1 Module Overview 1.1 Features 1.2 Description 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 3.3 Strapping Pins 3.3.1 Chip Boot Mode Control 3.3.2 VDD_SPI Voltage Control 3.3.3 ROM Messages Printing Control 4 Electrical Characteristics 4.1 Absolute Maximum Ratings 4.2 Recommended Operating Conditions 4.3 DC Characteristics (3.3 V, 25 °C) 4.4 Current Consumption Characteristics 4.4.1 Current Consumption in Active Mode 4.4.2 Current Consumption in Other Modes 4.5 Wi-Fi RF Characteristics 4.5.1 Wi-Fi RF Standards 4.5.2 Transmitter Characteristics 4.5.3 Receiver Characteristics 5 Module Schematics 6 Peripheral Schematics 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions 7.2 Recommended PCB Land Pattern 7.3 Dimensions of External Antenna Connector 8 Product Handling 8.1 Storage Conditions 8.2 Electrostatic Discharge (ESD) 8.3 Soldering Profile 8.3.1 Reflow Profile 8.4 Ultrasonic Vibration 9 MAC Addresses and eFuse Related Documentation and Resources Revision History ESP32-S2-MINI-1 ESP32-S2-MINI-1U Datasheet Version 1.6 2.4 GHz Wi-Fi (802.11 b/g/n) module Built around ESP32-S2 series of SoC, Xtensa ® single-core 32-bit LX7 microprocessor 4 MB flash and optional 2 MB PSRAM in chip package 37 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector ESP32-S2-MINI-1 ESP32-S2-MINI-1U www.espressif.com NOT RECOMMENDED FOR NEW DESIGNS (NRND) Not Recommended For New Designs (NRND) 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-s2-mini-1_esp32-s2-mini-1u_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-S2FH4 or ESP32-S2FN4R2 embedded, Xtensa ® single-core 32-bit LX7 microprocessor, up to 240 MHz • 128 KB ROM • 320 KB SRAM • 16 KB SRAM in RTC • 4 MB embedded flash • 2 MB embedded PSRAM (ESP32-S2FN4R2 only) Wi-Fi • 802.11 b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support • Operating frequency: 2412 ~ 2484 MHz Peripherals • GPIO, SPI, LCD, UART, I2C, I2S, Camera interface, IR, pulse counter, LED PWM, TWAI ® (compatible with ISO 11898-1, i.e. CAN Specification 2.0), full-speed USB OTG, ADC, DAC, touch sensor, temperature sensor Note: * Please refer to ESP32-S2 Series Datasheet for detailed information about the module peripherals. Integrated Components on Module • 40 MHz crystal oscillator Antenna Options • On-board PCB antenna (ESP32-S2-MINI-1) • External antenna via a connector (ESP32-S2-MINI-1U) Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: – 85 °C version: –40 ~ 85 °C – 105 °C version: –40 ~ 105 °C Certification • RF certification: See certificates • Green certification: RoHS/REACH Test • HTOL/HTSL/uHAST/TCT/ESD 1.2 Description ESP32-S2-MINI-1 and ESP32-S2-MINI-1U are two powerful, generic Wi-Fi MCU modules that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as wearable electronics and smart home. Espressif Systems 2 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 1 Module Overview ESP32-S2-MINI-1 comes with a PCB antenna (ANT). ESP32-S2-MINI-1U comes with an external antenna connector (CONN). A wide selection of module variants are available for customers as shown in Table 1 and Table 2. Table 1: ESP32-S2-MINI-1 (ANT) Series Comparison 1 Chip Chip Ambient Temp. 2 Size 3 Ordering Code Flash 4 PSRAM 5 Embedded Revision (°C) (mm) ESP32-S2-MINI-1-N4 (NRND) 4 MB (Quad SPI) — ESP32-S2FH4 v1.0 –40 ∼ 85 15.4 × 20.0 × 2.4ESP32-S2-MINI-1-H4 (End of life) — –40 ∼ 105 ESP32-S2-MINI-1-N4R2 (NRND) 2 MB (Quad SPI) ESP32-S2FN4R2 –40 ∼ 85 1 This table shares the same notes presented in Table 2 below. Table 2: ESP32-S2-MINI-1U (CONN) Series Comparison Chip Chip Ambient Temp. 2 Size 3 Ordering Code Flash 4 PSRAM 5 Embedded Revision (°C) (mm) ESP32-S2-MINI-1U-N4 (NRND) 4 MB (Quad SPI) — ESP32-S2FH4 v1.0 –40 ∼ 85 15.4 × 15.4 × 2.4ESP32-S2-MINI-1U-H4 (End of life) — –40 ∼ 105 ESP32-S2-MINI-1U-N4R2 (End of life) 2 MB (Quad SPI) ESP32-S2FN4R2 –40 ∼ 85 2 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espressif module. 3 For details, refer to Section 7.1 Physical Dimensions. 4 The flash is integrated in the chip’s package. 