1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 Internal LDO (VDD_SDIO) Voltage Control 4.3 U0TXD Printing Control 4.4 Timing Control of SDIO Slave 4.5 JTAG Signal Source Control 4.6 Chip Power-up and Reset 5 Peripherals 5.1 Peripheral Overview 5.2 Digital Peripherals 5.2.1 General Purpose Input / Output Interface (GPIO) 5.2.2 Serial Peripheral Interface (SPI) 5.2.3 Universal Asynchronous Receiver Transmitter (UART) 5.2.4 I2C Interface 5.2.5 I2S Interface 5.2.6 Remote Control Peripheral 5.2.7 Pulse Counter Controller (PCNT) 5.2.8 LED PWM Controller 5.2.9 Motor Control PWM 5.2.10 SD/SDIO/MMC Host Controller 5.2.11 SDIO/SPI Slave Controller 5.2.12 TWAI Controller 5.2.13 Ethernet MAC Interface 5.3 Analog Peripherals 5.3.1 Analog-to-Digital Converter (ADC) 5.3.2 Digital-to-Analog Converter (DAC) 5.3.3 Touch Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 6.5 Memory Specifications 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 7.2 Bluetooth Radio 7.2.1 Transmitter – Basic Data Rate 7.2.2 Receiver – Basic Data Rate 7.2.3 Transmitter – Enhanced Data Rate 7.2.4 Receiver – Enhanced Data Rate 7.3 Bluetooth LE Radio 7.3.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.3.2 Bluetooth LE RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Reflow Profile 12.4 Ultrasonic Vibration Datasheet Versioning Related Documentation and Resources Revision History ESP32-PICO-MINI-02 ESP32-PICO-MINI-02U Datasheet Version 1.6 2.4 GHz Wi-Fi + Bluetooth ® + Bluetooth LE module Built around ESP32 series of SoCs, Xtensa ® dual-core 32-bit LX6 microprocessor Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector ESP32-PICO-MINI-02 ESP32-PICO-MINI-02U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/sites/default/files/documentation/esp32-pico-mini-02_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support • Center frequency range of operating channel: 2412 ~ 2484 MHz Bluetooth ® • Bluetooth V4.2 BR/EDR and Bluetooth LE specification • Class-1, class-2 and class-3 transmitter • AFH • CVSD and SBC Peripherals • Up to 27 GPIOs – 5 strapping GPIOs – 4 GPIOs used for in-package flash and PSRAM – 6 input-only GPIOs • SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI ® (compatible with ISO 11898-1, i.e. CAN Specification 2.0), Ethernet MAC Integrated Components on Module • 40 MHz crystal oscillator Antenna Options • ESP32-PICO-MINI-02: On-board PCB antenna • ESP32-PICO-MINI-02U: external antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: –40 ~ 85 °C Certification • RF certification: See certificates for ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U • Green certification: REACH/RoHS Test • Reliability: HTOL/HTSL/uHAST/TCT/ESD Espressif Systems 2 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 1 Module Overview 1.2 Series Comparison ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U are two general-purpose Wi-Fi + Bluetooth + Bluetooth LE MCU modules. The rich set of peripherals and a small size make the two modules an ideal choice for a wide variety of IoT applications, ranging from home automation, smart building, consumer electronics to industrial control, and they are suitable for intelligent speakers, speech recognition toys, intelligent gateway and Ethernet, etc. ESP32-PICO-MINI-02 comes with a PCB antenna. ESP32-PICO-MINI-02U comes with a connector for an external antenna. They both feature an 8 MB in-package SPI flash and an additional 2 MB SPI Pseudo static RAM (PSRAM). The information in this datasheet is applicable to both modules. The series comparison for the two modules is listed as follows: Table 1: ESP32-PICO-MINI-02 Series Comparison 1 Ambient Temp. 2 Size 3 Ordering Code Flash PSRAM (°C) (mm) ESP32-PICO-MINI-02-N8R2 8 MB 2 MB –40 ~ 85 13.2 × 16.6 × 2.4 1 This table shares the same notes presented in Table 1 below. Table 2: ESP32-PICO-MINI-02USeries Comparison Ambient Temp. 2 Size 3 Ordering Code Flash 4 PSRAM (°C) (mm) ESP32-PICO-MINI-02U-N8R2 8 MB 2 MB –40 ~ 85 13.2 × 11.2 × 2.4 2 Ambient temperature specifies the recommended temperature range of the environment im- mediately outside the Espressif module. 3 For details, refer to Section 10.1 Module Dimensions. 4 For specifications, refer to Section 6.5 Memory Specifications. At the core of the modules is the ESP32-PICO-V3-02 *. The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. You can power off the CPU and make use of the low-power coprocessor to constantly monitor the peripherals for changes or crossing of thresholds. Note: For more information on ESP32-PICO-V3-02, please refer to ESP32-PICO Series Datasheet. Espressif Systems 3 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 1 Module Overview 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Audio Devices • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers • Cameras for Video Streaming • Speech Recognition • Image Recognition • SDIO Wi-Fi + Bluetooth Networking Card Espressif Systems 4 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 11 4 Boot Configurations 13 4.1 Chip Boot Mode Control 14 4.2 Internal LDO (VDD_SDIO) Voltage Control 15 4.3 U0TXD Printing Control 16 4.4 Timing Control of SDIO Slave 16 4.5 JTAG Signal Source Control 16 4.6 Chip Power-up and Reset 16 5 Peripherals 18 5.1 Peripheral Overview 18 5.2 Digital Peripherals 18 5.2.1 General Purpose Input / Output Interface (GPIO) 18 5.2.2 Serial Peripheral Interface (SPI) 18 5.2.3 Universal Asynchronous Receiver Transmitter (UART) 19 5.2.4 I2C Interface 19 5.2.5 I2S Interface 20 5.2.6 Remote Control Peripheral 20 5.2.7 Pulse Counter Controller (PCNT) 21 5.2.8 LED PWM Controller 21 5.2.9 Motor Control PWM 22 5.2.10 SD/SDIO/MMC Host Controller 23 5.2.11 SDIO/SPI Slave Controller 23 5.2.12 TWAI ® Controller 24 5.2.13 Ethernet MAC Interface 24 5.3 Analog Peripherals 25 5.3.1 Analog-to-Digital Converter (ADC) 25 5.3.2 Digital-to-Analog Converter (DAC) 26 5.3.3 Touch Sensor 26 6 Electrical Characteristics 28 6.1 Absolute Maximum Ratings 28 6.2 Recommended Operating Conditions 28 Espressif Systems 5 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 Contents 6.3 DC Characteristics (3.3 V, 25 °C) 28 6.4 Current Consumption Characteristics 29 6.4.1 Current Consumption in Active Mode 29 6.4.2 Current Consumption in Other Modes 30 6.5 Memory Specifications 30 7 RF Characteristics 32 7.1 Wi-Fi Radio 32 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 32 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 33 7.2 Bluetooth Radio 34 7.2.1 Transmitter – Basic Data Rate 34 7.2.2 Receiver – Basic Data Rate 35 7.2.3 Transmitter – Enhanced Data Rate 36 7.2.4 Receiver – Enhanced Data Rate 36 7.3 Bluetooth LE Radio 37 7.3.1 Bluetooth LE RF Transmitter (TX) Characteristics 37 7.3.2 Bluetooth LE RF Receiver (RX) Characteristics 37 8 Module Schematics 39 9 Peripheral Schematics 41 10 Physical Dimensions 42 10.1 Module Dimensions 42 10.2 Dimensions of External Antenna Connector 43 11 PCB Layout Recommendations 45 11.1 PCB Land Pattern 45 11.2 Module Placement