LE - Transmitter Characteristics - 1 Mbps 36 7-9 Bluetooth LE - Transmitter Characteristics - 2 Mbps 36 7-10 Bluetooth LE - Transmitter Characteristics - 125 Kbps 36 7-11 Bluetooth LE - Transmitter Characteristics - 500 Kbps 37 7-12 Bluetooth LE - Receiver Characteristics - 1 Mbps 37 7-13 Bluetooth LE - Receiver Characteristics - 2 Mbps 37 7-14 Bluetooth LE - Receiver Characteristics - 125 Kbps 38 7-15 Bluetooth LE - Receiver Characteristics - 500 Kbps 38 Espressif Systems 7 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 List of Figures List of Figures 2-1 ESP32-S3-MINI-1 Block Diagram 9 2-2 ESP32-S3-MINI-1U Block Diagram 9 3-1 Pin Layout (Top View) 10 4-1 Visualization of Timing Parameters for the Strapping Pins 14 4-2 Visualization of Timing Parameters for Power-up and Reset 16 8-1 ESP32-S3-MINI-1 Schematics 40 8-2 ESP32-S3-MINI-1U Schematics 41 9-1 Peripheral Schematics 42 10-1 ESP32-S3-MINI-1 Physical Dimensions 43 10-2 ESP32-S3-MINI-1U Physical Dimensions 43 10-3 Dimensions of External Antenna Connector 44 11-1 ESP32-S3-MINI-1 Recommended PCB Land Pattern 46 11-2 ESP32-S3-MINI-1U Recommended PCB Land Pattern 47 12-1 Reflow Profile 48 Espressif Systems 8 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 2 Block Diagram 2 Block Diagram FLASH (QSPI) ESP32-S3FN8 ESP32-S3FH4R2 RF Matching 40 MHz Crystal ESP32-S3-MINI-1 GPIOs Antenna PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 40 MHz Crystal ESP32-S2-MINI-2U GPIOs PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 2-1. ESP32-S3-MINI-1 Block Diagram FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 RF Matching 40 MHz Crystal ESP32-S2-MINI-2 GPIOs Antenna PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S3FN8 ESP32-S3FH4R2 40 MHz Crystal ESP32-S3-MINI-1U GPIOs PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 2-2. ESP32-S3-MINI-1U Block Diagram Note: For the pin mapping between the chip and the in-package flash/PSRAM, please refer to ESP32-S3 Series Datasheet > Table Pin Mapping Between Chip and In-package Flash/PSRAM. Espressif Systems 9 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10.1 Module Dimensions. Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 Pin 63 GND IO12 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 64 GND Pin 31 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 IO47 IO33 IO34 IO48 Pin 32 Pin 33 Pin 34 Pin 35 Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 65 GND Pin 62 GND Pin 46 Pin 47 Pin 48 Pin 49 Pin 50 Pin 51 Pin 52 Pin 53 Pin 54 Pin 55 Pin 56 Pin 57 Pin 58 Pin 59 Pin 60 Pin 61 GND GND GND GND GNDGND GND GND GND IO35 IO36 IO37 IO38 IO39 IO40 IO41 IO42 TXD0 RXD0 IO45 GND GND IO46 EN GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Keepout Zone Figure 3-1. Pin Layout (Top View) Note A: The zone marked with dotted lines is the antenna keepout zone. The pin diagram is applicable to ESP32-S3-MINI-1 and ESP32-S3-MINI-1U, but the latter has no antenna keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP32-S3 Hardware Design Guidelines > Section General Principles of PCB Layout for Modules. Espressif Systems 10 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 3 Pin Definitions 3.2 Pin Description The module has 65 pins. See pin definitions in Table 3-1 Pin Definitions. For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to ESP32-S3 Series Datasheet. Table 3-1. Pin Definitions Name No. Type a Function GND 1, 2, 42, 43, 46-65 P GND 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0, GPIO0 IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6 IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1 IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD IO10 14 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0 IO11 15 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID IO12 16 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK IO13 17 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ IO14 18 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17, GPIO17 , U1TXD, ADC2_CH6 IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D- IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ IO21 25 I/O/T RTC_GPIO21, GPIO21 IO26 b 26 I/O/T SPICS1, GPIO26 IO47 27 I/O/T SPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD, SUBSPIHD IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0, SUBSPICS0 IO48 30 I/O/T SPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF IO35 31 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 3 Pin Definitions Table 3-1 – cont’d from previous page Name No. Type a Function IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ IO38 34 I/O/T GPIO38, FSPIWP, SUBSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1 IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 IO46 44 I/O/T GPIO46 EN 45 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. a P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default pin functions. For pin 28 ∼ 29, 31 ∼ 33, the default function is decided by eFuse bit. b For modules with ordering codes ending with -N4R2, IO26 connects to the embedded PSRAM and is not available for other uses. Espressif Systems 12 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32-S3 Series Datasheet > Section Boot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter 8 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO0 and GPIO46 • VDD_SPI voltage – Strapping pin: GPIO45 – eFuse parameter: EFUSE_VDD_SPI_FORCE and EFUSE_VDD_SPI_TIEH • ROM message printing – Strapping pin: GPIO46 – eFuse parameter: EFUSE_UART_PRINT_CONTROL and EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT • JTAG signal source – Strapping pin: GPIO3 – eFuse parameter: EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_STRAP_JTAG_SEL The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer to ESP32-S3 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4-1. Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Weak pull-up 1 GPIO3 Floating – GPIO45 Weak pull-down 0 GPIO46 Weak pull-down 0 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-S3 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in Espressif Systems 13 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 4 Boot Configurations any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 4-2 and Figure 4-1. Table 4-2. Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the EN pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after EN is already high and before these pins start operating as regular IO pins. 3 Strapping pin VIL_nRST VIH t SU t H EN Figure 4-1. Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO0 and GPIO46 control the boot mode after the reset is released. See Table 4-3 Chip Boot Mode Control. Table 4-3. Chip Boot Mode Control Boot Mode GPIO0 GPIO46 SPI Boot 1 Any value Joint Download Boot 2 0 0 1 Bold marks the default value and configura- tion. 2 Joint Download Boot mode supports the fol- lowing download methods: • USB Download Boot: – USB-Serial-JTAG Download Boot – USB-OTG Download Boot • UART Download Boot Espressif Systems 14 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 4 Boot Configurations In SPI Boot mode, the ROM bootloader loads and executes the program from SPI flash to boot the system. In Joint Download Boot mode, users can download binary files into flash using UART0 or USB interface. It is also possible to download binary files into SRAM and execute it from SRAM. In addition to SPI Boot and Joint Download Boot modes, ESP32-S3 also supports SPI Download Boot mode. For details, please see ESP32-S3 Technical Reference Manual > Chapter Chip Boot Control . 4.2 VDD_SPI Voltage Control Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways. Table 4-4. VDD_SPI Voltage Control VDD_SPI power source 2 Voltage EFUSE_VDD_SPI_FORCE GPIO45 EFUSE_VDD_SPI_TIEH VDD3P3_RTC via R SP I 3.3 V 0 0 Ignored Flash Voltage Regulator 1.8 V 1 Flash Voltage Regulator 1.8 V 1 Ignored 0 VDD3P3_RTC via R SP I 3.3 V 1 1 Bold marks the default value and configuration. 2 See ESP32-S3 Series Datasheet > Section Power Scheme. 4.3 ROM Messages Printing Control During boot process the messages by the ROM code can be printed to: • (Default) UART0 and USB Serial/JTAG controller • USB Serial/JTAG controller • UART0 The ROM messages printing to UART or USB Serial/JTAG controller can be respectively disabled by configuring registers and eFuse. For detailed information, please refer to ESP32-S3 Technical Reference Manual > Chapter Chip Boot Control. 4.4 JTAG Signal Source Control The strapping pin GPIO3 can be used to control the source of JTAG signals during the early boot process. This pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that cannot be in a high impedance state. As Table 4-5 shows, GPIO3 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_STRAP_JTAG_SEL. Espressif Systems 15 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 4 Boot Configurations Table 4-5. JTAG Signal Source Control JTAG Signal Source EFUSE_DIS_PAD_JTAG EFUSE_DIS_USB_JTAG EFUSE_STRAP_JTAG_SEL GPIO3 USB Serial/JTAG Controller 0 0 0 Ignored 0 0 1 1 1 0 Ignored Ignored JTAG pins 2 0 0 1 0 0 1 Ignored Ignored JTAG is disabled 1 1 Ignored Ignored 1 Bold marks the default value and configuration. 2 JTAG pins refer to MTDI, MTCK, MTMS, and MTDO. 4.5 Chip Power-up and Reset Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, EN – the pin used for power-up and reset – is pulled high to activate the chip. For information on EN as well as power-up and reset timing, see Figure 4-2 and Table 4-6. V IL_nRST t ST BL t RST 2.8 V VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU EN Figure 4-2. Visualization of Timing Parameters for Power-up and Reset Table 4-6. Description of Timing Parameters for Power-up and Reset Parameter Description Min (µs) t ST BL Time reserved for the power rails of VDDA, VDD3P3, VDD3P3_RTC, and VDD3P3_CPU to stabilize before the EN pin is pulled high to activate the chip 50 t RST Time reserved for EN to stay below V IL_nRST to reset the chip (see Table 6-3) 50 Espressif Systems 16 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB Serial/JTAG, MCPWM, SD/MMC host controller, TWAI ® controller (compatible with ISO 11898-1, i.e., CAN Specification 2.0), ADC, touch sensor, and temperature sensor. It also includes a full-speed USB 2.0 On-The-Go (OTG) interface to enable USB communication. To learn more about on-chip components, please refer to ESP32-S3 Series Datasheet > Section Functional Description. Note: The content below is sourced from ESP32-S3 Series Datasheet > Section Peripherals. Some information may not be applicable to ESP32-S3-MINI-1 and ESP32-S3-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer to ESP32-S3 Technical Reference Manual > Section Peripheral Signals via GPIO Matrix. 5.2 Peripheral Description This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality. 5.2.1 Connectivity Interface This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks. 5.2.1.1 UART Controller ESP32-S3 has three UART (Universal Asynchronous Receiver Transmitter) controllers, i.e., UART0, UART1, and UART2, which support IrDA and asynchronous communication (RS232 and RS485) at a speed of up to 5 Mbps. Feature List • Three clock sources that can be divided • Programmable baud rate • 1024 x 8-bit RAM shared by TX FIFOs and RX FIFOs of the three UART controllers • Full-duplex asynchronous communication • Automatic baud rate detection of input signals • Data bits ranging from 5 to 8 • Stop bits of 1, 1.5, 2, or 3 bits • Parity bit Espressif Systems 17 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals • Special character AT_CMD detection • RS485 protocol • IrDA protocol • High-speed data communication using GDMA • UART as wake-up source • Software and hardware flow control For details, see ESP32-S3 Technical Reference Manual > Chapter UART Controller. Pin Assignment • UART0 – The pins U0TXD and U0RXD that are connected to transmit and receive signals are multiplexed with GPIO43 ~ GPIO44 via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U0RTS and U0CTS that are connected to hardware flow control signals are multiplexed with GPIO15 ~ GPIO16, RTC_GPIO15 ~ RTC_GPIO16, XTAL_32K_P and XTAL_32K_N, and SAR ADC2 interface via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U0DTR and U0DSR that are connected to hardware flow control signals can be chosen from any GPIO via the GPIO Matrix. • UART1 – The pins U1TXD and U1RXD that are connected to transmit and receive signals are multiplexed with GPIO17 ~ GPIO18, RTC_GPIO17 ~ RTC_GPIO18, and SAR ADC2 interface via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U1RTS and U1CTS that are connected to hardware flow control signals are multiplexed with GPIO19 ~ GPIO20, RTC_GPIO19 ~ RTC_GPIO20, USB_D- and USB_D+ pins, and SAR ADC2 interface via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U1DTR and U1DSR that are connected to hardware flow control signals can be chosen from any GPIO via the GPIO Matrix. • UART2: The pins used can be chosen from any GPIO via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.2 I2C Interface ESP32-S3 has two I2C bus interfaces which are used for I2C master mode or slave mode, depending on the user’s configuration. Feature List • Standard mode (100 kbit/s) • Fast mode (400 kbit/s) • Up to 800 kbit/s (constrained by SCL and SDA pull-up strength) Espressif Systems 18 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals • 7-bit and 10-bit addressing mode • Double addressing mode (slave addressing and slave register addressing) The hardware provides a command abstraction layer to simplify the usage of the I2C peripheral. For details, see ESP32-S3 Technical Reference Manual > Chapter I2C Controller. Pin Assignment For I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.3 I2S Interface ESP32-S3 includes two standard I2S interfaces. They can operate in master mode or slave mode, in full-duplex mode or half-duplex communication mode, and can be configured to operate with an 8-bit, 16-bit, 24-bit, or 32-bit resolution as an input or output