1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 VDD_SPI Voltage Control 4.3 ROM Messages Printing Control 4.4 Chip Power-up and Reset 5 Electrical Characteristics 5.1 Absolute Maximum Ratings 5.2 Recommended Operating Conditions 5.3 DC Characteristics (3.3 V, 25 °C) 5.4 Current Consumption Characteristics 5.4.1 Current Consumption in Active Mode 5.4.2 Current Consumption in Other Modes 5.5 Memory Specifications 6 RF Characteristics 6.1 Wi-Fi Radio 6.1.1 Wi-Fi RF Standards 6.1.2 Wi-Fi RF Transmitter (TX) Specifications 6.1.3 Wi-Fi RF Receiver (RX) Specifications 7 Module Schematics 8 Peripheral Schematics 9 Physical Dimensions 9.1 Module Dimensions 9.2 Dimensions of External Antenna Connector 10 PCB Layout Recommendations 10.1 PCB Land Pattern 10.2 Module Placement for PCB Design 11 Product Handling 11.1 Storage Conditions 11.2 Electrostatic Discharge (ESD) 11.3 Soldering Profiles 11.3.1 Reflow Profile 11.3.2 Wave Profile 11.4 Ultrasonic Vibration Datasheet Versioning Related Documentation and Resources Revision History ESP32-S2-MINI-2 ESP32-S2-MINI-2U Datasheet Version 1.4 2.4 GHz Wi-Fi (802.11 b/g/n) module Built around ESP32-S2 series of SoC (chip revision v1.0), Xtensa ® single-core 32-bit LX7 mi- croprocessor 4 MB flash and optional 2 MB PSRAM in chip package 37 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector ESP32-S2-MINI-2 ESP32-S2-MINI-2U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/documentation/esp32-s2-mini-2_esp32-s2-mini-2u_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-S2FH4 or ESP32-S2FN4R2 embedded, Xtensa ® single-core 32-bit LX7 microprocessor, up to 240 MHz • 128 KB ROM • 320 KB SRAM • 16 KB SRAM in RTC • 4 MB flash • 2 MB PSRAM (ESP32-S2FN4R2 only) Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support • Center frequency range of operating channel: 2412 ~ 2484 MHz Peripherals • Up to 37 GPIOs • SPI, LCD, UART, I2C, I2S, Camera interface, IR, pulse counter, LED PWM, TWAI ® (compatible with ISO 11898-1, i.e. CAN Specification 2.0), full-speed USB OTG, ADC, DAC, touch sensor, temperature sensor, general-purpose timers, watchdog timers Note: * Please refer to ESP32-S2 Series Datasheet for detailed information about the module peripherals. Integrated Components on Module • 40 MHz crystal oscillator Antenna Options • ESP32-S2-MINI-2: On-board PCB antenna • ESP32-S2-MINI-2U: External antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: –40 ~ 85 °C Certification • Green certification: RoHS/REACH • RF certification: See certificates Test • HTOL/HTSL/uHAST/TCT/ESD/Latch-up 1.2 Series Comparison ESP32-S2-MINI-2 and ESP32-S2-MINI-2U are two powerful, generic Wi-Fi MCU modules that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as wearable electronics and smart home. Espressif Systems 2 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 1 Module Overview ESP32-S2-MINI-2 comes with a PCB antenna (ANT). ESP32-S2-MINI-2U comes with an external antenna connector (CONN). A wide selection of module variants are available. The variant nomenclature is shown in Figure 1-1, and the series comparisons are listed in Table 1-1 and Table 1-2. The nomenclature for the module variants is as follows: ESP32-S2 -XX-XX H/N x R Flash size (MB) Ambient temperature (℃) H：-40 ~ 105 N：-40 ~ 85 Module name x PSRAM size (MB) PSRAM (optional) Figure 1-1. ESP32-S2 Module Variant Nomenclature Espressif Systems 3 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 1 Module Overview Table 1-1. ESP32-S2-MINI-2 (ANT) Series Comparison Ambient Temp. 1 Size 2 Part Number Flash 3 PSRAM 3 (°C) (mm) ESP32-S2-MINI-2-N4 4 MB (Quad SPI) — –40 ∼ 85 15.4 × 20.5 × 2.4 ESP32-S2-MINI-2-N4R2 2 MB (Quad SPI) 1 Ambient temperature specifies the recommended temperature range of the environment immediately out- side the Espressif module. 2 For details, refer to Section 9.1 Module Dimensions. 