for PCB Design 46 12 Product Handling 47 12.1 Storage Conditions 47 12.2 Electrostatic Discharge (ESD) 47 12.3 Reflow Profile 47 12.4 Ultrasonic Vibration 48 Datasheet Versioning 49 Related Documentation and Resources 50 Revision History 51 Espressif Systems 6 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 List of Tables List of Tables 1 ESP32-PICO-MINI-02 Series Comparison 1 3 2 ESP32-PICO-MINI-02USeries Comparison 3 3 Pin Definitions 11 4 Default Configuration of Strapping Pins 13 5 Description of Timing Parameters for the Strapping Pins 14 6 Chip Boot Mode Control 14 7 U0TXD Printing Control 16 8 Timing Control of SDIO Slave 16 9 Description of Timing Parameters for Power-up and Reset 17 10 ADC Characteristics 25 11 ADC Calibration Results 26 12 Capacitive-Sensing GPIOs Available on ESP32 26 13 Absolute Maximum Ratings 28 14 Recommended Operating Conditions 28 15 DC Characteristics (3.3 V, 25 °C) 28 16 Current Consumption Depending on RF Modes 29 17 Current Consumption Depending on Work Modes 30 18 Flash Specifications 30 19 PSRAM Specifications 31 20 Wi-Fi RF Characteristics 32 21 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 32 22 TX EVM Test 1 32 23 RX Sensitivity 33 24 Maximum RX Level 34 25 RX Adjacent Channel Rejection 34 26 Transmitter Characteristics – Basic Data Rate 34 27 Receiver Characteristics – Basic Data Rate 35 28 Transmitter Characteristics – Enhanced Data Rate 36 29 Receiver Characteristics – Enhanced Data Rate 36 30 Bluetooth LE RF Characteristics 37 31 Transmitter Characteristics – BLE 37 32 Receiver Characteristics – BLE 38 Espressif Systems 7 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 List of Figures List of Figures 1 ESP32-PICO-MINI-02 Block Diagram 9 2 ESP32-PICO-MINI-02U Block Diagram 9 3 ESP32-PICO-MINI-02 Pin Layout (Top View) 10 4 ESP32-PICO-MINI-02U Pin Layout (Top View) 11 5 Visualization of Timing Parameters for the Strapping Pins 14 6 Chip Boot Flow 15 7 Visualization of Timing Parameters for Power-up and Reset 16 8 ESP32-PICO-MINI-02 Schematics 39 9 ESP32-PICO-MINI-02U Schematics 40 10 Peripheral Schematics 41 11 ESP32-PICO-MINI-02 Physical Dimensions 42 12 ESP32-PICO-MINI-02U Physical Dimensions 42 13 Dimensions of External Antenna Connector 43 14 ESP32-PICO-MINI-02 Recommended PCB Land Pattern 45 15 ESP32-PICO-MINI-02U Recommended PCB Land Pattern 46 16 Reflow Profile 47 Espressif Systems 8 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 2 Block Diagram 2 Block Diagram SPI Flash ESP32-PICO-V3-02 RF Matching 40 MHz Crystal 3V3 ESP32-PICO-MINI-02 EN GPIOs PSRAM Antenna SPI Flash ESP32-PICO-V3-02 RF Matching 40 MHz Crystal 3V3 ESP32-PICO-MINI-02U EN GPIOs PSRAM Antenna Figure 1: ESP32-PICO-MINI-02 Block Diagram SPI Flash ESP32-PICO-V3-02 RF Matching 40 MHz Crystal 3V3 ESP32-PICO-MINI-02 EN GPIOs PSRAM Antenna SPI Flash ESP32-PICO-V3-02 RF Matching 40 MHz Crystal 3V3 ESP32-PICO-MINI-02U EN GPIOs PSRAM Antenna Figure 2: ESP32-PICO-MINI-02U Block Diagram Note: For the pin mapping between the chip and the in-package flash/PSRAM, please refer to ESP32 Series Datasheet > Table Pin Mapping Between Chip and In-package Flash/PSRAM. Espressif Systems 9 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10.1 Module Dimensions. GND Pin 4 Pin 29 Pin 8 Pin 10 Pin 12 GND Pin 50 GND Pin 2 Pin 20 Pin 9 Pin 13 GND Pin 16 I37 Pin 22 IO32 Pin 21 Pin 18 Pin 51 GND Pin 24 Pin 33 Pin 30 Pin 32 Pin 34 Pin 36 Pin 40 Pin 49 GND GND Pin 47 Pin 44 GND GND GND GND GND Pin 45 Pin 1 EN Pin 7 I34 I39 I38 IO33 Pin 3 Pin 6 3V3 Pin 5 IO13 Pin 11 Pin 15 Pin 53 GND GND IO14 I35 Pin 52 GND IO15 IO27 IO12 Pin 14 IO26 IO2 Pin 17 IO20 NC IO5 IO0 IO7 IO8 Pin 23 Pin 19 Pin 25 IO22 RXD0 Pin 26 GND TXD0 NC Pin 27 IO19 GND Pin 31 GND Pin 28 GND GND Pin 35 GND GND GND GND Pin 38 GND GND Pin 37 Keepout Zone Pin 39 Pin 41 Pin 42 Pin 43 GND I36 Pin 46 Pin 48 GND IO25 IO4 IO21 GND GND Figure 3: ESP32-PICO-MINI-02 Pin Layout (Top View) Espressif Systems 10 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 3 Pin Definitions GND Pin 4 Pin 29 Pin 8 Pin 10 Pin 12 GND Pin 50 GND Pin 2 Pin 20 Pin 9 Pin 13 GND Pin 16 I37 Pin 22 IO32 Pin 21 Pin 18 Pin 51 GND Pin 24 Pin 33 Pin 30 Pin 32 Pin 34 Pin 36 Pin 40 Pin 49 GND GND Pin 47 Pin 44 GND GND GND GND GND Pin 45 Pin 1 EN Pin 7 I34 I39 I38 IO33 Pin 3 Pin 6 3V3 Pin 5 IO13 Pin 11 Pin 15 Pin 53 GND GND IO14 I35 Pin 52 GND IO15 IO27 IO12 Pin 14 IO26 IO2 Pin 17 IO20 NC IO5 IO0 IO7 IO8 Pin 23 Pin 19 Pin 25 IO22 RXD0 Pin 26 GND TXD0 NC Pin 27 IO19 GND Pin 31 GND Pin 28 GND GND Pin 35 GND GND GND GND Pin 38 GND GND Pin 37 Pin 39 Pin 41 Pin 42 Pin 43 GND I36 Pin 46 Pin 48 GND IO25 IO4 IO21 GND GND Figure 4: ESP32-PICO-MINI-02U Pin Layout (Top View) 3.2 Pin Description ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U each has 53 pins. See pin definitions in Table 3 Pin Description. For peripheral pin configurations, please refer to Section 5.2 Digital Peripherals. Table 3: Pin Definitions Name No. Type 1 Function GND 1, 2, 11, 14, 36-53 P Ground 3V3 3 P Power supply I36 4 I GPIO36, ADC1_CH0, RTC_GPIO0 I37 5 I GPIO37, ADC1_CH1, RTC_GPIO1 I38 6 I GPIO38, ADC1_CH2, RTC_GPIO2 I39 7 I GPIO39, ADC1_CH3, RTC_GPIO3 EN 8 I High: On; enables the chip Low: Off; the chip shuts down Note: Do not leave EN pin floating. I34 9 I GPIO34, ADC1_CH6, RTC_GPIO4 I35 10 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 12 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 IO33 13 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 3 Pin Definitions Table 3 – cont’d from previous page Name No. Type 1 Function IO25 15 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 16 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 17 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 18 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 IO12 19 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 IO13 20 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER IO15 21 I/O GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3 IO2 22 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 IO0 23 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK IO4 24 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER NC 25 - - IO20 26 I/O GPIO20 IO7 27 I/O GPIO7, HS1_DATA0, U2RTS, SD_DATA0 IO8 28 I/O GPIO8, HS1_DATA1, U2CTS, SD_DATA1 IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK RXD0 30 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 31 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 NC 32 - - IO19 33 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 IO22 34 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO21 35 I/O GPIO21, VSPIHD, EMAC_TX_EN * P: power supply; I: input; O: output. * Pins CMD/IO11 and CLK/IO6 are used for connecting the embedded flash, and pins SD2/IO9 and SD3/IO10 are used for connecting embedded PSRAM. These pins are not led out. Espressif Systems 12 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32 Series Datasheet > Section Boot Configurations. For the strapping pin map- ping between the chip and modules, please refer to Chapter 8 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO0 and GPIO2 • Internal LDO (VDD_SDIO) Voltage – Strapping pin: MTDI – eFuse bit: EFUSE_SDIO_FORCE and EFUSE_SDIO_TIEH • U0TXD printing – Strapping pin: MTDO • Timing of SDIO Slave – Strapping pin: MTDO and GPIO5 • JTAG signal source – eFuse bit: EFUSE_DISABLE_JTAG The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to program eFuse bits, please refer to ESP32 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Pull-up 1 GPIO2 Pull-down 0 MTDI Pull-down 0 MTDO Pull-up 1 GPIO5 Pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in Espressif Systems 13 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 4 Boot Configurations any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 5 and Figure 5. Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_PU pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. 1 Strapping pin V IH_nRST V IH t SU t H CHIP_PU Figure 5: Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO0 and GPIO2 control the boot mode after the reset is released. See Table 6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO0 GPIO2 SPI Boot Mode 1 Any value Joint Download Boot Mode 2 0 0 1 Bold marks the default value and configuration. 2 Joint Download Boot mode supports the following download methods: • SDIO Download Boot • UART Download Boot In Joint Download Boot mode, the detailed boot flow of the chip is put below 6. Espressif Systems 14 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 4 Boot Configurations Figure 6: Chip Boot Flow uart_download_dis controls boot mode behaviors: It permanently disables Download Boot mode when uart_download_dis is set to 1 (valid only for ESP32 chip revisions v3.0 and higher). 4.2 Internal LDO (VDD_SDIO) Voltage Control MTDI is used to select the VDD_SDIO power supply voltage at reset: • MTDI = 0 (by default), VDD_SDIO pin is powered directly from VDD3P3_RTC. Typically this voltage is 3.3 V. For more information, see ESP32 Series Datasheet > Section Power Scheme. • MTDI = 1, VDD_SDIO pin is powered from internal 1.8 V LDO. This functionality can be overridden by setting EFUSE_SDIO_FORCE to 1, in which case the EFUSE_SDIO_TIEH determines the VDD_SDIO voltage: • EFUSE_SDIO_TIEH = 0, VDD_SDIO connects to 1.8 V LDO. • EFUSE_SPI_TIEH = 1, VDD_SDIO connects to VDD3P3_RTC. Espressif Systems 15 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 4 Boot Configurations 4.3 U0TXD Printing Control During booting, the strapping pin MTDO can be used to control the U0TXD Printing, as Table 7 shows. Table 7: U0TXD Printing Control U0TXD Printing Control MTDO Enabled 1 1 Disabled 0 1 Bold marks the default value and configuration. 4.4 Timing Control of SDIO Slave The strapping pin MTDO and GPIO5 can be used to control the timing of SDIO slave, see Table 8 Timing Control of SDIO Slave. Table 8: Timing Control of SDIO Slave Edge behavior MTDO GPIO5 Falling edge sampling, falling edge output 0 0 Falling edge sampling, rising edge output 0 1 Rising edge sampling, falling edge output 1 0 Rising edge sampling, rising edge output 1 1 1 Bold marks the default value and configuration. 4.5 JTAG Signal Source Control If EFUSE_DISABLE_JTAG is set to 1, the source of JTAG signals can be disabled. 4.6 Chip Power-up and Reset Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, CHIP_PU – the pin used for power-up and reset – is pulled high to activate the chip. For information on CHIP_PU as well as power-up and reset timing, see Figure 7 and Table 9. V IL_nRST t ST BL t RST VDD3P3_RTC Min VDD CHIP_PU Figure 7: Visualization of Timing Parameters for Power-up and Reset Espressif Systems 16 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 4 Boot Configurations Table 9: Description of Timing Parameters for Power-up and Reset Parameter Description Min (µs) t ST BL Time reserved for the 3.3 V rails to stabilize before the CHIP_PU pin is pulled high to activate the chip 50 t RST Time reserved for CHIP_PU to stay below V IL_nRST to reset the chip (see Table 15) 50 For details, please refer to ESP32 Series Datasheet > Section Chip Power-up and Reset. Espressif Systems 17 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP32-PICO-V3-02 chip integrates a rich set of peripherals including SPI, I2S, UART, I2C, pulse count controller, TWAI ® , ADC, DAC, touch sensor, etc. To learn more about on-chip components, please refer to ESP32 Series Datasheet > Section Functional Description. Note: • The content below is sourced from ESP32 Series Datasheet > Section Functional Description. Some information may not be applicable to ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U as not all the IO signals are exposed on the module. • To learn more about peripheral signals, please refer to ESP32 Technical Reference Manual > Section Peripheral Signal List. 5.2 Digital Peripherals 5.2.1 General Purpose Input / Output Interface (GPIO) ESP32 has 34 GPIO pins which can be assigned various functions by programming the appropriate registers. There are several kinds of GPIOs: digital-only, analog-enabled, capacitive-touch-enabled, etc. Analog-enabled GPIOs and Capacitive-touch-enabled GPIOs can be configured as digital GPIOs. Most of the digital GPIOs can be configured as internal pull-up or pull-down, or set to high impedance. When configured as an input, the input value can be read through the register. The input can also be set to edge-trigger or level-trigger to generate CPU interrupts. Most of the digital IO pins are bi-directional, non-inverting and tristate, including input and output buffers with tristate control. These pins can be multiplexed with other functions, such as the SDIO, UART, SPI, etc. (More details can be found in ESP32 Series Datasheet > Appendix, Table IO_MUX. ) For low-power operations, the GPIOs can be set to hold their states. 5.2.2 Serial Peripheral Interface (SPI) ESP32 integrates four SPI controllers which can be used to communicate with external devices that use the SPI protocol. Controller SPI0 is used as a buffer for accessing external memory. Controller SPI1 can be used as a master. Controllers SPI2 and SPI3 can be configured as either a master or a slave. SPI1, SPI2, and SPI3 use signal buses prefixed with SPI, HSPI, and VSPI, respectively. Features of General Purpose SPI (GP-SPI) • Programmable data transfer length, in multiples of 1 byte • Four-line full-duplex/half-duplex communication and three-line half-duplex communication support • Master mode and slave mode • Programmable CPOL and CPHA Espressif Systems 18 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals • Programmable clock Pin Assignment For SPI, the pins are multiplexed with GPIO6 ~ GPIO11 via the IO MUX. For HSPI, the pins are multiplexed with GPIO2, GPIO4, GPIO12 ~ GPIO15 via the IO MUX. For VSPI, the pins are multiplexed with GPIO5, GPIO18 ~ GPIO19, GPIO21 ~ GPIO23 via the IO MUX. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.3 Universal Asynchronous Receiver Transmitter (UART) The UART in the ESP32 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It consists of two UARTs in the main system, and one low-power LP UART. Feature List • Programmable baud rates up to 5 MBaud • RAM shared by TX FIFOs and RX FIFOs • Supports input baud rate self-check • Support for various lengths of data bits and stop bits • Parity bit support • Asynchronous communication (RS232 and RS485) and IrDA support • Supports DMA to communicate data in high speed • Supports UART wake-up • Supports both software and hardware flow control Pin Assignment The pins for UART can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.4 I2C Interface ESP32 has two I2C bus interfaces which can serve as I2C master or slave, depending on the user’s configuration. Feature List • Two I2C controllers: one in the main system and one in the low-power system • Standard mode (100 Kbit/s) • Fast mode (400 Kbit/s) Espressif Systems 19 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals • Up to 5 MHz, yet constrained by SDA pull-up strength • Support for 7-bit and 10-bit addressing, as well as dual address mode • Supports continuous data transmission with disabled Serial Clock Line (SCL) • Supports programmable digital noise filter Users can program command registers to control I2C interfaces, so that they have more flexibility. Pin Assignment For regular I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.5 I2S Interface The I2S Controller in the ESP32 chip provides a flexible communication interface for streaming digital data in multimedia applications, particularly digital audio applications. Feature List • Master mode and slave mode • Full-duplex and half-duplex communications • A variety of audio standards supported • Configurable high-precision output clock • Supports PDM signal input and output • Configurable data transmit and receive modes Pin Assignment The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.6 Remote Control Peripheral The Remote Control Peripheral (RMT) controls the transmission and reception of infrared remote control signals. Feature List • Eight channels for sending and receiving infrared remote control signals • Independent transmission and reception capabilities for each channel • Clock divider counter, state machine, and receiver for each RX channel • Supports various infrared protocols Espressif Systems 20 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals Pin Assignment The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.7 Pulse Counter Controller (PCNT) The pulse counter controller (PCNT) is designed to count input pulses by tracking rising and falling edges of the input pulse signal. Feature List • Eight independent pulse counter units • Each pulse counter unit has a 16-bit signed counter register and two channels • Counter modes: increment, decrement, or disable • Glitch filtering for input pulse signals and control signals • Selection between counting on rising or falling edges of the input pulse signal Pin Assignment The pins for the Pulse Count Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.8 LED PWM Controller The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List • Sixteen independent PWM generators • Maximum PWM duty cycle resolution of 20 bits • Eight independent timers with 20-bit counters, configurable fractional clock dividers and counter overflow values • Adjustable phase of PWM signal output • PWM duty cycle dithering • Automatic duty cycle fading Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. Espressif Systems 21 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals 5.2.9 Motor Control PWM The Pulse Width Modulation (PWM) controller can be used for driving digital motors and smart lights. The controller consists of PWM timers, the PWM operator and a dedicated capture sub-module. Each timer provides timing in synchronous or independent form, and each PWM operator generates a waveform for one PWM channel. The dedicated capture sub-module can accurately capture events with external timing. Feature List • Three PWM timers for precise timing and frequency control – Every PWM timer has a dedicated 8-bit clock prescaler – The 16-bit counter in the PWM timer can work in count-up mode, count-down mode, or count-up-down mode – A hardware sync can trigger a reload on the PWM timer with a phase register. It will also trigger the prescaler’ restart, so that the timer’s clock can also be synced, with selectable hardware synchronization source • Three PWM operators for generating waveform pairs – Six PWM outputs to operate in several topologies – Configurable dead time on rising and falling edges; each set up independently – Modulating of PWM output by high-frequency carrier signals, useful when gate drivers are insulated with a transformer • Fault Detection module – Programmable fault handling in both cycle-by-cycle mode and one-shot mode – A fault condition can force the PWM output to either high or low logic levels • Capture module for hardware-based signal processing – Speed measurement of rotating machinery – Measurement of elapsed time between position sensor pulses – Period and duty cycle measurement of pulse train signals – Decoding current or voltage amplitude derived from duty-cycle-encoded signals of current/voltage sensors – Three individual capture channels, each of which with a 32-bit time-stamp register – Selection of edge polarity and prescaling of input capture signals – The capture timer can sync with a PWM timer or external signals Pin Assignment The pins for the Motor Control PWM can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. Espressif Systems 22 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals 5.2.10 SD/SDIO/MMC Host Controller An SD/SDIO/MMC host controller is available on ESP32. Feature List • Supports two external cards • Supports SD Memory Card standard: version 3.0 and version 3.01) • Supports SDIO Version 3.0 • Supports Consumer Electronics Advanced Transport Architecture (CE-ATA Version 1.1) • Supports Multimedia Cards (MMC version 4.41, eMMC version 4.5 and version 4.51) The controller allows up to 80 MHz clock output in three different data-bus modes: 1-bit, 4-bit, and 8-bit modes. It supports two SD/SDIO/MMC4.41 cards in a 4-bit data-bus mode. It also supports one SD card operating at 1.8 V. Pin Assignment The pins for SD/SDIO/MMC Host Controller are multiplexed with GPIO2, GPIO4, GPIO6 ~ GPIO15 via IO MUX. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.11 SDIO/SPI Slave Controller ESP32 integrates an SD device interface that conforms to the industry-standard SDIO Card Specification Version 2.0, and allows a host controller to access the SoC, using the SDIO bus interface and protocol. ESP32 acts as the slave on the SDIO bus. The host can access the SDIO-interface registers directly and can access shared memory via a DMA engine, thus maximizing performance without engaging the processor cores. Feature List The SDIO/SPI slave controller supports the following features: • SPI, 1-bit SDIO, and 4-bit SDIO transfer modes over the full clock range from 0 to 50 MHz • Configurable sampling and driving clock edge • Special registers for direct access by host • Interrupts to host for initiating data transfer • Automatic loading of SDIO bus data and automatic discarding of padding data • Block size of up to 512 bytes • Interrupt vectors between the host and the slave, allowing both to interrupt each other • Supports DMA for data transfer Espressif Systems 23 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals Pin Assignment The pins for SDIO/SPI Slave Controller are multiplexed with GPIO2, GPIO4, GPIO6 ~ GPIO15 via IO MUX. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.12 TWAI ® Controller The Two-wire Automotive Interface (TWAI ® ) is a multi-master, multi-cast communication protocol designed for automotive applications. The TWAI controller facilitates the communication based on this protocol. Feature List • Compatible with ISO 11898-1 protocol (CAN Specification 2.0) • Standard frame format (11-bit ID) and extended frame format (29-bit ID) • Bit rates: – From 25 Kbit/s to 1 Mbit/s in chip revision v0.0/v1.0/v1.1 – From 12.5 Kbit/s to 1 Mbit/s in chip revision v3.0/v3.1 • Multiple modes of operation: Normal, Listen Only, and Self-Test • 64-byte receive FIFO • Special transmissions: single-shot transmissions and self reception • Acceptance filter (single and dual filter modes) • Error detection and handling: error counters, configurable error interrupt threshold, error code capture, arbitration lost capture Pin Assignment The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.13 Ethernet MAC Interface An IEEE-802.3-2008-compliant Media Access Controller (MAC) is provided for Ethernet LAN communications. ESP32 requires an external physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.). The PHY is connected to ESP32 through 17 signals of MII or nine signals of RMII. Feature List • 10 Mbps and 100 Mbps rates • Dedicated DMA controller allowing high-speed transfer between the dedicated SRAM and Ethernet MAC • Tagged MAC frame (VLAN support) • Half-duplex (CSMA/CD) and full-duplex operation Espressif Systems 24 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals • MAC control sublayer (control frames) • 32-bit CRC generation and removal • Several address-filtering modes for physical and multicast address (multicast and group addresses) • 32-bit status code for each transmitted or received frame • Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive FIFO are both 512 words (32-bit) • Hardware PTP (Precision Time Protocol) in accordance with IEEE 1588 2008 (PTP V2) • 25 MHz/50 MHz clock output Pin Assignment For information about the pin assignment of Ethernet MAC Interface, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.3 Analog Peripherals 5.3.1 Analog-to-Digital Converter (ADC) ESP32 integrates two 12-bit SAR ADCs and supports measurements on 18 channels (analog-enabled pins). The ULP coprocessor in ESP32 is also designed to measure voltage, while operating in the sleep mode, which enables low-power consumption. The CPU can be woken up by a threshold setting and/or via other triggers. Table 10 describes the ADC characteristics. Table 10: ADC Characteristics Parameter Description Min Max Unit DNL (Differential nonlinearity) RTC controller; ADC connected to an –7 7 LSB external 100 nF capacitor; DC signal input; INL (Integral nonlinearity) ambient temperature at 25 °C; –12 12 LSB Wi-Fi&Bluetooth off Sampling rate RTC controller — 200 ksps DIG controller — 2 Msps Notes: • When atten = 3 and the measurement result is above 3000 (voltage at approx. 2450 mV), the ADC accuracy will be worse than described in the table above. • To get better DNL results, users can take multiple sampling tests with a filter, or calculate the average value. • The input voltage range of GPIO pins within VDD3P3_RTC domain should strictly follow the DC characteristics provided in Table 15. Otherwise, measurement errors may be introduced, and chip performance may be affected. By default, there are ±6% differences in measured results between chips. ESP-IDF provides couple of calibration methods for ADC1. Results after calibration using eFuse Vref value are shown in Table 11. For higher accuracy, users may apply other calibration methods provided in ESP-IDF, or implement their own. Espressif Systems 25 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals Table 11: ADC Calibration Results Parameter Description Min Max Unit Total error Atten = 0, effective measurement range of 100 ∼ 950 mV –23 23 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV –30 30 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV –40 40 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV –60 60 mV Pin Assignment With appropriate settings, the ADCs can be configured to measure voltage on 18 pins maximum. For detailed information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.3.2 Digital-to-Analog Converter (DAC) Two 8-bit DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The design structure is composed of integrated resistor strings and a buffer. This dual DAC supports power supply as input voltage reference. The two DAC channels can also support independent conversions. Pin Assignment The DAC can be configured by GPIO 25 and GPIO 26. For detailed information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.3.3 Touch Sensor ESP32 has 10 capacitive-sensing GPIOs, which detect variations induced by touching or approaching the GPIOs with a finger or other objects. The low-noise nature of the design and the high sensitivity of the circuit allow relatively small pads to be used. Arrays of pads can also be used, so that a larger area or more points can be detected. Pin Assignment The 10 capacitive-sensing GPIOs are listed in Table 12. Table 12: Capacitive-Sensing GPIOs Available on ESP32 Capacitive-Sensing Signal Name Pin Name T0 GPIO4 T1 GPIO0 T2 GPIO2 T3 MTDO T4 MTCK T5 MTDI T6 MTMS T7 GPIO27 T8 32K_XN Espressif Systems 26 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 5 Peripherals Capacitive-Sensing Signal Name Pin Name T9 32K_XP Note: ESP32 Touch Sensor has not passed the Conducted Susceptibility (CS) test for now, and thus has limited application scenarios. Espressif Systems 27 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 6 Electrical Characteristics 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Stresses above those listed in Table 13 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in Section 14 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 13: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST ORE Storage temperature –40 85 °C * For IO’s power domain, please see ESP32 Series Datasheet > Appendix IO MUX. 6.2 Recommended Operating Conditions Table 14: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T Operating ambient temperature –40 — 85 °C 6.3 DC Characteristics (3.3 V, 25 °C) Table 15: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH High-level output voltage 0.8 × VDD 1 — — V V OL Low-level output voltage — — 0.1 × VDD 1 V Cont’d on next page Espressif Systems 28 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 6 Electrical Characteristics Table 15 – cont’d from previous page Symbol Parameter Min Typ Max Unit I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) VDD3P3_CPU power domain 1, 2 — 40 — mA VDD3P3_RTC power domain 1, 2 — 40 — mA VDD_SDIO power domain 1, 3 — 20 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) — 28 — mA R P U Resistance of internal pull-up resistor — 45 — kΩ R P D Resistance of internal pull-down resistor — 45 — kΩ V IH_nRST Chip reset release voltage (CHIP_PU voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Low-level input voltage of CHIP_PU to shut down the chip — — 0.6 V 1 Please see Appendix IO MUX of ESP32 Series Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power domain of pins. 2 For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, V OH >=2.64 V, as the number of current-source pins increases. 3 Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 16: Current Consumption Depending on RF Modes Work mode Description Peak (mA) Active (RF working) TX 802.11b, 20 MHz, 1 Mbps, @19.5 dBm 368 802.11g, 20 MHz, 54 Mbps, @14 dBm 258 802.11n, 20 MHz, MCS7, @13 dBm 248 802.11n, 40 MHz, MCS7, @13 dBm 250 RX 802.11b/g/n, 20 MHz 111 802.11n, 40 MHz 117 Espressif Systems 29 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 6 Electrical Characteristics 6.4.2 Current Consumption in Other Modes Table 17: Current Consumption Depending on Work Modes Work mode Description Current consumption (Typ) Modem-sleep 1, 2 The CPU is powered on 3 240 MHz 30 ~ 68 mA 160 MHz 27 ~ 44 mA Normal speed: 80 MHz 20 ~ 31 mA Light-sleep — 0.8 mA Deep-sleep The ULP coprocessor is powered up 4 150 µA ULP sensor-monitored pattern 5 100 µA @1% duty RTC timer + RTC memory 10 µA RTC timer only 5 µA Power off CHIP_PU is set to low level, the chip is powered down 1 µA 1 The current consumption figures in Modem-sleep mode are for cases where the CPU is powered up and the cache idle. 2 When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current con- sumption changes accordingly. 3 In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and the peripherals used. 4 During Deep-sleep, when the ULP coprocessor is powered up, peripherals such as GPIO and RTC I2C are able to operate. 5 The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodically. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA. 6.5 Memory Specifications The data below is sourced from the memory vendor datasheet. These values are guaranteed through design and/or characterization but are not fully tested in production. Devices are shipped with the memory erased. Table 18: Flash Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.65 1.80 2.00 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz — Program/erase cycles 100,000 — — cycles T RET Data retention time 20 — — years T P P Page program time — 0.8 5 ms T SE Sector erase time (4 KB) — 70 500 ms T BE1 Block erase time (32 KB) — 0.2 2 s T BE2 Block erase time (64 KB) — 0.3 3 s T CE Chip erase time (16 Mb) — 7 20 s Chip erase time (32 Mb) — 20 60 s Cont’d on next page Espressif Systems 30 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 6 Electrical Characteristics Table 18 – cont’d from previous page Parameter Description Min Typ Max Unit Chip erase time (64 Mb) — 25 100 s Chip erase time (128 Mb) — 60 200 s Chip erase time (256 Mb) — 70 300 s Table 19: PSRAM Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.62 1.80 1.98 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz Espressif Systems 31 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio Table 20: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics Table 21: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 19.5 — 802.11b, 11 Mbps — 19.5 — 802.11g, 6 Mbps — 18.0 — 802.11g, 54 Mbps — 14.0 — 802.11n, HT20, MCS0 — 18.0 — 802.11n, HT20, MCS7 — 13.0 — 802.11n, HT40, MCS0 — 18.0 — 802.11n, HT40, MCS7 — 13.0 — Table 22: TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –26.5 –10.0 802.11b, 11 Mbps, CCK — –26.5 –10.0 802.11g, 6 Mbps, OFDM — –24.0 –5.0 802.11g, 54 Mbps, OFDM — –30.0 –25.0 802.11n, HT20, MCS0 — –24.0 –5.0 Cont’d on next page Espressif Systems 32 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics Table 22 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11n, HT20, MCS7 — –30.5 –27.0 802.11n, HT40, MCS0 — –24.0 –5.0 802.11n, HT40, MCS7 — –30.5 –27.0 1 EVM is measured at the corresponding typical TX power provided in Table 21 Wi-Fi RF Transmitter (TX) Characteristics above. 7.1.2 Wi-Fi RF Receiver (RX) Characteristics Table 23: RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –97.0 — 802.11b, 2 Mbps, DSSS — –94.0 — 802.11b, 5.5 Mbps, CCK — –92.0 — 802.11b, 11 Mbps, CCK — –88.0 — 802.11g, 6 Mbps, OFDM — –93.0 — 802.11g, 9 Mbps, OFDM — –91.0 — 802.11g, 12 Mbps, OFDM — –89.0 — 802.11g, 18 Mbps, OFDM — –87.0 — 802.11g, 24 Mbps, OFDM — –84.0 — 802.11g, 36 Mbps, OFDM — –80.0 — 802.11g, 48 Mbps, OFDM — –77.0 — 802.11g, 54 Mbps, OFDM — –75.0 — 802.11n, HT20, MCS0 — –92.0 — 802.11n, HT20, MCS1 — –88.0 — 802.11n, HT20, MCS2 — –86.0 — 802.11n, HT20, MCS3 — -83.0 — 802.11n, HT20, MCS4 — –80.0 — 802.11n, HT20, MCS5 — –76.0 — 802.11n, HT20, MCS6 — –74.0 — 802.11n, HT20, MCS7 — –72.0 — 802.11n, HT40, MCS0 — –89.0 — 802.11n, HT40, MCS1 — –85.0 — 802.11n, HT40, MCS2 — –83.0 — 802.11n, HT40, MCS3 — –80.0 — 802.11n, HT40, MCS4 — –76.0 — 802.11n, HT40, MCS5 — –72.0 — 802.11n, HT40, MCS6 — –71.0 — 802.11n, HT40, MCS7 — –69.0 — Espressif Systems 33 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics Table 24: Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 0 — 802.11g, 54 Mbps — –8 — 802.11n, HT20, MCS0 — 0 — 802.11n, HT20, MCS7 — –8 — 802.11n, HT40, MCS0 — 0 — 802.11n, HT40, MCS7 — –8 — Table 25: RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 35 — 802.11b, 11 Mbps, CCK — 35 — 802.11g, 6 Mbps, OFDM — 27 — 802.11g, 54 Mbps, OFDM — 13 — 802.11n, HT20, MCS0 — 27 — 802.11n, HT20, MCS7 — 12 — 802.11n, HT40, MCS0 — 16 — 802.11n, HT40, MCS7 — 7 — 7.2 Bluetooth Radio 7.2.1 Transmitter – Basic Data Rate Table 26: Transmitter Characteristics – Basic Data Rate Parameter Conditions Min Typ Max Unit RF transmit power * - - 0 - dBm Gain control step - - 3 - dB RF power control range - –12 - +9 dBm +20 dB bandwidth - - 0.9 - MHz Adjacent channel transmit power F = F0 ± 2 MHz - –55 - dBm F = F0 ± 3 MHz - –55 - dBm F = F0 ± > 3 MHz - –59 - dBm ∆ f1 avg - - - 155 kHz ∆ f2 max - 127 - - kHz ∆ f2 avg /∆ f1 avg - - 0.92 - - ICFT - - –7 - kHz Cont’d on next page Espressif Systems 34 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics Table 26 – cont’d from previous page Parameter Conditions Min Typ Max Unit Drift rate - - 0.7 - kHz/50 µs Drift (DH1) - - 6 - kHz Drift (DH5) - - 6 - kHz * There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9 dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding transmit power is 0 dBm. 7.2.2 Receiver – Basic Data Rate Table 27: Receiver Characteristics – Basic Data Rate Parameter Conditions Min Typ Max Unit Sensitivity @0.1% BER — –90 –89 –88 dBm Maximum received signal @0.1% BER — 0 — — dBm Co-channel C/I — — +7 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — — –6 dB F = F0 – 1 MHz — — –6 dB F = F0 + 2 MHz — — –25 dB F = F0 – 2 MHz — — –33 dB F = F0 + 3 MHz — — –25 dB F = F0 – 3 MHz — — –45 dB Cont’d on next page Espressif Systems 35 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics Table 27 – cont’d from previous page Parameter Conditions Min Typ Max Unit Out-of-band blocking performance 30 MHz ~ 2000 MHz –10 — — dBm 2000 MHz ~ 2400 MHz –27 — — dBm 2500 MHz ~ 3000 MHz –27 — — dBm 3000 MHz ~ 12.5 GHz –10 — — dBm Intermodulation — –36 — — dBm 7.2.3 Transmitter – Enhanced Data Rate Table 28: Transmitter Characteristics – Enhanced Data Rate Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 26) — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm π/4 DQPSK max w0 — — –0.72 — kHz π/4 DQPSK max wi — — –6 — kHz π/4 DQPSK max |wi + w0| — — –7.42 — kHz 8DPSK max w0 — — 0.7 — kHz 8DPSK max wi — — –9.6 — kHz 8DPSK max |wi + w0| — — –10 — kHz π/4 DQPSK modulation accuracy RMS DEVM — 4.28 — % 99% DEVM — 100 — % Peak DEVM — 13.3 — % 8 DPSK modulation accuracy RMS DEVM — 5.8 — % 99% DEVM — 100 — % Peak DEVM — 14 — % In-band spurious emissions F = F0 ± 1 MHz — –46 — dBm F = F0 ± 2 MHz — –44 — dBm F = F0 ± 3 MHz — –49 — dBm F = F0 +/– > 3 MHz — — –53 dBm EDR differential phase coding — — 100 — % 7.2.4 Receiver – Enhanced Data Rate Table 29: Receiver Characteristics – Enhanced Data Rate Parameter Conditions Min Typ Max Unit π/4 DQPSK Sensitivity @0.01% BER — –90 –89 –88 dBm Maximum received signal @0.01% BER — — 0 — dBm Co-channel C/I — — 11 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –7 — dB Cont’d on next page Espressif Systems 36 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics Table 29 – cont’d from previous page Parameter Conditions Min Typ Max Unit F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –35 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –45 — dB 8DPSK Sensitivity @0.01% BER — –84 –83 –82 dBm Maximum received signal @0.01% BER — — –5 — dBm C/I c-channel — — 18 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 2 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –25 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –38 — dB 7.3 Bluetooth LE Radio Table 30: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402 ~ 2480 MHz RF transmit power range –12.0 ~ 9.0 dBm 7.3.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 31: Transmitter Characteristics – BLE Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 26) — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm Adjacent channel transmit power F = F0 ± 2 MHz — –52 — dBm F = F0 ± 3 MHz — –58 — dBm F = F0 ± > 3 MHz — –60 — dBm ∆ f 1 avg — — — 265 kHz ∆ f2 max — 247 — — kHz ∆ f2 avg /∆ f1 avg — — +0.92 — — ICFT — — –10 — kHz Drift rate — — 0.7 — kHz/50 µs Drift — — 2 — kHz 7.3.2 Bluetooth LE RF Receiver (RX) Characteristics Espressif Systems 37 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 7 RF Characteristics Table 32: Receiver Characteristics – BLE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER — –94 –93 –92 dBm Maximum received signal @30.8% PER — 0 — — dBm Co-channel C/I — — +10 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –5 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –35 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –45 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz –10 — — dBm 2000 MHz ~ 2400 MHz –27 — — dBm 2500 MHz ~ 3000 MHz –27 — — dBm 3000 MHz ~ 12.5 GHz –10 — — dBm Intermodulation — –36 — — dBm Espressif Systems 38 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 8 Module Schematics 8 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. ESP32-PICO-MINI-02 (pin-out) IO23:SPIDI IO18:SPIWP CLK:FLASH_CLK CMD:FLASH_CS SD3:PSRAM_CLK SD2:PSRAM_CS IO17:SPIDO IO16:SPIHD IO13 IO15 IO2 IO4 IO7 IO8 IO5 IO19 IO22 U0TXD U0RXD IO21 EN RF_ANT LNA_IN IO21 U0RXD U0TXD IO22 IO19 IO5 IO8 IO7 IO20 I39 I38 I37 I36 I34 I35 IO32 EN IO33 IO25 IO26 IO27 IO14 IO12 IO13 IO15 IO2 IO0 IO4 IO0 I36 I37 I38 I39 I34 I35 IO25 IO14 IO12 IO32 IO33 IO26 IO27 IO20 GND GND GND GND GND GND VDD33 GND VDD33 VDD33 GND VDD33 GND Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary A4 2 2Monday, January 18, 2021 1.2 Title Size Page Name R ev Date: Sheet o f Confidential and Proprietary A4 2 2Monday, January 18, 2021 1.2 Title Size Page Name R ev Date: Sheet o f Confidential and Proprietary A4 2 2Monday, January 18, 2021 1.2 U1 ESP32-PICO-V3-02 VDDA 1 LNA_IN 2 VDDA3P3 3 VDDA3P3 4 SENSOR_VP/I36 5 SENSOR_CAPP/I37 6 SENSOR_CAPN/I38 7 SENSOR_VN/I39 8 EN 9 VDET_1/I34 10 VDET_2/I35 11 32K_XP/IO32 12 32K_XN/IO33 13 IO25 14 IO26 15 IO27 16 MTMS/IO14 17 MTDI/IO12 18 VDD3P3_RTC 19 MTCK/IO13 20 MTDO/IO15 21 IO2 22 IO0 23 IO4 24 VDD_SDIO 26 NC 25 IO20 27 SD2/IO9 28 SD3/IO10 29 CMD/IO11 30 CLK/IO6 31 SD0/IO7 32 GND 49 SD1/IO8 33 IO5 34 NC 35 IO19 38 NC 47 VDDA 43 NC 44 NC 45 NC 36 U0TXD/IO1 41 IO22 39 IO21 42 VDD3P3_CPU 37 NC 48 VDDA 46 U0RXD/IO3 40 C5 0.1uF C11 TBD ANT1 PCB_ANT 1 2 C12 TBD L2 TBD U2 ESP32-PICO-MINI-02 GND 1 3V3 3 IO0 23 I36 4 I37 5 I38 6 I39 7 I34 9 I35 10 IO25 15 IO26 16 IO27 17 IO14 18 IO12 19 NC 32 TXD0 31 RXD0 30 IO22 34 IO19 33 IO20 26 IO5 29 IO8 28 IO7 27 IO15 21 IO2 22 IO32 12 IO33 13 GND 52 IO13 20 IO21 35 IO4 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 D1 ESD C6 10uF Figure 8: ESP32-PICO-MINI-02 Schematics Espressif Systems 39 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 8 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. ESP32-PICO-MINI-02U(pin-out) IO23:SPIDI IO18:SPIWP CLK:FLASH_CLK CMD:FLASH_CS SD3:PSRAM_CLK SD2:PSRAM_CS IO17:SPIDO IO16:SPIHD IO13 IO15 IO2 IO4 IO7 IO8 IO5 IO19 IO22 U0TXD U0RXD IO21 EN RF_ANT LNA_IN IO21 U0RXD U0TXD IO22 IO19 IO5 IO8 IO7 IO20 I39 I38 I37 I36 I34 I35 IO32 EN IO33 IO25 IO26 IO27 IO14 IO12 IO13 IO15 IO2 IO0 IO4 IO0 I36 I37 I38 I39 I34 I35 IO25 IO14 IO12 IO32 IO33 IO26 IO27 IO20 GND GND GND GND GND GND VDD33 GND VDD33 VDD33 GND VDD33 GND Title Size Page Name R ev Date: Sheet o f Confidential and Proprietary <02_ESP32-PICO-MINI-02U> A4 2 2Thursday, April 01, 2021 1.0 Title Size Page Name R ev Date: Sheet o f Confidential and Proprietary <02_ESP32-PICO-MINI-02U> A4 2 2Thursday, April 01, 2021 1.0 Title Size Page Name R ev Date: Sheet o f Confidential and Proprietary <02_ESP32-PICO-MINI-02U> A4 2 2Thursday, April 01, 2021 1.0 U1 ESP32-PICO-V3-02 VDDA 1 LNA_IN 2 VDDA3P3 3 VDDA3P3 4 SENSOR_VP/I36 5 SENSOR_CAPP/I37 6 SENSOR_CAPN/I38 7 SENSOR_VN/I39 8 EN 9 VDET_1/I34 10 VDET_2/I35 11 32K_XP/IO32 12 32K_XN/IO33 13 IO25 14 IO26 15 IO27 16 MTMS/IO14 17 MTDI/IO12 18 VDD3P3_RTC 19 MTCK/IO13 20 MTDO/IO15 21 IO2 22 IO0 23 IO4 24 VDD_SDIO 26 NC 25 IO20 27 SD2/IO9 28 