channel. BCK clock frequency, from 10 kHz up to 40 MHz, is supported. The I2S interface has a dedicated DMA controller. It supports TDM PCM, TDM MSB alignment, TDM LSB alignment, TDM Phillips, and PDM interface. Pin Assignment For I2S, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.4 LCD and Camera Controller The LCD and Camera controller of ESP32-S3 consists of a LCD module and a camera module. The LCD module is designed to send parallel video data signals, and its bus supports 8-bit ~ 16-bit parallel RGB, I8080, and MOTO6800 interfaces. These interfaces operate at 40 MHz or lower, and support conversion among RGB565, YUV422, YUV420, and YUV411. The camera module is designed to receive parallel video data signals, and its bus supports an 8-bit ~ 16-bit DVP image sensor, with clock frequency of up to 40 MHz. The camera interface supports conversion among RGB565, YUV422, YUV420, and YUV411. Pin Assignment For LCD and Camera controller, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.5 Serial Peripheral Interface (SPI) ESP32-S3 has the following SPI interfaces: Espressif Systems 19 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals • SPI0 used by ESP32-S3’s GDMA controller and cache to access in-package or off-package flash/PSRAM • SPI1 used by the CPU to access in-package or off-package flash/PSRAM • SPI2 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller • SPI3 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller Feature List • SPI0 and SPI1: – Supports Single SPI, Dual SPI, Quad SPI, Octal SPI, QPI, and OPI modes – 8-line SPI mode supports single data rate (SDR) and double data rate (DDR) – Configurable clock frequency with a maximum of 120 MHz for 8-line SPI SDR/DDR modes – Data transmission is in bytes • SPI2: – Supports operation as a master or slave – Connects to a DMA channel allocated by the GDMA controller – Supports Single SPI, Dual SPI, Quad SPI, Octal SPI, QPI, and OPI modes – Configurable clock polarity (CPOL) and phase (CPHA) – Configurable clock frequency – Data transmission is in bytes – Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first – As a master * Supports 2-line full-duplex communication with clock frequency up to 80 MHz * Full-duplex 8-line SPI mode supports single data rate (SDR) only * Supports 1-, 2-, 4-, 8-line half-duplex communication with clock frequency up to 80 MHz * Half-duplex 8-line SPI mode supports both single data rate (up to 80 MHz) and double data rate (up to 40 MHz) * Provides six SPI_CS pins for connection with six independent SPI slaves * Configurable CS setup time and hold time – As a slave * Supports 2-line full-duplex communication with clock frequency up to 60 MHz * Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz * Full-duplex and half-duplex 8-line SPI mode supports single data rate (SDR) only • SPI3: – Supports operation as a master or slave Espressif Systems 20 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals – Connects to a DMA channel allocated by the GDMA controller – Supports Single SPI, Dual SPI, Quad SPI, and QPI modes – Configurable clock polarity (CPOL) and phase (CPHA) – Configurable clock frequency – Data transmission is in bytes – Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first – As a master * Supports 2-line full-duplex communication with clock frequency up to 80 MHz * Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz * Provides three SPI_CS pins for connection with three independent SPI slaves * Configurable CS setup time and hold time – As a slave * Supports 2-line full-duplex communication with clock frequency up to 60 MHz * Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz For details, see ESP32-S3 Technical Reference Manual > Chapter SPI Controller. Pin Assignment Note: Please refer to ESP32-S3 Series Datasheet > Section IO MUX Function > Table IO MUX Pin Functions for the corresponding SPI interface details. • SPI0/1 – Via IO MUX: * Interface 4a is multiplexed with GPIO26 ~ GPIO32 via IO MUX. When used in conjunction with 4b, it can operate as the lower 4 bits data line interface and the CLK, CS0, and CS1 interfaces in 8-line SPI mode. * Interface 4b is multiplexed with GPIO33 ~ GPIO37 and SPI interfaces 4e and 4f via IO MUX. When used in conjunction with 4a, it can operate as the higher 4 bits data line interface and DQS interface in 8-line SPI mode. * Interface 4d is multiplexed with GPIO8 ~ GPIO14, RTC_GPIO8 ~ RTC_GPIO14, Touch Sensor interface, SAR ADC interface, and SPI interfaces 4c and 4g via IO MUX. Note that the fast SPI2 interface will not be available. * Interface 4e is multiplexed with GPIO33 ~ GPIO39, JTAG MTCK interface, and SPI interfaces 4b and 4f via IO MUX. It is an alternative group of signal lines that can be used if SPI0/1 does not use 8-line SPI connection. – Via GPIO Matrix: The pins used can be chosen from any GPIOs via the GPIO Matrix. • SPI2 Espressif Systems 21 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals – Via IO MUX: * Interface 4c is multiplexed with GPIO9 ~ GPIO14, RTC_GPIO9 ~ RTC_GPIO14, Touch Sensor interface, SAR ADC interface, and SPI interfaces 4d and 4g via IO MUX. It is the SPI2 main interface for fast SPI connection. * (not recommended) Interface 4f is multiplexed with GPIO33 ~ GPIO38, SPI interfaces 4e and 4b via IO MUX. It is the alternative SPI2 interface if the main SPI2 is not available. Its performance is comparable to SPI2 via GPIO matrix, so use the GPIO matrix instead. * (not recommended) Interface 4g is multiplexed with GPIO10 ~ GPIO14, RTC_GPIO10 ~ RTC_GPIO14, Touch Sensor interface, SAR ADC interface, and SPI interfaces 4c and 4d via IO MUX. It is the alternative SPI2 interface signal lines for 8-line SPI connection. – Via GPIO Matrix: The pins used can be chosen from any GPIOs via the GPIO Matrix. • SPI3: The pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.6 Two-Wire Automotive Interface (TWAI ® ) The Two-Wire Automotive Interface (TWAI ® ) is a multi-master, multi-cast communication protocol with error detection and signaling as well as inbuilt message priorities and arbitration. Feature List • Compatible with ISO 11898-1 protocol (CAN Specification 2.0) • Standard frame format (11-bit ID) and extended frame format (29-bit ID) • Bit rates from 1 Kbit/s to 1 Mbit/s • Multiple modes of operation: – Normal – Listen Only – Self-Test (no acknowledgment required) • 64-byte receive FIFO • Acceptance filter (single and dual filter modes) • Error detection and handling: – Error counters – Configurable error interrupt threshold – Error code capture – Arbitration lost capture For details, see ESP32-S3 Technical Reference Manual > Chapter Two-wire Automotive Interface. Espressif Systems 22 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals Pin Assignment For TWAI, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.7 USB 2.0 OTG Full-Speed Interface ESP32-S3 features a full-speed USB OTG interface along with an integrated transceiver. The USB OTG interface complies with the USB 2.0 specification. General