5 The PSRAM is integrated in the chip’s package. In this datasheet unless otherwise stated, ESP32-S2-MINI-1 refers to ESP32-S2-MINI-1-N4, ESP32-S2-MINI-1-H4, and ESP32-S2-MINI-1-N4R2, whereas ESP32-S2-MINI-1U refers to ESP32-S2-MINI-1U-N4, ESP32-S2-MINI-1U-H4, and ESP32-S2-MINI-1U-N4R2. The ESP32-S2FH4 chip and the ESP32-S2FN4R2 chip at the core of the two modules fall into the same category, namely ESP32-S2 chip series. ESP32-S2 series of chips have an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. It has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. ESP32-S2 series of chips integrate a rich set of peripherals, ranging from SPI, I2S, UART, I2C, LED PWM, TWAI ® , LCD, Camera interface, ADC, DAC, touch sensor, temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed USB On-The-Go (OTG) interface for USB communication. For more information on ESP32-S2 series of chips, please refer to ESP32-S2 Series Datasheet and ESP32-S2 Series SoC Errata. Information about ESP-IDF release that supports a specific chip revision is provided in ESP Product Selector. 1.3 Applications • Generic Low-power IoT Sensor Hub • Generic Low-power IoT Data Loggers • Cameras for Video Streaming • Over-the-top (OTT) Devices • USB Devices • Speech Recognition Espressif Systems 3 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 1 Module Overview • Image Recognition • Mesh Network • Home Automation • Smart Home Control Panel • Smart Building • Industrial Automation • Smart Agriculture • Audio Applications • Health Care Applications • Wi-Fi-enabled Toys • Wearable Electronics • Retail & Catering Applications • Smart POS Machines Espressif Systems 4 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Description 2 1.3 Applications 3 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 10 3.3 Strapping Pins 12 3.3.1 Chip Boot Mode Control 13 3.3.2 VDD_SPI Voltage Control 13 3.3.3 ROM Messages Printing Control 14 4 Electrical Characteristics 15 4.1 Absolute Maximum Ratings 15 4.2 Recommended Operating Conditions 15 4.3 DC Characteristics (3.3 V, 25 °C) 15 4.4 Current Consumption Characteristics 16 4.4.1 Current Consumption in Active Mode 16 4.4.2 Current Consumption in Other Modes 16 4.5 Wi-Fi RF Characteristics 17 4.5.1 Wi-Fi RF Standards 17 4.5.2 Transmitter Characteristics 18 4.5.3 Receiver Characteristics 18 5 Module Schematics 21 6 Peripheral Schematics 23 7 Physical Dimensions and PCB Land Pattern 24 7.1 Physical Dimensions 24 7.2 Recommended PCB Land Pattern 25 7.3 Dimensions of External Antenna Connector 27 8 Product Handling 28 8.1 Storage Conditions 28 8.2 Electrostatic Discharge (ESD) 28 8.3 Soldering Profile 28 8.3.1 Reflow Profile 28 8.4 Ultrasonic Vibration 29 Espressif Systems 5 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) Contents 9 MAC Addresses and eFuse 30 Related Documentation and Resources 31 Revision History 32 Espressif Systems 6 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) List of Tables List of Tables 1 ESP32-S2-MINI-1 (ANT) Series Comparison 1 3 2 ESP32-S2-MINI-1U (CONN) Series Comparison 3 3 Pin Definitions 11 4 Default Configuration of Strapping Pins 12 5 Description of Timing Parameters for the Strapping Pins 13 6 Chip Boot Mode Control 13 7 VDD_SPI Voltage Control 14 8 ROM Messages Printing Control 14 9 Absolute Maximum Ratings 15 10 Recommended Operating Conditions 15 11 DC Characteristics (3.3 V, 25 °C) 15 12 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 16 13 Current Consumption in Modem-sleep Mode 16 14 Current Consumption in Low-Power Modes 17 15 Wi-Fi RF Standards 17 16 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 18 17 TX EVM Test 1 18 18 RX Sensitivity 19 19 Maximum RX Level 19 20 Adjacent Channel Rejection 20 Espressif Systems 7 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) List of Figures List of Figures 1 ESP32-S2-MINI-1 Block Diagram 9 2 ESP32-S2-MINI-1U Block Diagram 9 3 ESP32-S2-MINI-1 Pin Layout (Top View) 10 4 Visualization of Timing Parameters for the Strapping Pins 13 5 ESP32-S2-MINI-1 Schematics 21 6 ESP32-S2-MINI-1U Schematics 22 7 Peripheral Schematics 23 8 ESP32-S2-MINI-1 Physical Dimensions 24 9 ESP32-S2-MINI-1U Physical