3 For specifications, refer to Section 5.5 Memory Specifications. Table 1-2. ESP32-S2-MINI-2U (CONN) Series Comparison 4 Ambient Temp. Size Part Number Flash PSRAM (°C) (mm) ESP32-S2-MINI-2U-N4 4 MB (Quad SPI) — –40 ∼ 85 15.4 × 15.4 × 2.4 ESP32-S2-MINI-2U-N4R2 2 MB (Quad SPI) 4 This table shares the same notes presented in Table 1-1 above. In this datasheet unless otherwise stated, ESP32-S2-MINI-2 refers to all variants of ESP32-S2-MINI-2, whereas ESP32-S2-MINI-2U refers to all variants of ESP32-S2-MINI-2U. At the core of the modules is ESP32-S2 series. ESP32-S2 series of chips has an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. It has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. Note: For more information on ESP32-S2, please refer to ESP32-S2 Series Datasheet. For chip revision identification, ESP-IDF release that supports a specific chip revision, and other information on chip revisions, please refer to ESP32-S2 Series SoC Errata > Section Chip Revision. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Audio Devices • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers • Cameras for Video Streaming • USB Devices • Speech Recognition • Image Recognition • Wi-Fi + Bluetooth Networking Card • Touch and Proximity Sensing Espressif Systems 4 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 2 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 11 4 Boot Configurations 13 4.1 Chip Boot Mode Control 14 4.2 VDD_SPI Voltage Control 14 4.3 ROM Messages Printing Control 15 4.4 Chip Power-up and Reset 15 5 Electrical Characteristics 17 5.1 Absolute Maximum Ratings 17 5.2 Recommended Operating Conditions 17 5.3 DC Characteristics (3.3 V, 25 °C) 17 5.4 Current Consumption Characteristics 18 5.4.1 Current Consumption in Active Mode 18 5.4.2 Current Consumption in Other Modes 18 5.5 Memory Specifications 19 6 RF Characteristics 21 6.1 Wi-Fi Radio 21 6.1.1 Wi-Fi RF Standards 21 6.1.2 Wi-Fi RF Transmitter (TX) Specifications 21 6.1.3 Wi-Fi RF Receiver (RX) Specifications 22 7 Module Schematics 24 8 Peripheral Schematics 26 9 Physical Dimensions 27 9.1 Module Dimensions 27 9.2 Dimensions of External Antenna Connector 29 10 PCB Layout Recommendations 31 10.1 PCB Land Pattern 31 10.2 Module Placement for PCB Design 32 Espressif Systems 5 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 Contents 11 Product Handling 33 11.1 Storage Conditions 33 11.2 Electrostatic Discharge (ESD) 33 11.3 Soldering Profiles 33 11.3.1 Reflow Profile 33 11.3.2 Wave Profile 34 11.4 Ultrasonic Vibration 34 Datasheet Versioning 35 Related Documentation and Resources 36 Revision History 37 Espressif Systems 6 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 List of Tables List of Tables 1-1 ESP32-S2-MINI-2 (ANT) Series Comparison 4 1-2 ESP32-S2-MINI-2U (CONN) Series Comparison 4 4 3-1 Pin Definitions 11 4-1 Default Configuration of Strapping Pins 13 4-2 Description of Timing Parameters for the Strapping Pins 14 4-3 Chip Boot Mode Control 14 4-4 VDD_SPI Voltage Control 15 4-5 UART ROM Message Printing Control 15 4-6 Description of Timing Parameters for Power-up and Reset 16 5-1 Absolute Maximum Ratings 17 5-2 Recommended Operating Conditions 17 5-3 DC Characteristics (3.3 V, 25 °C) 17 5-4 RF Current Consumption in Active Mode 18 5-5 Current Consumption in Modem-sleep Mode 19 5-6 Current Consumption in Low-Power Modes 19 5-7 Flash Specifications 19 5-8 PSRAM Specifications 20 6-1 Wi-Fi RF Standards 21 6-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 21 6-3 TX EVM Test 22 6-4 RX Sensitivity 22 6-5 Maximum RX Level 23 6-6 RX Adjacent Channel Rejection 23 Espressif Systems 7 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 List of Figures List of Figures 1-1 ESP32-S2 Module Variant Nomenclature 3 2-1 ESP32-S2-MINI-2 Block Diagram 9 2-2 ESP32-S2-MINI-2U Block Diagram 9 3-1 ESP32-S2-MINI-2 Pin Layout (Top View) 10 4-1 Visualization of Timing Parameters for the Strapping Pins 14 4-2 Visualization of Timing Parameters for Power-up and Reset 16 7-1 ESP32-S2-MINI-2 Schematics 24 7-2 ESP32-S2-MINI-2U Schematics 25 8-1 Peripheral Schematics 26 9-1 ESP32-S2-MINI-2 Physical Dimensions 27 9-2 ESP32-S2-MINI-2U Physical Dimensions 28 9-3 Dimensions of External Antenna Connector 29 10-1 ESP32-S2-MINI-2 Recommended PCB Land Pattern 31 10-2 ESP32-S2-MINI-2U Recommended PCB Land Pattern 32 11-1 Reflow Profile 33 11-2 Wave Soldering Profile 34 Espressif Systems 8 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 2 Block Diagram 2 Block Diagram FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 RF Matching 40 MHz Crystal ESP32-S2-MINI-2 GPIOs Antenna PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 