Features • FS and LS data rates • HNP and SRP as A-device or B-device • Dynamic FIFO (DFIFO) sizing • Multiple modes of memory access – Scatter/Gather DMA mode – Buffer DMA mode – Slave mode • Can choose integrated transceiver or external transceiver • Utilizing integrated transceiver with USB Serial/JTAG by time-division multiplexing when only integrated transceiver is used • Support USB OTG using one of the transceivers while USB Serial/JTAG using the other one when both integrated transceiver or external transceiver are used Device Mode Features • Endpoint number 0 always present (bi-directional, consisting of EP0 IN and EP0 OUT) • Six additional endpoints (endpoint numbers 1 to 6), configurable as IN or OUT • Maximum of five IN endpoints concurrently active at any time (including EP0 IN) • All OUT endpoints share a single RX FIFO • Each IN endpoint has a dedicated TX FIFO Host Mode Features • Eight channels (pipes) – A control pipe consists of two channels (IN and OUT), as IN and OUT transactions must be handled separately. Only Control transfer type is supported. – Each of the other seven channels is dynamically configurable to be IN or OUT, and supports Bulk, Isochronous, and Interrupt transfer types. Espressif Systems 23 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals • All channels share an RX FIFO, non-periodic TX FIFO, and periodic TX FIFO. The size of each FIFO is configurable. For details, see ESP32-S3 Technical Reference Manual > Chapter USB On-The-Go. Pin Assignment When using the on-chip PHY, the differential signal pins USB_D- and USB_D+ of the USB OTG are multiplexed with GPIO19 ~ GPIO20, RTC_GPIO19 ~ RTC_GPIO20, UART1 interface, and SAR ADC2 interface via IO MUX. When using external PHY, the USB OTG pins are multiplexed with GPIO21, RTC_GPIO21, GPIO38 ~ GPIO42, and SPI interface via IO MUX: • VP signal connected to MTMS pin • VM signal connected to MTDI pin • RCV signal connected to GPIO21 • OEN signal connected to MTDO pin • VPO signal connected to MTCK pin • VMO signal connected to GPIO38 For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.8 USB Serial/JTAG Controller ESP32-S3 integrates a USB Serial/JTAG controller. Feature List • USB Full-speed device. • Can be configured to either use internal USB PHY of ESP32-S3 or external PHY via GPIO matrix. • Fixed function device, hardwired for CDC-ACM (Communication Device Class - Abstract Control Model) and JTAG adapter functionality. • Two OUT Endpoints, three IN Endpoints in addition to Control Endpoint 0; Up to 64-byte data payload size. • Internal PHY, so no or very few external components needed to connect to a host computer. • CDC-ACM adherent serial port emulation is plug-and-play on most modern OSes. • JTAG interface allows fast communication with CPU debug core using a compact representation of JTAG instructions. • CDC-ACM supports host controllable chip reset and entry into download mode. For details, see ESP32-S3 Technical Reference Manual > Chapter USB Serial/JTAG Controller. Espressif Systems 24 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals Pin Assignment When using the on-chip PHY, the differential signal pins USB_D- and USB_D+ of the USB Serial/JTAG controller are multiplexed with GPIO19 ~ GPIO20, RTC_GPIO19 ~ RTC_GPIO20, UART1 interface, and SAR ADC2 interface via IO MUX. When using external PHY, the USB Serial/JTAG controller pins are multiplexed with GPIO38 ~ GPIO42 and SPI interface via IO MUX: • VP signal connected to MTMS pin • VM signal connected to MTDI pin • OEN signal connected to MTDO pin • VPO signal connected to MTCK pin • VMO signal connected to GPIO38 For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.9 SD/MMC Host Controller ESP32-S3 has an SD/MMC Host controller. Feature List • Secure Digital (SD) memory version 3.0 and version 3.01 • Secure Digital I/O (SDIO) version 3.0 • Consumer Electronics Advanced Transport Architecture (CE-ATA) version 1.1 • Multimedia Cards (MMC version 4.41, eMMC version 4.5 and version 4.51) • Up to 80 MHz clock output • Three data bus modes: – 1-bit – 4-bit (supports two SD/SDIO/MMC 4.41 cards, and one SD card operating at 1.8 V in 4-bit mode) – 8-bit For details, see ESP32-S3 Technical Reference Manual > Chapter SD/MMC Host Controller. Pin Assignment For SD/MMC Host, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.10 LED PWM Controller The LED PWM controller can generate independent digital waveforms on eight channels. Espressif Systems 25 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals Feature List • Can generate a digital waveform with configurable periods and duty cycle. The duty cycle resolution can be up to 14 bits within a 1 ms period • Multiple clock sources, including APB clock and external main crystal clock • Can operate when the CPU is in Light-sleep mode • Gradual increase or decrease of duty cycle, useful for the LED RGB color-fading generator For details, see ESP32-S3 Technical Reference Manual > Chapter LED PWM Controller. Pin Assignment For LED PWM, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.11 Motor Control PWM (MCPWM) ESP32-S3 integrates two MCPWMs that can be used to drive digital motors and smart light. Each MCPWM peripheral has one clock divider (prescaler), three PWM timers, three PWM operators, and a capture module. PWM timers are used for generating timing references. The PWM operators generate desired waveform based on the timing references. Any PWM operator can be configured to use the timing references of any PWM timers. Different PWM operators can use the same PWM timer’s timing references to produce related PWM signals. PWM operators can also use different PWM timers’ values to produce the PWM signals that work alone. Different PWM timers can also be synchronized together. For details, see ESP32-S3 Technical Reference Manual > Chapter Motor Control PWM. Pin Assignment For MCPWM, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.12 Remote Control Peripheral (RMT) The Remote Control Peripheral (RMT) is designed to send and receive infrared remote control signals. Feature List • Four TX channels • Four RX channels • Support multiple channels (programmable) transmitting data simultaneously • Eight channels share a 384 x 32-bit RAM • Support modulation on TX pulses • Support filtering and demodulation on RX pulses Espressif Systems 26 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals • Wrap TX mode • Wrap RX mode • Continuous TX mode • DMA access for TX mode on channel 3 • DMA access for RX mode on channel 7 For details, see ESP32-S3 Technical Reference Manual > Chapter Remote Control Peripheral. Pin Assignment For RMT, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.13 Pulse Count Controller (PCNT) The pulse count controller (PCNT) captures pulse and counts pulse edges through multiple modes. Feature List • Four independent pulse counters (units) that count from 1 to 65535 • Each unit consists of two independent channels sharing one pulse counter • All channels have input