Dimensions 24 10 ESP32-S2-MINI-1 Recommended PCB Land Pattern 25 11 ESP32-S2-MINI-1U Recommended PCB Land Pattern 26 12 Dimensions of External Antenna Connector 27 13 Reflow Profile 28 Espressif Systems 8 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 2 Block Diagram 2 Block Diagram FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 RF Matching 40 MHz Crystal ESP32-S2-MINI-1 GPIOs Antenna PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 40 MHz Crystal ESP32-S2-MINI-1U GPIOs PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 1: ESP32-S2-MINI-1 Block Diagram FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 RF Matching 40 MHz Crystal ESP32-S2-MINI-1 GPIOs Antenna PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 40 MHz Crystal ESP32-S2-MINI-1U GPIOs PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 2: ESP32-S2-MINI-1U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 7.1 Physical Dimensions. The pin layout is applicable for ESP32-S2-MINI-1 and ESP32-S2-MINI-1U, but the latter has no keepout zone. Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 Pin 63 GND IO12 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 64 GND Pin 31 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 NC IO33 IO34 GND Pin 32 Pin 33 Pin 34 Pin 35 Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 65 GND Pin 62 GND Pin 46 Pin 47 Pin 48 Pin 49 Pin 50 Pin 51 Pin 52 Pin 53 Pin 54 Pin 55 Pin 56 Pin 57 Pin 58 Pin 59 Pin 60 Pin 61 GND GND GND GND GNDGND GND GND GND IO35 IO36 IO37 IO38 IO39 IO40 IO41 IO42 TXD0 RXD0 IO45 GND GND IO46 EN GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Keepout Zone Figure 3: ESP32-S2-MINI-1 Pin Layout (Top View) 3.2 Pin Description The module has 65 pins. See pin definitions in Table 3 Pin Definitions. For peripheral pin configurations, please refer to ESP32-S2 Series Datasheet > Section Peripheral Pin Configurations. Espressif Systems 10 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 3: Pin Definitions Name No. Type 1 Function GND 1, 2, 30, 42, 43, 46-65 P Ground 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0, GPIO0 IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6 IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7 IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD IO10 14 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 IO11 15 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 IO12 16 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 IO13 17 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 IO14 18 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1 IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D- IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ IO21 25 I/O/T RTC_GPIO21, GPIO21 IO26 2 26 I/O/T SPICS1, GPIO26 NC 27 — NC IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0 IO35 31 I/O/T SPIIO6, GPIO35, FSPID IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ IO38 34 I/O/T GPIO38, FSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3 IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 3 – cont’d from previous page Name No. Type 1 Function IO46 44 I GPIO46 EN 45 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. 1 P: power supply; I: input; O: output; T: high impedance. 2 IO26 is used by the embedded PSRAM on the ESP32-S2-MINI-1-N4R2 and ESP32-S2-MINI-1U-N4R2 modules, and cannot be used for other purposes. 3.3 Strapping Pins Note: The content below is excerpted from ESP32-S2 Series Datasheet > Section Strapping Pins. For the strapping pin mapping between the chip and modules, please refer to Chapter 5 Module Schematics. At each startup or reset, a chip requires some initial configuration parameters, such as in which boot mode to load the chip, voltage of flash memory, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins operate as regular IO pins. The parameters controlled by the given strapping pins at chip reset are as follows: • Chip boot mode – GPIO0 and GPIO46 • VDD_SPI voltage – GPIO45 • ROM messages printing – GPIO46 GPIO0, GPIO45, and GPIO46 are connected to the chip’s internal weak pull-up/pull-down resistors at chip reset. These resistors determine the default bit values of the strapping pins. Also, these resistors determine the bit values if the strapping pins are connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Pull-up 1 GPIO45 Pull-down 0 GPIO46 Pull-down 0 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-S2 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold time. For more information, see Table 5 and Figure 4. Espressif Systems 12 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_PU pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. 