40 MHz Crystal ESP32-S2-MINI-2U GPIOs PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 2-1. ESP32-S2-MINI-2 Block Diagram FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 RF Matching 40 MHz Crystal ESP32-S2-MINI-2 GPIOs Antenna PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 40 MHz Crystal ESP32-S2-MINI-2U GPIOs PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 2-2. ESP32-S2-MINI-2U Block Diagram Note: For the pin mapping between the chip and the in-package flash/PSRAM, please refer to ESP32-S2 Series Datasheet > Table Pin Mapping Between Chip and In-package Flash/PSRAM . Espressif Systems 9 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 9.1 Module Dimensions. Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 Pin 63 GND IO12 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 64 GND Pin 31 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 NC IO33 IO34 GND Pin 32 Pin 33 Pin 34 Pin 35 Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 65 GND Pin 62 GND Pin 46 Pin 47 Pin 48 Pin 49 Pin 50 Pin 51 Pin 52 Pin 53 Pin 54 Pin 55 Pin 56 Pin 57 Pin 58 Pin 59 Pin 60 Pin 61 GND GND GND GND GNDGND GND GND GND IO35 IO36 IO37 IO38 IO39 IO40 IO41 IO42 TXD0 RXD0 IO45 GND GND IO46 EN GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Keepout Zone A Figure 3-1. ESP32-S2-MINI-2 Pin Layout (Top View) Note A: The zone marked with dotted lines is the antenna keepout zone. The pin diagram is applicable to ESP32-S2-MINI-2 and ESP32-S2-MINI-2U, but the latter has no antenna keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP32-S2 Hardware Design Guidelines > Section General Principles of PCB Layout for Modules. Espressif Systems 10 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 3 Pin Definitions 3.2 Pin Description The module has 65 pins. See pin definitions in Table 3-1 Pin Definitions. For peripheral pin configurations, please refer to ESP32-S2 Series Datasheet > Section Peripheral Pin Configurations. Table 3-1. Pin Definitions Name No. Type 1 Function GND 1, 2, 30, 42, 43, 46-65 P Ground 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0, GPIO0 IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6 IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7 IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD IO10 14 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 IO11 15 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 IO12 16 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 IO13 17 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 IO14 18 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1 IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D- IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ IO21 25 I/O/T RTC_GPIO21, GPIO21 IO26 2 26 I/O/T SPICS1, GPIO26 NC 27 — NC IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0 IO35 31 I/O/T SPIIO6, GPIO35, FSPID IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ IO38 34 I/O/T GPIO38, FSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 3 Pin Definitions Table 3-1 – cont’d from previous page Name No. Type 1 Function IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 IO46 44 I GPIO46 EN 45 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. 1 P: power supply; I: input; O: output; T: high impedance. 2 IO26 is used by the embedded PSRAM on the ESP32-S2-MINI-2-N4R2 and ESP32-S2-MINI-2U-N4R2 modules, and cannot be used for other purposes. Espressif Systems 12 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32-S2 Series Datasheet > Section Boot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter 7 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse parameters at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pins: GPIO0 and GPIO46 • VDD_SPI voltage – Strapping pin: GPIO45 – eFuse parameters: EFUSE_VDD_SPI_FORCE and EFUSE_VDD_SPI_TIEH • ROM message printing – Strapping pin: GPIO46 – eFuse parameters: EFUSE_UART_PRINT_CONTROL and EFUSE_UART_PRINT_CHANNEL The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer to ESP32-S2 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4-1. Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Weak pull-up 1 GPIO45 Weak pull-down 0 GPIO46 Weak pull-down 0 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-S2 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 4-2 and Figure 4-1. Espressif Systems 13 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 4 Boot Configurations Table 4-2. Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_PU pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. 3 Strapping pin V IH_nRST V IH t SU t H CHIP_PU Figure 4-1. Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO0 and GPIO46 control the boot mode after the reset is released. See Table 4-3 Chip Boot Mode Control. Table 4-3. Chip Boot Mode Control Boot Mode GPIO0 GPIO46 SPI boot mode 1 Any value Joint download boot mode 2 0 0 1 Bold marks the default value and configuration. 2 Joint Download Boot mode supports the following download methods: • USB-OTG Download Boot • UART Download Boot • SPI Download Boot 4.2 VDD_SPI Voltage Control Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways. Espressif Systems 14 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 4 Boot Configurations Table 4-4. VDD_SPI Voltage Control VDD_SPI power source 2 Voltage EFUSE_VDD_SPI_FORCE GPIO45 EFUSE_VDD_SPI_TIEH VDD3P3_RTC via R SP I 3.3 V 0 0 Ignored 1 Ignored 1 Flash Voltage Regulator 1.8 V 0 1 Ignored 1 Ignored 0 1 Bold marks the default value and configuration. 2 See ESP32-S2 Series Datasheet > Section Power Scheme . 4.3 ROM Messages Printing Control During the boot process, the messages by the ROM code can be printed to: • (Default) UART0 • UART1 EFUSE_UART_PRINT_CONTROL and GPIO46 control ROM messages printing to UART as shown in Table 4-5 UART ROM Message Printing Control. EFUSE_UART_PRINT_CHANNEL controls if the ROM messages will be printed to UART0 or UART1. • 0: UART0 • 1: UART1 Table 4-5. UART ROM Message Printing Control UART ROM Code Printing EFUSE_UART_PRINT_CONTROL GPIO46 Enabled 0 Ignored 1 0 2 1 Disabled 1 1 2 0 3 Ignored 1 Bold marks the default value and configuration. 4.4 Chip Power-up and Reset Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, CHIP_PU – the pin used for power-up and reset – is pulled high to activate the chip. For information on CHIP_PU as well as power-up and reset timing, see Figure 4-2 and Table 4-6. Espressif Systems 15 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 4 Boot Configurations V IL_nRST t ST BL t RST 2.8 V VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_RTC_IO, VDD3P3_CPU CHIP_PU Figure 4-2. Visualization of Timing Parameters for Power-up and Reset Table 4-6. Description of Timing Parameters for Power-up and Reset Parameter Description Min (µs) t ST BL Time reserved for the power rails of VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_RTC_IO, and VDD3P3_CPU to stabilize before the CHIP_PU pin is pulled high to activate the chip 50 t RST Time reserved for CHIP_PU to stay below V IL_nRST to reset the chip (see Table 5-3) 50 Espressif Systems 16 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 5 Electrical Characteristics 5 Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses above those listed in Table 5-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 5-2 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 5-1. Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST OR E Storage temperature –40 105 °C 5.2 Recommended Operating Conditions Table 5-2. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature 85 °C version –40 — 85 °C 105 °C version 105 5.3 DC Characteristics (3.3 V, 25 °C) Table 5-3. DC Characteristics (3.3 V, 25 °C) Parameter Description Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Internal weak pull-up resistor — 45 — kΩ R P D Internal weak pull-down resistor — 45 — kΩ Espressif Systems 17 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 5 Electrical Characteristics V IH_nRST Chip reset release voltage (CHIP_PU voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage (CHIP_PU voltage is within the specified range) –0.3 — 0.25 × VDD 1 V 1 VDD – voltage from a power pin of a respective power domain. 2 V OH and V OL are measured using high-impedance load. 5.4 Current Consumption Characteristics Owing to the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-S2 Series Datasheet. 