pulse signals (e.g. sig_ch0_un) with their corresponding control signals (e.g. ctrl_ch0_un) • Independently filter glitches of input pulse signals (sig_ch0_un and sig_ch1_un) and control signals (ctrl_ch0_un and ctrl_ch1_un) on each unit • Each channel has the following parameters: 1. Selection between counting on positive or negative edges of the input pulse signal 2. Configuration to Increment, Decrement, or Disable counter mode for control signal’s high and low states For details, see ESP32-S3 Technical Reference Manual > Chapter Pulse Count Controller. Pin Assignment For pulse count controller, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2 Analog Signal Processing This subsection describes components on the chip that sense and process real-world data. Espressif Systems 27 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 5 Peripherals 5.2.2.1 SAR ADC ESP32-S3 integrates two 12-bit SAR ADCs and supports measurements on 20 channels (analog-enabled pins). For power-saving purpose, the ULP coprocessors in ESP32-S3 can also be used to measure voltage in sleep modes. By using threshold settings or other methods, we can awaken the CPU from sleep modes. For more details, see ESP32-S3 Technical Reference Manual > Chapter On-Chip Sensors and Analog Signal Processing. Pin Assignment The pins for the SAR ADC are multiplexed with GPIO1 ~ GPIO20, RTC_GPIO1 ~ RTC_GPIO20, Touch Sensor interface, SPI interface, UART interface, and USB_D- and USB_D+ pins via IO MUX. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2.2 Temperature Sensor The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted via an ADC into a digital value. The temperature sensor has a range of –40 °C to 125 °C. It is designed primarily to sense the temperature changes inside the chip. The temperature value depends on factors such as microcontroller clock frequency or I/O load. Generally, the chip’s internal temperature is higher than the ambient temperature. For more details, see ESP32-S3 Technical Reference Manual > Chapter On-Chip Sensors and Analog Signal Processing. 5.2.2.3 Touch Sensor ESP32-S3 has 14 capacitive-sensing GPIOs, which detect variations induced by touching or approaching the GPIOs with a finger or other objects. The low-noise nature of the design and the high sensitivity of the circuit allow relatively small pads to be used. Arrays of pads can also be used, so that a larger area or more points can be detected. The touch sensing performance can be further enhanced by the waterproof design and digital filtering feature. Note: ESP32-S3 touch sensor has not passed the Conducted Susceptibility (CS) test for now, and thus has limited application scenarios. For more details, see ESP32-S3 Technical Reference Manual > Chapter On-Chip Sensors and Analog Signal Processing. Pin Assignment The pins for touch sensor are multiplexed with GPIO1 ~ GPIO14, RTC_GPIO1 ~ RTC_GPIO14, SAR ADC interface, and SPI interface via IO MUX. For more information about the pin assignment, see ESP32-S3 Series Datasheet > Section IO Pins and ESP32-S3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. Espressif Systems 28 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 6 Electrical Characteristics 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Stresses above those listed in Table 6-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 6-2 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 6-1. Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST OR E Storage temperature –40 105 °C 6.2 Recommended Operating Conditions Table 6-2. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature –40 — 85 °C 6.3 DC Characteristics (3.3 V, 25 °C) Table 6-3. DC Characteristics (3.3 V, 25 °C) Parameter Description Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Internal weak pull-up resistor — 45 — kΩ R P D Internal weak pull-down resistor — 45 — kΩ Espressif Systems 29 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 6 Electrical Characteristics V IH_nRST Chip reset release voltage (EN voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage (EN voltage is within the specified range) –0.3 — 0.25 × VDD 1 V 1 VDD – voltage from a power pin of a respective power domain. 2 V OH and V OL are measured using high-impedance load. 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section Power Management Unit in ESP32-S3 Series Datasheet. The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 6-4. Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, @20.5 dBm 355 802.11g, 54 Mbps, @18 dBm 297 802.11n, HT20, MCS 7, @17.5 dBm 286 802.11n, HT40, MCS 7, @17 dBm 285 RX 802.11b/g/n, HT20 95 802.11n, HT40 97 Table 6-5. Current Consumption for Bluetooth LE in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX Bluetooth LE @ 20.0 dBm 340 Bluetooth LE @ 9.0 dBm 204 Bluetooth LE @ 0 dBm 189 Bluetooth LE @ –15.0 dBm 118 RX Bluetooth LE 93 Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP32-S3 Series Datasheet. 6.4.2 Current Consumption in Other Modes Please note that if the chip embedded has in-package PSRAM, the current consumption of the module might be higher compared to the measurements below. Espressif Systems 30 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 6 Electrical Characteristics Table 6-6. Current Consumption in Modem-sleep Mode Work mode Frequency (MHz) Description Typ 1 (mA) Typ 2 (mA) Modem-sleep 3 40 WAITI (Dual core in idle state) 13.2 18.8 Single core running 32-bit data access instructions, the other core in idle state 16.2 21.8 Dual core running 32-bit data access instructions 18.7 24.4 Single core running 128-bit data access instructions, the other core in idle state 19.9 25.4 Dual core running 128-bit data access instructions 23.0 28.8 80 WAITI 22.0 36.1 Single core running 32-bit data access instructions, the other core in idle state 28.4 42.6 Dual core running 32-bit data access instructions 33.1 47.3 Single core running 128-bit data access instructions, the other core in idle state 35.1 49.6 Dual core running 128-bit data access instructions 41.8 56.3 160 WAITI 27.6 42.3 Single core running 32-bit data access instructions, the other core in idle state 39.9 54.6 Dual core running 32-bit data access instructions 49.6 64.1 Single core running 128-bit data access instructions, the other core in idle state 54.4 69.2 Dual core running 128-bit data access instructions 66.7 81.1 240 WAITI 32.9 47.6 Single core running 32-bit data access instructions, the other core in idle state 51.2 65.9 Dual core running 32-bit data access instructions 66.2 81.3 Single core running 128-bit data access instructions, the other core in idle state 72.4 87.9 Dual core running 128-bit data access instructions 91.7 107.9 1 Current consumption when all peripheral clocks are disabled. 2 Current consumption when all peripheral clocks are enabled. In practice, the current consumption might be different depending on which peripherals are enabled. 3 In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 6-7. Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep 1 VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance. 240 Deep-sleep RTC memory and RTC peripherals are powered up. 8 RTC memory is powered up. RTC peripherals are powered down. 7 Espressif Systems 31 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 6 Electrical Characteristics Power off EN is set to low level. The chip is shut down. 1 1 In Light-sleep mode, all related SPI pins are pulled up. For chips embedded with PSRAM, please add corresponding PSRAM consumption values, e.g., 140 µA for 8 MB Octal PSRAM (3.3 V), 200 µA for 8 MB Octal PSRAM (1.8 V) and 40 µA for 2 MB Quad PSRAM (3.3 V). 6.5 Memory Specifications The data below is sourced from the memory vendor datasheet. These values are guaranteed through design and/or characterization but are not fully tested in production. Devices are shipped with the memory erased. Table 6-8. Flash Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.65 1.80 2.00 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz — Program/erase cycles 100,000 — — cycles T RET Data retention time 20 — — years T P P Page program time — 0.8 5 ms T SE Sector erase time (4 KB) — 70 500 ms T BE1 Block erase time (32 KB) — 0.2 2 s T BE2 Block erase time (64 KB) — 0.3 3 s T CE Chip erase time (16 Mb) — 7 20 s Chip erase time (32 Mb) — 20 60 s Chip erase time (64 Mb) — 25 100 s Chip erase time (128 Mb) — 60 200 s Chip erase time (256 Mb) — 70 300 s Table 6-9. PSRAM Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.62 1.80 1.98 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz Espressif Systems 32 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio Table 7-1. Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics Table 7-2. TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 20.5 — 802.11b, 11 Mbps — 20.5 — 802.11g, 6 Mbps — 20.0 — 802.11g, 54 Mbps — 18.0 — 802.11n, HT20, MCS 0 — 19.0 — 802.11n, HT20, MCS 7 — 17.5 — 802.11n, HT40, MCS 0 — 18.5 — 802.11n, HT40, MCS 7 — 17.0 — Table 7-3. TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, @20.5 dBm — –24.5 –10 802.11b, 11 Mbps, @20.5 dBm — –24.5 –10 802.11g, 6 Mbps, @20 dBm — –23.0 –5 802.11g, 54 Mbps, @18 dBm — –29.5 –25 Cont’d on next page Espressif Systems 33 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics Table 7-3 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11n, HT20, MCS 0, @19 dBm — –24.0 –5 802.11n, HT20, MCS 7, @17.5 dBm — –30.5 –27 802.11n, HT40, MCS 0, @18.5 dBm — –25.0 –5 802.11n, HT40, MCS 7, @17 dBm — –30.0 –27 1 EVM is measured at the corresponding typical TX power provided in Table 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 7.1.2 Wi-Fi RF Receiver (RX) Characteristics For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n. Table 7-4. RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.2 — 802.11b, 2 Mbps — –95.6 — 802.11b, 5.5 Mbps — –92.8 — 802.11b, 11 Mbps — –88.5 — 802.11g, 6 Mbps — –93.0 — 802.11g, 9 Mbps — –92.0 — 802.11g, 12 Mbps — –90.8 — 802.11g, 18 Mbps — –88.5 — 802.11g, 24 Mbps — –85.5 — 802.11g, 36 Mbps — –82.2 — 802.11g, 48 Mbps — –78.0 — 802.11g, 54 Mbps — –76.2 — 802.11n, HT20, MCS 0 — –93.0 — 802.11n, HT20, MCS 1 — –90.6 — 802.11n, HT20, MCS 2 — –88.4 — 802.11n, HT20, MCS 3 — –84.8 — 802.11n, HT20, MCS 4 — –81.6 — 802.11n, HT20, MCS 5 — –77.4 — 802.11n, HT20, MCS 6 — –75.6 — 802.11n, HT20, MCS 7 — –74.2 — 802.11n, HT40, MCS 0 — –90.0 — 802.11n, HT40, MCS 1 — –87.5 — 802.11n, HT40, MCS 2 — –85.0 — 802.11n, HT40, MCS 3 — –82.0 — 802.11n, HT40, MCS 4 — –78.5 — 802.11n, HT40, MCS 5 — –74.4 — Cont’d on next page Espressif Systems 34 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics Table 7-4 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11n, HT40, MCS 6 — –72.5 — 802.11n, HT40, MCS 7 — –71.2 — Table 7-5. Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS 0 — 5 — 802.11n, HT20, MCS 7 — 0 — 802.11n, HT40, MCS 0 — 5 — 802.11n, HT40, MCS 7 — 0 — Table 7-6. RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS 0 — 31 — 802.11n, HT20, MCS 7 — 13 — 802.11n, HT40, MCS 0 — 19 — 802.11n, HT40, MCS 7 — 8 — 7.2 Bluetooth LE Radio Table 7-7. Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402 ~ 2480 MHz RF transmit power range –24.0 ~ 20.0 dBm Espressif Systems 35 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 7-8. Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max |f n | n=0, 1, 2, ..k — 2.50 — kHz Max |f 0 − f n | — 2.00 — kHz Max |f n − f n−5 | — 1.40 — kHz |f 1 − f 0 | — 1.00 — kHz Modulation characteristics ∆ f1 avg — 249.00 — kHz Min ∆ f2 max (for at least 99.9% of all ∆ f2 max ) — 198.00 — kHz ∆ f2 avg /∆ f1 avg — 0.86 — — In-band spurious emissions ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Table 7-9. Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max |f n | n=0, 1, 2, ..k — 2.50 — kHz Max |f 0 − f n | — 2.00 — kHz Max |f n − f n−5 | — 1.40 — kHz |f 1 − f 0 | — 1.00 — kHz Modulation characteristics ∆ f1 avg — 499.00 — kHz Min ∆ f2 max (for at least 99.9% of all ∆ f2 max ) — 416.00 — kHz ∆ f2 avg /∆ f1 avg — 0.89 — — In-band spurious emissions ±4 MHz offset — –42.00 — dBm ±5 MHz offset — –44.00 — dBm >±5 MHz offset — –47.00 — dBm Table 7-10. Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max |f n | n=0, 1, 2, ..k — 0.80 — kHz Max |f 0 − f n | — 1.00 — kHz |f n − f n−3 | — 0.30 — kHz |f 0 − f 3 | — 1.00 — kHz Modulation characteristics ∆ f1 avg — 248.00 — kHz Min ∆ f1 max (for at least 99.9% of all∆ f1 max ) — 222.00 — kHz In-band spurious emissions ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Espressif Systems 36 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics Table 7-11. Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max |f n | n=0, 1, 2, ..k — 0.80 — kHz Max |f 0 − f n | — 1.00 — kHz |f n − f n−3 | — 0.85 — kHz |f 0 − f 3 | — 0.34 — kHz Modulation characteristics ∆ f2 avg — 213.00 — kHz Min ∆ f2 max (for at least 99.9% of all ∆ f2 max ) — 196.00 — kHz In-band spurious emissions ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics Table 7-12. Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –96.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 8 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 4 — dB F = F0 – 1 MHz — 4 — dB F = F0 + 2 MHz — –23 — dB F = F0 – 2 MHz — –23 — dB F = F0 + 3 MHz — –34 — dB F = F0 – 3 MHz — –34 — dB F > F0 + 3 MHz — –36 — dB F > F0 – 3 MHz — –37 — dB Image frequency — — –36 — dB Adjacent channel to image frequency F = F image + 1 MHz — –39 — dB F = F image – 1 MHz — –34 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –12 — dBm 2003 MHz ~ 2399 MHz — –18 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –10 — dBm Intermodulation — — –29 — dBm Table 7-13. Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –92 — dBm Maximum received signal @30.8% PER — — 3 — dBm Cont’d on next page Espressif Systems 37 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics Table 7-13 – cont’d from previous page Parameter Description Min Typ Max Unit Co-channel C/I F = F0 MHz — 8 — dB Adjacent channel selectivity C/I F = F0 + 2 MHz — 4 — dB F = F0 – 2 MHz — 4 — dB F = F0 + 4 MHz — –27 — dB F = F0 – 4 MHz — –27 — dB F = F0 + 6 MHz — –38 — dB F = F0 – 6 MHz — –38 — dB F > F0 + 6 MHz — –41 — dB F > F0 – 6 MHz — –41 — dB Image frequency — — –27 — dB Adjacent channel to image frequency F = F image + 2 MHz — –38 — dB F = F image – 2 MHz — 4 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –15 — dBm 2003 MHz ~ 2399 MHz — –21 — dBm 2484 MHz ~ 2997 MHz — –21 — dBm 3000 MHz ~ 12.75 GHz — –9 — dBm Intermodulation — — –29 — dBm Table 7-14. Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –103.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –26 — dB F = F0 – 2 MHz — –26 — dB F = F0 + 3 MHz — –36 — dB F = F0 – 3 MHz — –39 — dB F > F0 + 3 MHz — –42 — dB F > F0 – 3 MHz — –43 — dB Image frequency — — –42 — dB Adjacent channel to image frequency F = F image + 1 MHz — –43 — dB F = F image – 1 MHz — –36 — dB Table 7-15. Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –100 — dBm Maximum received signal @30.8% PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB Cont’d on next page Espressif Systems 38 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 7 RF Characteristics Table 7-15 – cont’d from previous page Parameter Description Min Typ Max Unit Adjacent channel selectivity C/I F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 0 — dB F = F0 + 2 MHz — –24 — dB F = F0 – 2 MHz — –24 — dB F = F0 + 3 MHz — –37 — dB F = F0 – 3 MHz — –39 — dB F > F0 + 3 MHz — –38 — dB F > F0 – 3 MHz — –42 — dB Image frequency — — –38 — dB Adjacent channel to image frequency F = F image + 1 MHz — –42 — dB F = F image – 1 MHz — –37 — dB Espressif Systems 39 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 8 Module Schematics 8 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of L3, C5, C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. R4 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-S3-MINI-1(pin-out) NC: No component. 50 ohm Impedance Control GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO26 GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO46 U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU RF_ANT LNA_IN CHIP_PU GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO47 GPIO48 GPIO21 GPIO47 GPIO48 GPIO45 VDD33 GND VDD33 GND GND VDD33 GND GND VDD33 GND GND GND GND GND VDD33 GND GND GND GND GND GND GND GND VDD_SPI VDD33 GND GND GND GND VDD33 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-MINI-1> A4 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-MINI-1> A4 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-MINI-1> A4 2 2Wednesday, November 22, 2023 1.1 C9 0.1uF L3 TBD C3 1uF C1 TBD U2 ESP32-S3-MINI-1 GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 IO47 27 EPAD 61 GND 2 GND 62 IO48 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 TBD D1 ESD R3 499 C8 0.1uF C14 1uF C13 0.1uF ANT1 PCB_ANT 1 2 C11 TBD U1 ESP32-S3FN8 VDDA 56 LNA_IN 1 VDD3P3 2 VDD3P3 3 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 GPIO17 23 GPIO18 24 GPIO19 25 GPIO20 26 VDD_SPI 29 SPIWP 31 SPICS0 32 SPIQ 34 SPID 35 SPICLK 33 SPICLK_N 36 GND 57 SPICLK_P 37 GPIO33 38 GPIO38 43 GPIO46 52 XTAL_N 53 XTAL_P 54 MTMS 48 MTDO 45 U0TXD 49 VDD3P3_CPU 46 CHIP_PU 4 VDDA 55 MTDI 47 GPIO8 13 GPIO9 14 GPIO21 27 SPICS1 28 SPIHD 30 GPIO34 39 GPIO35 40 GPIO36 41 U0RXD 50 GPIO45 51 GPIO37 42 MTCK 44 R1 10K(NC) R4 0 C2 10nF C10 0.1uF Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C5 TBD L1 2.0nH(0.1nH) C12 TBD L2 TBD C6 10uF C15 0.1uF C7 1uF Figure 8-1. ESP32-S3-MINI-1 Schematics Espressif Systems 40 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 8 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. R4 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-S3-MINI-1U(pin-out) NC: No component. 50 ohm Impedance Control GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO26 GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO46 U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU RF_ANT LNA_IN CHIP_PU GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO47 GPIO48 GPIO21 GPIO47 GPIO48 GPIO45 VDD33 GND VDD33 GND GND VDD33 GND GND VDD33 GND GND GND GND GND VDD33 GND GND GND GND GND GND GND VDD_SPI VDD33 GND GND GND GND VDD33 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-MINI-1U> A4 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-MINI-1U> A4 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S3-MINI-1U> A4 2 2Wednesday, November 22, 2023 1.1 C9 0.1uF U2 ESP32-S3-MINI-1U GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 IO47 27 EPAD 61 GND 2 GND 62 IO48 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C1 TBD C3 1uF C4 TBD C8 0.1uF R3 499 C14 1uF U1 ESP32-S3FN8 VDDA 56 LNA_IN 1 VDD3P3 2 VDD3P3 3 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 GPIO17 23 GPIO18 24 GPIO19 25 GPIO20 26 VDD_SPI 29 SPIWP 31 SPICS0 32 SPIQ 34 SPID 35 SPICLK 33 SPICLK_N 36 GND 57 SPICLK_P 37 GPIO33 38 GPIO38 43 GPIO46 52 XTAL_N 53 XTAL_P 54 MTMS 48 MTDO 45 U0TXD 49 VDD3P3_CPU 46 CHIP_PU 4 VDDA 55 MTDI 47 GPIO8 13 GPIO9 14 GPIO21 27 SPICS1 28 SPIHD 30 GPIO34 39 GPIO35 40 GPIO36 41 U0RXD 50 GPIO45 51 GPIO37 42 MTCK 44 C11 TBD C13 0.1uF D1 ESD R1 10K(NC) R4 0 Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C10 0.1uF C2 10nF L1 2.0nH(0.1nH) C12 TBD L2 TBD C6 10uF C15 0.1uF ANT1 CONN 1 4 2 3 C7 1uF Figure 8-2. ESP32-S3-MINI-1U Schematics Espressif Systems 41 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. X1: ESR = Max. 70 KΩ EN IO42 IO41 IO37 IO36 IO38 IO40 IO39 RXD0 TXD0 IO35 TMS TDI TDO TCK IO6 IO7 IO9 IO10 IO11 USB_D+ IO3 IO5 IO20 IO19 USB_D- IO46 IO8 IO12 IO13 IO14 IO21 IO48 IO47 IO0 IO1 IO2 IO4 IO26 IO33 IO34 EN IO45 IO17 IO18 IO15 IO16 GND GND GND VDD33 GND GND GND VDD33 GNDGND GND GND GND GND C3 0.1uF JP4 Boot Option 1 1 2 2 SW1 R2 NC R7 0 R6 0R5 0(NC) C7 12pF(NC) C2 TBD R4 0 X1 32.768KHz(NC) 12 R3 0(NC) C5 TBD U1 ESP32-S3-MINI-1/ESP32-S3-MINI-1U GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 IO47 27 EPAD 61 GND 2 GND 62 IO48 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 R1 TBD JP1 UART 1 1 2 2 3 3 4 4 C1 22uF C8 0.1uF JP3 USB OTG 1 1 2 2 JP2 JTAG 1 1 2 2 3 3 4 4 C4 12pF(NC) C6 TBD Figure 9-1. Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence timing diagram, please refer Section 4.5 Chip Power-up and Reset. Espressif Systems 42 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 20.5±0.2 0.815.4±0.2 Top view Side view 2.4±0.15 14 13.55 0.7 0.5 Ø0.5 Unit: mm 5.05 4.5 15.4±0.2 0.815.4±0.2 Top view Side view Bottom view 4.5 0.6 0.6 1.2 1.2 1.7 11.9 14 1.7 11.9 14 2.4±0.15 3.2 0.5 0.7 1.6 0.85 13.55 14 60 x 0.4 x 0.8 4 x 0.8 x 0.8 Unit: mm ESP32-S3-MINI-1U Dimensions 0.85 7.7 4.5 Bottom view 4.5 7.7 0.6 0.6 1.2 1.2 1.7 14 1.7 14 60 x 0.4 x 0.8 11.9 4 x 0.8 x 0.8 11.9 0.85 Figure 10-1. ESP32-S3-MINI-1 Physical Dimensions 20.5±0.2 0.815.4±0.2 Top view Side view 2.4±0.15 14 13.55 0.7 0.5 Ø0.5 Unit: mm 5.05 4.5 15.4±0.2 0.815.4±0.2 Top view Side view Bottom view 4.5 0.6 0.6 1.2 1.2 1.7 11.9 14 1.7 11.9 14 2.4±0.15 3.2 0.5 0.7 1.6 0.85 13.55 14 60 x 0.4 x 0.8 4 x 0.8 x 0.8 Unit: mm ESP32-S3-MINI-1U Dimensions 0.85 7.7 4.5 Bottom view 4.5 7.7 0.6 0.6 1.2 1.2 1.7 14 1.7 14 60 x 0.4 x 0.8 11.9 4 x 0.8 x 0.8 11.9 0.85 Figure 10-2. ESP32-S3-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to ESP32-S3 Module Packaging Information. Espressif Systems 43 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP32-S3-MINI-1U uses the third generation external antenna connector as shown in Figure 10-3 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 10-3. Dimensions of External Antenna Connector The external antenna used for ESP32-S3-MINI-1U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance Espressif Systems 44 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 10 Physical Dimensions • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 10-3 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 45 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11-1 ESP32-S3-MINI-1 Recommended PCB Land Pattern and Figure 11-2 ESP32-S3-MINI-1U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11-1 and Figure 11-2. You can view the source files for ESP32-S3-MINI-1 and ESP32-S3-MINI-1U with Autodesk Viewer. • 3D models of ESP32-S3-MINI-1 and ESP32-S3-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 14 4.5 1.7 1.2 1.7 11.9 11.9 20.5 1.2 15.4 0.6 0.6 14 Antenna Area Pin 1 5.05 60 x 0.4 x 0.8 4 x 0.8 x 0.8 Unit: mm Pad Via for thermal pad Unit: mm Pad Via for thermal pad ESP32-S3-MINI-1U Land Pattern 4.5 14 4.5 1.7 1.2 1.7 11.9 11.9 15.4 1.2 15.4 0.6 0.6 14 Pin 1 60 x 0.4 x 0.8 4 x 0.8 x 0.8 4.5 7.7 0.85 7.7 0.85 Figure 11-1. ESP32-S3-MINI-1 Recommended PCB Land Pattern Espressif Systems 46 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 11 PCB Layout Recommendations 14 4.5 1.7 1.2 1.7 11.9 11.9 20.5 1.2 15.4 0.6 0.6 14 Antenna Area Pin 1 5.05 60 x 0.4 x 0.8 4 x 0.8 x 0.8 Unit: mm Pad Via for thermal pad Unit: mm Pad Via for thermal pad ESP32-S3-MINI-1U Land Pattern 4.5 14 4.5 1.7 1.2 1.7 11.9 11.9 15.4 1.2 15.4 0.6 0.6 14 Pin 1 60 x 0.4 x 0.8 4 x 0.8 x 0.8 4.5 7.7 0.85 7.7 0.85 Figure 11-2. ESP32-S3-MINI-1U Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32-S3 Hardware Design Guidelines > Section General Principles of PCB Layout for Modules. Espressif Systems 47 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 12-1. Reflow Profile Espressif Systems 48 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 49 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 50 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware. • ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals. • ESP32-S3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S3 into your hardware product. • ESP32-S3 Series SoC Errata – Descriptions of known errors in ESP32-S3 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-S3 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-S3 • ESP32-S3 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-S3 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-S3 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • ESP-FAQ – A summary document of frequently asked questions released by Espressif. https://espressif.com/projects/esp-faq/en/latest/index.html • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs. https://espressif.com/en/products/socs?id=ESP32-S3 • ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules. https://espressif.com/en/products/modules?id=ESP32-S3 • ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits. https://espressif.com/en/products/devkits?id=ESP32-S3 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 51 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Revision History Revision History Date Version Release notes 2025-11-18 v1.6 • Added Table 6-5 Current Consumption for Bluetooth LE in Active Mode 2025-07-25 v1.5 • Added Section 4.5 Chip Power-up and Reset • Added Section 6.5 Memory Specifications • Added the external antenna information for certification in Section 10.2 Di- mensions of External Antenna Connector • Added Section Datasheet Versioning • Other minor changes 2025-06-10 v1.4 • Added a note about the pin mapping between the chip and the in-package flash/PSRAN in Section 2 Block Diagram 2024-11-14 v1.3 • Added flash memory program/erase cycle and data retention details in the table note of Table 1-1 ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison and added a reference to the chip revision information in the following note in Section 1.2 Series Comparison • Updated Section 1.3 Applications • Restructured the previous Section Strapping Pins as Section 4 Boot Con- figurations • Added Section 5.2 Peripheral Description • Divided Section Electrical Characteristics into Section 6 Electrical Character- istics and Section 7 RF Characteristics with updated formatting and wording • Divided Section Physical Dimensions and PCB Land Pattern into Section 10 Physical Dimensions and 11 PCB Layout Recommendations and added Section 11.2 Module Placement for PCB Design • Added the 3D model link of ESP32-S3-MINI-1U in Section 11.1 PCB Land Pattern • Updated Figure 12-1 Reflow Profile • Other minor updates to formatting and wording 2023-11-24 v1.2 • Removed the table note about ESP32-S3FH4R2 sample status from Ta- ble 1-1 ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison and added the second table note • Updated Section 4.1 Chip Boot Mode Control • Updated the module schematics in Section 8 Module Schematics • Updated the physical dimensions figure in Section 10.1 Module Dimensions • Updated the recommended PCB land pattern figure in Section 11.1 PCB Land Pattern • Other minor updates Cont’d on next page Espressif Systems 52 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Revision History Cont’d from previous page Date Version Release notes 2023-03-07 v1.1 • Remove module variants ESP32-S3-MINI-1-H4R2 and ESP32-S3-MINI- 1U-H4R2 • Update the descriptions and Table 1-1 ESP32-S3-MINI-1 and ESP32-S3- MINI-1U Series Comparison in Section 1.2 Series Comparison • Update Section Strapping Pins • Update Section 6.4 Current Consumption Characteristics • Update the minimum value of RF transmit power in Section 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics • Update descriptions in Section 9 Peripheral Schematics • Add descriptions in Section 11.1 PCB Land Pattern • Update Section 12.4 • Other minor updates 2022-05-24 v1.0 • Update information about flash and PSRAM on the title page and in Section 1.1 • Add certification and test information • Add information of new module variants and their ambient operating tem- perature versions in Table 1-1 • Add the second note in Table 3-1 • Update Section Strapping Pins • Add notes in Table 6-7 • Update Bluetooth LE RF data • Update module schematics in Section 8 • Other minor updates 2021-11-16 v0.6 Overall update for chip revision 1 2021-03-30 v0.1 Preliminary release, for chip revision 0 Espressif Systems 53 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.6 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com