3 Strapping pin VIL_nRST VIH t SU t H CHIP_PU Figure 4: Visualization of Timing Parameters for the Strapping Pins 3.3.1 Chip Boot Mode Control GPIO0 and GPIO46 control the boot mode after the reset is released. See Table 6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO0 GPIO46 Default configuration 1 (Pull-up) 0 (Pull-down) SPI Boot (default) 1 Any value Download Boot 0 0 Invalid combination 1 0 1 1 This combination triggers unexpected behavior and should be avoided. 3.3.2 VDD_SPI Voltage Control Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways. Espressif Systems 13 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 7: VDD_SPI Voltage Control EFUSE_VDD_SPI_FORCE GPIO45 eFuse 1 Voltage VDD_SPI power source 2 0 0 Ignored 3.3 V VDD3P3_RTC_IO via R SP I 1 1.8 V Flash Voltage Regulator 1 Ignored 0 1.8 V Flash Voltage Regulator 1 3.3 V VDD3P3_RTC_IO via R SP I 1 eFuse: EFUSE_VDD_SPI_TIEH 2 See ESP32-S2 Series Datasheet > Section Power Scheme 3.3.3 ROM Messages Printing Control During boot process the messages by the ROM code can be printed to: • (Default) U0TXD pin. For this, EFUSE_UART_PRINT_CONTROL should be 0. • DAC_1 pin. For this, EFUSE_UART_PRINT_CONTROL should be 1. EFUSE_UART_PRINT_CONTROL and GPIO46 control ROM messages printing as shown in Table 8 ROM Messages Printing Control. Table 8: ROM Messages Printing Control eFuse 1 GPIO46 ROM Messages Printing 0 Ignored Always enabled 1 0 Enabled 1 Disabled 2 0 Disabled 1 Enabled 3 Ignored Always disabled 1 eFuse: EFUSE_UART_PRINT_CONTROL Espressif Systems 14 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Stresses above those listed in Table 9 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 10 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 9: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST OR E Storage temperature –40 105 °C 4.2 Recommended Operating Conditions Table 10: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature 85 °C version –40 — 85 °C 105 °C version 105 4.3 DC Characteristics (3.3 V, 25 °C) Table 11: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Pull-up resistor — 45 — kΩ R P D Pull-down resistor — 45 — kΩ V IH_nRST Chip reset release voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage –0.3 — 0.25 × VDD 1 V Espressif Systems 15 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions 1 VDD is the I/O voltage for pins of a particular power domain. 2 V OH and V OL are measured using high-impedance load. 4.4 Current Consumption Characteristics Owing to the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-S2 Series Datasheet. 4.4.1 Current Consumption in Active Mode Table 12: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, DSSS, @19.0 dBm 328 802.11g, 54 Mbps, OFDM, @17.5 dBm 295 802.11n, HT20, MCS7, @17.0 dBm 276 802.11n, HT40, MCS7, @16.0 dBm 254 RX 802.11b/g/n, HT20 75 802.11n, HT40 83 1 The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient tem- perature at the RF port. All transmitters’ measurements are based on 100% duty cycle. 2 The current consumption figures in RX mode are for cases where the peripherals are disabled and the CPU idle. Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP32-S2 Series Datasheet. 