5.4.1 Current Consumption in Active Mode Table 5-4. RF Current Consumption in Active Mode Work mode Description Peak (mA) Active (RF working) TX 802.11b, 20 MHz, 1 Mbps, @19 dBm 302 802.11g, 20 MHz, 54 Mbps, @17.5 dBm 264 802.11n, 20 MHz, MCS7, @16.5 dBm 257 802.11n, 40 MHz, MCS7, @16.5 dBm 267 RX 802.11b/g/n, 20 MHz 77 802.11n, 40 MHz 81 1 The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters’ measurements are based on 100% duty cycle. 2 The current consumption figures in RX mode are for cases where the peripherals are disabled and the CPU idle. Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP32-S2 Series Datasheet. 5.4.2 Current Consumption in Other Modes The measurements below are applicable to ESP32-S2, ESP32-S2FH2, and ESP32-S2FH4. Since ESP32-S2FN4R2 and ESP32-S2R2 come with in-package PSRAM, their current consumption might be higher. Espressif Systems 18 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 5 Electrical Characteristics Table 5-5. Current Consumption in Modem-sleep Mode Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA) 1 Modem-sleep 2,3 240 CPU is idle 20.0 28.0 CPU is running 23.0 32.0 160 CPU is idle 14.0 21.0 CPU is running 16.0 24.0 80 CPU is idle 10.5 18.4 CPU is running 12.0 20.0 1 In practice, the current consumption might be different depending on which peripherals are enabled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 5-6. Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep 1 VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance 750 Deep-sleep The ULP co-processor is powered on 2 ULP-FSM 170 ULP-RISC-V 190 ULP sensor-monitored pattern 3 22 RTC timer + RTC memory 25 RTC timer only 20 Power off CHIP_PU is set to low level, the chip is powered off 1 1 In Light-sleep mode, with all related SPI pins pulled up, the current consumption of the embedded PSRAM is 140 µA. Chip variants with in-package PSRAM include ESP32-S2FN4R2 and ESP32-S2R2. 2 During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to operate. 3 The “ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodically. When touch sensors work with a duty cycle of 1%, the typical current consumption is 22 µA. 5.5 Memory Specifications The data below is sourced from the memory vendor datasheet. These values are guaranteed through design and/or characterization but are not fully tested in production. Devices are shipped with the memory erased. Table 5-7. Flash Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.65 1.80 2.00 V Cont’d on next page Espressif Systems 19 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 5 Electrical Characteristics Table 5-7 – cont’d from previous page Parameter Description Min Typ Max Unit Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz — Program/erase cycles 100,000 — — cycles T RET Data retention time 20 — — years T P P Page program time — 0.8 5 ms T SE Sector erase time (4 KB) — 70 500 ms T BE1 Block erase time (32 KB) — 0.2 2 s T BE2 Block erase time (64 KB) — 0.3 3 s T CE Chip erase time (16 Mb) — 7 20 s Chip erase time (32 Mb) — 20 60 s Chip erase time (64 Mb) — 25 100 s Chip erase time (128 Mb) — 60 200 s Chip erase time (256 Mb) — 70 300 s Table 5-8. PSRAM Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.62 1.80 1.98 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz Espressif Systems 20 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 6 RF Characteristics 6 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 6.1 Wi-Fi Radio 6.1.1 Wi-Fi RF Standards Table 6-1. Wi-Fi RF Standards Name Description Center frequency range of operating channel 1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n Data rate 20 MHz 802.11b: 1, 2, 5.5 and 11 Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n: MCS0-7, 72.2 Mbps (Max) 40 MHz 802.11n: MCS0-7, 150 Mbps (Max) Antenna type PCB antenna, external antenna connector 1 Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency range is configurable by software. See ESP RF Test Tool and Test Guide for instructions. 2 For the modules that use external antenna connectors, the output impedance is 50 Ω. For other modules without external antenna connectors, the output impedance is irrelevant. 