4.4.2 Current Consumption in Other Modes The measurements below are applicable to ESP32-S2, ESP32-S2FH2, and ESP32-S2FH4. Since ESP32-S2FN4R2 and ESP32-S2R2 come with in-package PSRAM, their current consumption might be higher. Table 13: Current Consumption in Modem-sleep Mode Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA) 1 Modem-sleep 2,3 240 CPU is idle 20.0 28.0 CPU is running 23.0 32.0 160 CPU is idle 14.0 21.0 CPU is running 16.0 24.0 Cont’d on next page Espressif Systems 16 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 13 – cont’d from previous page Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA) 1 80 CPU is idle 10.5 18.4 CPU is running 12.0 20.0 1 In practice, the current consumption might be different depending on which peripherals are enabled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 14: Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep 1 VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance 750 Deep-sleep The ULP co-processor is powered on 2 ULP-FSM 170 ULP-RISC-V 190 ULP sensor-monitored pattern 3 22 RTC timer + RTC memory 25 RTC timer only 20 Power off CHIP_PU is set to low level, the chip is powered off 1 1 In Light-sleep mode, with all related SPI pins pulled up, the current consumption of the embedded PSRAM is 140 µA. Chip variants with in-package PSRAM include ESP32-S2FN4R2 and ESP32-S2R2. 2 During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to operate. 3 The “ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodically. When touch sensors work with a duty cycle of 1%, the typical current consumption is 22 µA. 4.5 Wi-Fi RF Characteristics 4.5.1 Wi-Fi RF Standards Table 15: Wi-Fi RF Standards Name Description Center frequency range of operating channel 1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n Data rate 20 MHz 802.11b: 1, 2, 5.5 and 11 Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n: MCS0-7, 72.2 Mbps (Max) 40 MHz 802.11n: MCS0-7, 150 Mbps (Max) Antenna type PCB antenna, external antenna connector Espressif Systems 17 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions 1 Device should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range is configurable by software. 2 For the modules that use external antenna connectors, the output impedance is 50 Ω. For other modules without external antenna connectors, the output impedance is irrelevant. 4.5.2 Transmitter Characteristics Target TX power is configurable based on device or certification requirements. The default characteristics of modules are provided in Table 16. Table 16: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 19.0 — 802.11b, 11 Mbps, CCK — 19.0 — 802.11g, 6 Mbps, OFDM — 17.5 — 802.11g, 54 Mbps, OFDM — 17.5 — 802.11n, HT20, MCS0 — 17.5 — 802.11n, HT20, MCS7 — 17.0 — 802.11n, HT40, MCS0 — 17.5 — 802.11n, HT40, MCS7 — 16.0 — Table 17: TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –25.0 –10.0 802.11b, 11 Mbps, CCK — –25.0 –10.0 802.11g, 6 Mbps, OFDM — –29.5 –5.0 802.11g, 54 Mbps, OFDM — –29.5 –25.0 802.11n, HT20, MCS0 — –28.0 –5.0 802.11n, HT20, MCS7 — –31.0 –27.0 802.11n, HT40, MCS0 — –28.5 –5.0 802.11n, HT40, MCS7 — –30.5 –27.0 1 EVM is measured at the corresponding typical TX power provided in Table 16 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 4.5.3 Receiver Characteristics Espressif Systems 18 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 18: RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –96.0 — 802.11b, 2 Mbps, DSSS — –93.5 — 802.11b, 5.5 Mbps, CCK — –91.0 — 802.11b, 11 Mbps, CCK — –87.5 — 802.11g, 6 Mbps, OFDM — –91.5 — 802.11g, 9 Mbps, OFDM — –90.0 — 802.11g, 12 Mbps, OFDM — –88.5 — 802.11g, 18 Mbps, OFDM — –86.0 — 802.11g, 24 Mbps, OFDM — –83.5 — 802.11g, 36 Mbps, OFDM — –79.5 — 802.11g, 48 Mbps, OFDM — –75.5 — 802.11g, 54 Mbps, OFDM — –74.0 — 802.11n, HT20, MCS0 — –91.0 — 802.11n, HT20, MCS1 — –88.0 — 802.11n, HT20, MCS2 — –85.5 — 802.11n, HT20, MCS3 — –82.5 — 802.11n, HT20, MCS4 — –78.5 — 802.11n, HT20, MCS5 — –74.5 — 802.11n, HT20, MCS6 — –73.0 — 802.11n, HT20, MCS7 — –71.5 — 802.11n, HT40, MCS0 — –88.0 — 802.11n, HT40, MCS1 — –85.5 — 802.11n, HT40, MCS2 — –83.0 — 802.11n, HT40, MCS3 — –79.0 — 802.11n, HT40, MCS4 — –76.0 — 802.11n, HT40, MCS5 — –71.5 — 802.11n, HT40, MCS6 — –70.5 — 802.11n, HT40, MCS7 — –69.0 — Table 19: Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 5 — 802.11b, 11 Mbps, CCK — 5 — 802.11g, 6 Mbps, OFDM — 5 — 802.11g, 54 Mbps, OFDM — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — Cont’d on next page Espressif Systems 19 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions Table 19 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11n, HT40, MCS7 — 0 — Table 20: Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 35 — 802.11b, 11 Mbps, CCK — 35 — 802.11g, 6 Mbps, OFDM — 31 — 802.11g, 54 Mbps, OFDM — 14 — 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 13 — 802.11n, HT40, MCS0 — 19 — 802.11n, HT40, MCS7 — 8 — Espressif Systems 20 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions 5 Module Schematics This is the reference design of the modules. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. ESP32-S2FN4R2 ESP32-S2FH4 The values of C11, L2 and C12 vary with the actual PCB board. ESP32-S2-MINI-1(pin-out) 50 ohm Impedance Control NC: No component. GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO19 GPIO20 GPIO21 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO26 RF_ANT GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO45 GPIO46 CHIP_PU U0TXD GPIO18 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU LNA_IN GND VDD33 GND GND GND GNDGND GND GND VDD33 VDD33 GND GNDGND VDD33 GND GND VDD33 GND GND VDD33 VDD33 GND GND GND GND GND GND GND VDD_SPI GND VDD33 VDD33 U2 ESP32-S2-MINI-1 GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND 2 GND 62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 TBD R3 499 C14 1uF U1 VDDA 1 LNA_IN 2 VDD3P3 3 VDD3P3 4 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 DAC_1 23 DAC_2 24 GPIO19 25 GPIO20 26 VDD_SPI 30 SPICS1 29 SPIWP 32 SPICS0 33 SPIQ 35 SPID 36 SPICLK 34 GPIO33 37 GND 57 GPIO34 38 GPIO35 39 MTCK 43 GPIO46 55 VDDA 51 XTAL_N 52 XTAL_P 53 MTMS 47 MTDO 44 U0TXD 48 VDD3P3_CPU 45 CHIP_PU 56 VDDA 54 MTDI 46 GPIO8 13 GPIO9 14 VDD3P3_RTC_IO 27 GPIO21 28 SPIHD 31 GPIO36 40 GPIO37 41 GPIO38 42 U0RXD 49 GPIO45 50 C13 0.1uF C9 0.1uF C6 10uF L1 2.0nH C10 0.1uF Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C2 100pF C12 TBD ANT1 PCB_ANT 1 2 L2 TBD C7 1uF C1 TBD R11 10K(NC) D1 ESD C11 TBD C3 1uF C16 0.1uF C15 0.1uF R4 0 C8 0.1uF C5 0.1uF Figure 5: ESP32-S2-MINI-1 Schematics Espressif Systems 21 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 3 Pin Definitions 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. ESP32-S2FN4R2 ESP32-S2FH4 ESP32-S2-MINI-1U(pin-out) 50 ohm Impedance Control NC: No component. GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO19 GPIO20 GPIO21 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO26 RF_ANT GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO45 GPIO46 CHIP_PU U0TXD GPIO18 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU LNA_IN VDD33 GND VDD33 GND GND GND GNDGND GND GND VDD33 VDD33 GND GNDGND VDD33 GND GND VDD33 GND GND VDD33 VDD33 GND GND GND GND GND GND GND VDD_SPI GND VDD33 U2 ESP32-S2-MINI-1U GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND 2 GND 62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 TBD R3 499 C14 1uF U1 VDDA 1 LNA_IN 2 VDD3P3 3 VDD3P3 4 GPIO0 5 GPIO1 6 GPIO2 7 GPIO3 8 GPIO4 9 GPIO5 10 GPIO6 11 GPIO7 12 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 DAC_1 23 DAC_2 24 GPIO19 25 GPIO20 26 VDD_SPI 30 SPICS1 29 SPIWP 32 SPICS0 33 SPIQ 35 SPID 36 SPICLK 34 GPIO33 37 GND 57 GPIO34 38 GPIO35 39 MTCK 43 GPIO46 55 VDDA 51 XTAL_N 52 XTAL_P 53 MTMS 47 MTDO 44 U0TXD 48 VDD3P3_CPU 45 CHIP_PU 56 VDDA 54 MTDI 46 GPIO8 13 GPIO9 14 VDD3P3_RTC_IO 27 GPIO21 28 SPIHD 31 GPIO36 40 GPIO37 41 GPIO38 42 U0RXD 49 GPIO45 50 C13 0.1uF C9 0.1uF C6 10uF L1 2.0nH C10 0.1uF Y1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C2 100pF C12 TBD L2 TBD C7 1uF ANT1 CONN 1 4 2 3 C1 TBD R11 10K(NC) C11 TBD C3 1uF C16 0.1uF C15 0.1uF D1 ESD R4 0 C8 0.1uF C5 0.1uF Figure 6: ESP32-S2-MINI-1U Schematics Espressif Systems 22 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 6 Peripheral Schematics 6 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. X1: ESR = Max. 70 KΩ EN IO4 IO5 IO6 IO7 IO14 IO8 IO13 IO12 IO17 EN IO46 IO45 TXD0 RXD0 TDI TDO TCK IO42 TMS IO39 IO41 