6.1.2 Wi-Fi RF Transmitter (TX) Specifications Target TX power is configurable based on device or certification requirements. The default characteristics are provided in Table 6-2. Table 6-2. TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 19.0 — 802.11b, 11 Mbps — 19.0 — 802.11g, 6 Mbps — 17.5 — Cont’d on next page Espressif Systems 21 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 6 RF Characteristics Table 6-2 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11g, 54 Mbps — 17.5 — 802.11n, HT20, MCS0 — 17.5 — 802.11n, HT20, MCS7 — 16.5 — 802.11n, HT40, MCS0 — 17.5 — 802.11n, HT40, MCS7 — 16.5 — Table 6-3. TX EVM Test Min Typ SL 1 Rate (dB) (dB) (dB) 802.11b, 1 Mbps, @19 dBm — –25.0 –10 802.11b, 11 Mbps, @19 dBm — –25.0 –10 802.11g, 6 Mbps, @17.5 dBm — –25.0 –5 802.11g, 54 Mbps, @17.5 dBm — –28.5 –25 802.11n, HT20, MCS0, @17.5 dBm — –27.0 –5 802.11n, HT20, MCS7, @16.5 dBm — –30.0 –27 802.11n, HT40, MCS0, @17.5 dBm — –27.0 –5 802.11n, HT40, MCS7, @16.5 dBm — –30.0 –27 1 SL stands for standard limit value. 6.1.3 Wi-Fi RF Receiver (RX) Specifications Table 6-4. RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –96.5 — 802.11b, 2 Mbps — –94.0 — 802.11b, 5.5 Mbps — –91.5 — 802.11b, 11 Mbps — –88.0 — 802.11g, 6 Mbps — –92.0 — 802.11g, 9 Mbps — –90.5 — 802.11g, 12 Mbps — –89.0 — 802.11g, 18 Mbps — –87.0 — 802.11g, 24 Mbps — –84.0 — 802.11g, 36 Mbps — –80.0 — 802.11g, 48 Mbps — –76.0 — 802.11g, 54 Mbps — –74.5 — 802.11n, HT20, MCS0 — –91.5 — 802.11n, HT20, MCS1 — –88.5 — 802.11n, HT20, MCS2 — –86.0 — Cont’d on next page Espressif Systems 22 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 6 RF Characteristics Table 6-4 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11n, HT20, MCS3 — –83.0 — 802.11n, HT20, MCS4 — –79.0 — 802.11n, HT20, MCS5 — –75.0 — 802.11n, HT20, MCS6 — –73.5 — 802.11n, HT20, MCS7 — –72.0 — 802.11n, HT40, MCS0 — –89.0 — 802.11n, HT40, MCS1 — –86.0 — 802.11n, HT40, MCS2 — –83.5 — 802.11n, HT40, MCS3 — –79.5 — 802.11n, HT40, MCS4 — –76.0 — 802.11n, HT40, MCS5 — –72.0 — 802.11n, HT40, MCS6 — –70.5 — 802.11n, HT40, MCS7 — –69.5 — Table 6-5. Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 5 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 5 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 5 — Table 6-6. RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 13 — 802.11n, HT40, MCS0 — 19 — 802.11n, HT40, MCS7 — 8 — Espressif Systems 23 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 7 Module Schematics 7 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. ESP32-S2FN4R2 ESP32-S2FH4 The values of C11, L2 and C12 vary with the actual PCB board. ESP32-S2-MINI-2(pin-out) GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO26 RF_ANT GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO45 GPIO46 CHIP_PU U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU LNA_IN VDD33 GND VDD33 GND GND GND GNDGND GND GND VDD33 VDD33 GND GNDGND VDD33 GND GND VDD33 GND VDD33 GND GND GND GND GND GND GND VDD_SPI GND GND VDD33 Title Size Page Name Re v Date: Sheet o f Proprietary <02_ESP32-S2-MINI-2> V1.0 A4 2 2Friday, February 25, 2022 Title Size Page Name Re v Date: Sheet o f Proprietary <02_ESP32-S2-MINI-2> V1.0 A4 2 2Friday, February 25, 2022 Title Size Page Name Re v Date: Sheet o f Proprietary <02_ESP32-S2-MINI-2> V1.0 A4 2 2Friday, February 25, 2022 U2 ESP32-S2-MINI-2 GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND 2 GND 62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 TBD R3 499 C14 1uF C13 0.1uF U1 VDDA 1 LNA_IN 2 VDD3P3 3 VDD3P3 4 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 DAC_1 23 DAC_2 24 GPIO19 25 GPIO20 26 VDD_SPI 30 SPICS1 29 SPIWP 32 SPICS0 33 SPIQ 35 SPID 36 SPICLK 34 GPIO33 37 GND 57 GPIO34 38 GPIO35 39 MTCK 43 GPIO46 55 VDDA 51 XTAL_N 52 XTAL_P 53 MTMS 47 MTDO 44 U0TXD 48 VDD3P3_CPU 45 CHIP_PU 56 VDDA 54 MTDI 46 GPIO8 13 GPIO9 14 VDD3P3_RTC_IO 27 GPIO21 28 SPIHD 31 GPIO36 40 GPIO37 41 GPIO38 42 U0RXD 49 GPIO45 50 C9 100pF C3 1uF L1 2.0nH C6 10uF C2 100pF Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C10 0.1uF C12 TBD D1 ESD C7 1uF L2 TBD ANT1 PCB_ANT 1 2 C1 TBD C11 TBD C16 0.1uF C15 0.1uF R4 0 C5 0.1uF C8 0.1uF Figure 7-1. ESP32-S2-MINI-2 Schematics Espressif Systems 24 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 7 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. ESP32-S2FN4R2 ESP32-S2FH4 ESP32-S2-MINI-2U(pin-out) GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO26 RF_ANT GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO45 