IO40 IO38 IO37 IO36 IO35 IO15 IO16 IO18 IO9 IO10 IO11 IO3 IO2 IO1 IO0 IO34 IO33 IO26 IO21 IO19 IO20 USB_D- USB_D+ GND VDD33 GND GND GND GND GND VDD33 GND GND GNDGND GND GND C5 TBD R6 0 SW1 R1 TBD JP4 Boot Option 1 1 2 2 R7 0 X1 32.768kHz(NC) 12 JP3 USB OTG 1 1 2 2 R2 NC JP1 UART 1 1 2 2 3 3 4 4 R4 0 C3 0.1uF R3 0(NC) JP2 JTAG 1 1 2 2 3 3 4 4 C7 12pF(NC) U1 ESP32-S2-MINI-1/ESP32-S2-MINI-1U GND 1 3V3 3 IO0 4 IO1 5 IO2 6 IO3 7 IO4 8 IO5 9 IO6 10 IO7 11 IO8 12 IO9 13 IO10 14 IO11 15 GND 42 TXD0 39 RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND 63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND 2 GND 62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 12pF(NC) R5 0(NC) C8 0.1uF C6 TBD C1 22uF C2 TBD Figure 7: Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32-S2 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to ESP32-S2 Series Datasheet > Section Power Scheme. Espressif Systems 23 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 7 Physical Dimensions and PCB Land Pattern 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions 4.5 20±0.2 0.815.4±0.2 Top view Side view Bottom view 2.4±0.15 4.5 14 13.55 7.7 0.6 0.6 1.2 1.2 1.7 14 1.7 14 0.7 0.5 Ø0.5 4.5 60 x 0.4 x 0.8 11.9 4 x 0.8 x 0.8 11.9 Unit: mm 0.85 Figure 8: ESP32-S2-MINI-1 Physical Dimensions 4.5 15.4±0.2 0.815.4±0.2 Top view Side view Bottom view 4.5 0.6 0.6 1.2 1.2 1.7 11.9 14 1.7 11.9 14 2.4±0.15 3.2 0.5 0.7 1.6 0.85 13.55 14 60 x 0.4 x 0.8 4 x 0.8 x 0.8 Unit: mm 0.85 7.7 Figure 9: ESP32-S2-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information. Espressif Systems 24 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 7 Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 10 ESP32-S2-MINI-1 Recommended PCB Land Pattern and Figure 11 ESP32-S2-MINI-1U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10 and Figure 11. You can view the source files for ESP32-S2-MINI-1 and ESP32-S2-MINI-1U with Autodesk Viewer. • 3D models of ESP32-S2-MINI-1 and ESP32-S2-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 14 4.5 1.7 1.2 1.7 11.9 11.9 20 1.2 15.4 0.6 0.6 14 Antenna Area Pin 1 4.5 60 x 0.4 x 0.8 4 x 0.8 x 0.8 Unit: mm Pad Via for thermal pad 4.5 7.7 0.85 Figure 10: ESP32-S2-MINI-1 Recommended PCB Land Pattern Espressif Systems 25 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 7 Physical Dimensions and PCB Land Pattern Unit: mm Via for thermal pad Pad 14 4.5 1.7 1.2 1.7 11.9 11.9 15.4 1.2 15.4 0.6 0.6 14 Pin 1 60 x 0.4 x 0.8 4 x 0.8 x 0.8 4.5 7.7 0.85 Figure 11: ESP32-S2-MINI-1U Recommended PCB Land Pattern Espressif Systems 26 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 7 Physical Dimensions and PCB Land Pattern 7.3 Dimensions of External Antenna Connector ESP32-S2-MINI-1U uses the third generation external antenna connector as shown in Figure 12 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 12: Dimensions of External Antenna Connector Espressif Systems 27 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 8 Product Handling 8 Product Handling 8.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 8.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 8.3 Soldering Profile 8.3.1 Reflow Profile Solder the module in a single reflow. 50 150 0 25 1 ~ 3 ℃/s 0 200 250 200 –1 ~ –5 ℃/s Cooling zone 100 217 50 100 250 Reflow zone 217 ℃ 60 ~ 90 s Temperature (℃) Preheating zone 150 ~ 200 ℃ 60 ~ 120 s Ramp-up zone Peak Temp. 235 ~ 250 ℃ Soldering time > 30 s Time (sec.) Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 13: Reflow Profile Espressif Systems 28 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 8 Product Handling 8.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 29 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) 9 MAC Addresses and eFuse 9 MAC Addresses and eFuse The eFuse in ESP32-S2 series of chips has been burnt into 48-bit mac_address. The actual addresses the chip uses in station or AP modes correspond to mac_address in the following way: • Station mode: mac_address • AP mode: mac_address + 1 There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read disable controller. Six of them can be used to store encrypted key or user data, and the remaining one is only used to store user data. Espressif Systems 30 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32-S2 Series Datasheet – Specifications of the ESP32-S2 hardware. • ESP32-S2 Technical Reference Manual – Detailed information on how to use the ESP32-S2 memory and peripherals. • ESP32-S2 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-S2 into your hardware product. • ESP32-S2 Series SoC Errata – Descriptions of known errors in ESP32-S2 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-S2 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-S2 • ESP32-S2 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-S2 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-S2 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-S2 Series SoCs – Browse through all ESP32-S2 SoCs. https://espressif.com/en/products/socs?id=ESP32-S2 • ESP32-S2 Series Modules – Browse through all ESP32-S2-based modules. https://espressif.com/en/products/modules?id=ESP32-S2 • ESP32-S2 Series DevKits – Browse through all ESP32-S2-based devkits. https://espressif.com/en/products/devkits?id=ESP32-S2 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 31 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) Revision History Revision History Date Version Release notes 2024-09-05 v1.6 • Updated the module images on the cover page 2024-07-05 v1.5 • According to PCN20240602, upgraded the chip embedded in ESP32-S2- MINI-1-N4, ESP32-S2-MINI-1-H4, ESP32-S2-MINI-1U-N4 and ESP32- S2-MINI-1U-H4 from chip revision v0.0 to v1.0 • Marked ESP32-S2-MINI-1U-H4R2 as end of life • Updated the module images on the cover page 2024-04-23 v1.4 • Marked ESP32-S2-MINI-1-H4 and ESP32-S2-MINI-1U-H4 as end of life, and other variants as NRND • According to PCN20230601, upgraded the chip embedded in ESP32-S2- MINI-N4R2 and ESP32-S2-MINI-1U-N4R2 from chip revision v0.0 to chip revision v1.0, and Section 4.4.1 Current Consumption in Active Mode, Sec- tion 4.5 Wi-Fi RF Characteristics, and Section 5 Module Schematics are up- dated with information about chip revision v1.0 accordingly 2023-05-25 v1.3 • Changed Table Ordering Information to Table ESP32-S2-MINI-1 (ANT) Series Comparison 1 and Table ESP32-S2-MINI-1U (CONN) Series Comparison • Added links to some reference documents in Section 1 Module Overview • Updated EPAD descriptions in Section 6 Peripheral Schematics • Added descriptions in Section 7.2 Recommended PCB Land Pattern • Other formatting updates 2022-09-23 v1.2 • Added Section 8.4 Ultrasonic Vibration • Removed NRND watermark 2022-03-01 v1.1 • Added information about ESP32-S2-MINI-1-H4 � ESP32-S2-MINI-1U-H4 • Added module pictures on the title page • Added NRND watermark • Added a note with a link and QR code to the latest version of the document • Updated Section ”Learning Resources” and renamed to ”Related Docu- mentation and Resources” • Updated the format for table notes • Updated Table 13 Current Consumption in Modem-sleep Mode and Table 14 Current Consumption in Low-Power Modes 2021-06-25 v1.0 • Added module variants embedded with the ESP32-S2FN4R2 chip • Added module description to the title page • Updated Chapter 1 Module Overview • Added description in Section 7.3 Dimensions of External Antenna Connector • Replaced ”chip family” with ”chip series” following Espressif’s taxonomy Cont’d on next page Espressif Systems 32 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) Revision History Cont’d from previous page Date Version Release notes 2020-12-17 v0.6 • Added TWAI to Chapter 1 Module Overview • Updated Table 4.4.1 Current Consumption in Active Mode • Updated the capacitance value of RC delay circuit to 1 µF in Chapter 6 Peripheral Schematics • Updated note in Section 8.3.1 Reflow Profile 2020-09-23 v0.5 Preliminary release. Espressif Systems 33 Submit Documentation Feedback ESP32-S2-MINI-1 & MINI-1U Datasheet v1.6 Not Recommended For New Designs (NRND) Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2026 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com