GPIO46 CHIP_PU U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU LNA_IN GND VDD33 GND GND GND GNDGND GND GND VDD33 VDD33 GND GNDGND VDD33 GND VDD33 GND VDD33GND GND GND GND GND GNDGND VDD_SPI GND GND GND VDD33 VDD33 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S2-MINI-1U> A4 2 2Monday, July 18, 2022 1.1 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S2-MINI-1U> A4 2 2Monday, July 18, 2022 1.1 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-S2-MINI-1U> A4 2 2Monday, July 18, 2022 1.1 U2 ESP32-S2-MINI-2U GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND 2 GND 62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 TBD R3 499 C14 1uF U1 VDDA 1 LNA_IN 2 VDD3P3 3 VDD3P3 4 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 DAC_1 23 DAC_2 24 GPIO19 25 GPIO20 26 VDD_SPI 30 SPICS1 29 SPIWP 32 SPICS0 33 SPIQ 35 SPID 36 SPICLK 34 GPIO33 37 GND 57 GPIO34 38 GPIO35 39 MTCK 43 GPIO46 55 VDDA 51 XTAL_N 52 XTAL_P 53 MTMS 47 MTDO 44 U0TXD 48 VDD3P3_CPU 45 CHIP_PU 56 VDDA 54 MTDI 46 GPIO8 13 GPIO9 14 VDD3P3_RTC_IO 27 GPIO21 28 SPIHD 31 GPIO36 40 GPIO37 41 GPIO38 42 U0RXD 49 GPIO45 50 C13 0.1uF C9 0.1uF C6 10uF L1 2.0nH C2 100pF C10 0.1uF Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 D1 ESD C12 TBD L2 TBD C7 1uF ANT1 CONN 1 4 2 3 C1 TBD C11 TBD C16 0.1uF C15 0.1uF R4 0 C3 1uF C8 0.1uF C5 0.1uF Figure 7-2. ESP32-S2-MINI-2U Schematics Espressif Systems 25 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 8 Peripheral Schematics 8 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. X1: ESR = Max. 70 KΩ EN IO4 IO5 IO6 IO7 IO14 IO8 IO13 IO12 IO17 EN IO46 IO45 TXD0 RXD0 TDI TDO TCK IO42 TMS IO39 IO41 IO40 IO38 IO37 IO36 IO35 IO15 IO16 IO18 IO9 IO10 IO11 IO3 IO2 IO1 IO0 IO34 IO33 IO26 IO21 IO19 IO20 USB_D- USB_D+ GND VDD33 GND GND GND GND GND VDD33 GND GND GNDGND GND GND C5 TBD R6 0 SW1 R1 TBD JP4 Boot Option 1 1 2 2 R7 0 X1 32.768kHz(NC) 12 JP3 USB OTG 1 1 2 2 R2 NC JP1 UART 1 1 2 2 3 3 4 4 R4 0 C3 0.1uF R3 0(NC) JP2 JTAG 1 1 2 2 3 3 4 4 C7 12pF(NC) U1 ESP32-S2-MINI-2/ESP32-S2-MINI-2U GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND 2 GND 62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 12pF(NC) R5 0(NC) C8 0.1uF C6 TBD C1 22uF C2 TBD Figure 8-1. Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32-S2 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to ESP32-S2 Series Datasheet > Section Power Scheme. Espressif Systems 26 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 9 Physical Dimensions 9 Physical Dimensions 9.1 Module Dimensions 4.5 20.5±0.15 0.815.4±0.15 Top view Side view Bottom view 2.4±0.15 4.5 14 13.55 15.45 0.6 0.6 1.2 1.2 10.6 11.5 12.3 13.2 14.8 10.6 11.5 12.3 13.2 14.8 0.7 0.5 Ø0.5 Unit: mm 5.05 Figure 9-1. ESP32-S2-MINI-2 Physical Dimensions Espressif Systems 27 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 9 Physical Dimensions 4.5 15.4±0.15 0.815.4±0.15 Top view Side view Bottom view 4.5 0.6 0.6 1.2 1.2 10.6 11.5 12.3 13.2 14.8 10.6 11.5 12.3 13.2 14.8 2.4±0.15 3.2 0.5 0.7 1.6 Unit: mm 0.85 13.55 14 Ø0.5 Figure 9-2. ESP32-S2-MINI-2U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to ESP32-S2 Module Packaging Information. Espressif Systems 28 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 9 Physical Dimensions 9.2 Dimensions of External Antenna Connector ESP32-S2-MINI-2U uses the third generation external antenna connector as shown in Figure 9-3 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 9-3. Dimensions of External Antenna Connector The external antenna used for ESP32-S2-MINI-2U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz & 5 GHz band • 50 Ω impedance Espressif Systems 29 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 9 Physical Dimensions • The maximum gain does not exceed 3.86 dBi (2.4 GHz) or 3.65 dBi (5 GHz), the gain of the antenna used for certification • The connector matches the specifications shown in Figure 9-3 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 30 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 10 PCB Layout Recommendations 10 PCB Layout Recommendations 10.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 10-1 ESP32-S2-MINI-2 Recommended PCB Land Pattern and Figure 10-2 ESP32-S2-MINI-2U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10-1 and Figure 10-2. You can view the source files for ESP32-S2-MINI-2 and ESP32-S2-MINI-2U with Autodesk Viewer. • 3D models of ESP32-S2-MINI-2 and ESP32-S2-MINI-2U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 12.3 4.5 10.6 13.2 1.2 4.5 10.6 11.5 11.5 20.5 1.2 15.4 0.6 0.6 14.8 13.2 12.3 14.8 Antenna Area Pin 1 Unit: mm : Pad 5.05 Figure 10-1. ESP32-S2-MINI-2 Recommended PCB Land Pattern Espressif Systems 31 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 10 PCB Layout Recommendations Unit: mm : Pad 12.3 4.5 10.6 15.4 13.2 1.2 4.5 10.6 11.5 11.5 1.2 15.4 0.6 0.6 14.8 13.2 12.3 14.8 Pin 1 Figure 10-2. ESP32-S2-MINI-2U Recommended PCB Land Pattern 10.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32-S2 Hardware Design Guidelines > Section General Principles of PCB Layout for Modules. Espressif Systems 32 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 11 Product Handling 11 Product Handling 11.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 11.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 11.3 Soldering Profiles 11.3.1 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 11-1. Reflow Profile Espressif Systems 33 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 11 Product Handling 11.3.2 Wave Profile 50 100 0 200150 250 Temperature (°C) Time (s) 80 Peak temperature: 230 – 260 °C Component Temperature Preheating Component temperature: 90 – 120 °C PCB soak time: 2 – 5 s PCB ramp-up rate: ≤ 5 °C/s Soldering Solder point temperature: 245 ± 10 °C Cooling Exit temperature: ＜ 100 °C Solder Point Temperature 150 200 250 120 50 160 260 90 230 100 Figure 11-2. Wave Soldering Profile 11.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 34 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 35 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32-S2 Series Datasheet – Specifications of the ESP32-S2 hardware. • ESP32-S2 Technical Reference Manual – Detailed information on how to use the ESP32-S2 memory and peripherals. • ESP32-S2 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S2 into your hardware product. • ESP32-S2 Series SoC Errata – Descriptions of known errors in ESP32-S2 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-S2 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-S2 • ESP32-S2 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-S2 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-S2 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • ESP-FAQ – A summary document of frequently asked questions released by Espressif. https://espressif.com/projects/esp-faq/en/latest/index.html • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-S2 Series SoCs – Browse through all ESP32-S2 SoCs. https://espressif.com/en/products/socs?id=ESP32-S2 • ESP32-S2 Series Modules – Browse through all ESP32-S2-based modules. https://espressif.com/en/products/modules?id=ESP32-S2 • ESP32-S2 Series DevKits – Browse through all ESP32-S2-based devkits. https://espressif.com/en/products/devkits?id=ESP32-S2 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 36 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 Revision History Revision History Date Version Release notes 2026-03-02 v1.4 • Updated “Ordering Code” to “Part Number” 2025-11-24 v1.3 • Added Section 4.4 Chip Power-up and Reset • Added Section 5.5 Memory Specifications • Added Section 11.4 Datasheet Versioning • Upgraded document template 2025-11-07 v1.2 • In Chapter Series Comparison: – Added Figure 1-1 ESP32-S2 Module Variant Nomenclature – Removed ESP32-S2-MINI-2-H4 and ESP32-S2-MINI-2U-H4 • In Section 9.2 Dimensions of External Antenna Connector: Added the external antenna information for certification • In Chapter Recommended PCB Land Pattern: added 3D models 2024-09-05 v1.6 Updated the module images on the cover page 2024-05-10 v1.0 • Added information about certification and test in Section 1.1 Features 2024-04-16 v0.6 • Updated EPAD descriptions in Section 8 Peripheral Schematics • Added descriptions in Section 10.1 PCB Land Pattern • Other formatting updates 2022-09-19 v0.5 Preliminary release Espressif Systems 37 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.4 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2026 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com