SD3/IO10 29 CMD/IO11 30 CLK/IO6 31 SD0/IO7 32 GND 49 SD1/IO8 33 IO5 34 NC 35 IO19 38 NC 47 VDDA 43 NC 44 NC 45 NC 36 U0TXD/IO1 41 IO22 39 IO21 42 VDD3P3_CPU 37 NC 48 VDDA 46 U0RXD/IO3 40 C5 0.1uF C11 TBD ANT1 IPEX 1 4 2 3 C12 TBD L2 TBD U2 ESP32-PICO-MINI-02U GND 1 3V3 3 IO0 23 I36 4 I37 5 I38 6 I39 7 I34 9 I35 10 IO25 15 IO26 16 IO27 17 IO14 18 IO12 19 NC 32 TXD0 31 RXD0 30 IO22 34 IO19 33 IO20 26 IO5 29 IO8 28 IO7 27 IO15 21 IO2 22 IO32 12 IO33 13 GND 52 IO13 20 IO21 35 IO4 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 C6 10uF D1 ESD Figure 9: ESP32-PICO-MINI-02U Schematics Espressif Systems 40 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. X1: ESR = Max. 70 KΩ IO12 should be kept low when the module is powered on. ESP32-PICO-MINI-02 ESP32-PICO-MINI-02U EN IO25 IO22 RXD0 TXD0 IO32 IO33 IO26 IO2 IO15 IO13 IO12 IO27 IO14 I36 TDIIO12 TCKIO13 TDOIO15 TMSIO14 IO21 IO19 IO5 IO8 IO7 IO20 I37 I38 I39 I34 I35 IO0 IO4 EN GND VDD33 GND GND VDD33 GND GND GND GND GND GND SW1 X1 32.768kHz(NC) 12 R2 0 C3 TBD R5 NC JP1 UART 1 1 2 2 3 3 4 4 C2 0.1uF R3 0(NC) R1 TBD C6 12pF(NC) C5 12pF(NC) JP3 JTAG 1 1 2 2 3 3 4 4 R4 0(NC) C4 0.1uF JP2 Boot Option 1 1 2 2 U1 GND 1 3V3 3 IO0 23 I36 4 I37 5 I38 6 I39 7 I34 9 I35 10 IO25 15 IO26 16 IO27 17 IO14 18 IO12 19 NC 32 TXD0 31 RXD0 30 IO22 34 IO19 33 IO20 26 IO5 29 IO8 28 IO7 27 IO15 21 IO2 22 IO32 12 IO33 13 GND 52 IO13 20 IO21 35 IO4 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 C1 22uF Figure 10: Peripheral Schematics • Soldering EPAD Pin 49 to the ground of the base board is not a must. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section 4.6 Chip Power-up and Reset. • UART0 is used to download firmware and log output. When using the AT firmware, please note that the UART GPIO is already configured (refer to Hardware Connection). It is recommended to use the default configuration. Espressif Systems 41 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 5.4 16.6±0.15 0.8 13.2±0.15 Top view Side view Bottom view 2.4±0.15 11.2 0.6 1.45 1.45 8.4 9.2 10 11.2 12.6 6.8 7.6 8.4 9 10.6 0.62 0.62 11.95 9.95 0.6 5.4 9.2 11 Ø0.5 Unit: mm Figure 11: ESP32-PICO-MINI-02 Physical Dimensions 5.4 11.2±0.15 0.8 13.2±0.15 Top view Side view Bottom view 0.6 1.45 1.45 8.4 9.2 10 11.2 12.6 6.8 7.6 8.4 9 10.6 12.25 0.6 5.4 9.2 11 Unit: mm 1.55 1.7 7.4 0.48 9.18 10.25 2.4±0.15 0.85 0.48 Figure 12: ESP32-PICO-MINI-02U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to ESP32 Module Packaging Information. Espressif Systems 42 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP32-PICO-MINI-02U uses the third generation external antenna connector as shown in Figure 13. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 13: Dimensions of External Antenna Connector The external antenna used for ESP32-PICO-MINI-02U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna Espressif Systems 43 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 10 Physical Dimensions based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 13 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 44 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 14 ESP32-PICO-MINI-02 Recommended PCB Land Pattern and Figure 15 ESP32-PICO-MINI-02U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 14 and Figure 15. You can view the source files for ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U with Autodesk Viewer. 10 6.8 9.2 Antenna Area Pin 1 11.2 0.6 10.6 9.2 7.6 8.4 5.4 11 12.6 8.4 13.2 16.6 1.45 5.4 1.450.6 11.2 9 Unit: mm : Pad Figure 14: ESP32-PICO-MINI-02 Recommended PCB Land Pattern Espressif Systems 45 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 11 PCB Layout Recommendations 10 6.8 9.2 Pin 1 0.6 10.6 9.2 7.6 8.4 5.4 11 12.6 8.4 13.2 11.2 1.45 5.4 1.450.6 11.2 9 Unit: mm : Pad Figure 15: ESP32-PICO-MINI-02U Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32 Hardware Design Guidelines > Section Positioning a Module on a Base Board. Espressif Systems 46 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Reflow Profile Solder the module in a single reflow. 50 150 0 25 1 ~ 3 ℃/s 0 200 250 200 –1 ~ –5 ℃/s Cooling zone 100 217 50 100 250 Reflow zone 217 ℃ 60 ~ 90 s Temperature (℃) Preheating zone 150 ~ 200 ℃ 60 ~ 120 s Ramp-up zone Peak Temp. 235 ~ 250 ℃ Soldering time > 30 s Time (sec.) Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 16: Reflow Profile Espressif Systems 47 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 48 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 49 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32 Series Datasheet – Specifications of the ESP32 hardware. • ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals. • ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product. • ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors. • ESP32 Series SoC Errata – Descriptions of known errors in ESP32 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns • ESP32 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32 Series SoCs – Browse through all ESP32 SoCs. https://espressif.com/en/products/socs?id=ESP32 • ESP32 Series Modules – Browse through all ESP32-based modules. https://espressif.com/en/products/modules?id=ESP32 • ESP32 Series DevKits – Browse through all ESP32-based devkits. https://espressif.com/en/products/devkits?id=ESP32 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 50 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 Revision History Revision History Date Version Release notes 2025-10-20 v1.6 • Section 2 Block Diagram: Added a note about pin mapping between the chip and the in-package flash/PSRAM • Updated Figure 5 Visualization of Timing Parameters for the Strapping Pins • Added Section 4.6 Chip Power-up and Reset • Table 15 DC Characteristics (3.3 V, 25 °C): Added V IH_nRST • Added Section 6.5 Memory Specifications • Added Section Datasheet Versioning 2025-07-15 v1.5 Section 10.2 Dimensions of External Antenna Connector: Added the external an- tenna information for certification 2025-03-19 v1.4 • Improved the wording and structure of following sections: – Updated Section Features and Series Comparison – Updated Section ”Strapping Pins” and renamed to Boot Configurations – Added Chapter 5 Peripherals – Section 7 RF Characteristics: * Updated Table ”Wi-Fi RF Standards” and renamed to Wi-Fi RF Characteristics * Added Table 22 TX EVM Test * Added Table 30 Bluetooth LE RF Characteristics – Section 9 Peripheral Schematics: Added a note about UART – Renamed Chapter ”Physical Dimensions and PCB Land Pattern” to Physical Dimensions and added Chapter 11 PCB Layout Recommen- dations 2023-11-21 v1.3 Section 9 Peripheral Schematics: Updated the note about EPAD soldering under the figure Section 11.1 PCB Land Pattern: Added the modules’ 2D PCB source files 2022-12-02 v1.2 Added Figure 5 and Table 5 in Section ”Strapping Pins” that was renamed into Boot Configurations Added Section 12.4 Ultrasonic Vibration 2022-03-28 v1.1 Added a link to RF certificates in Section Features Updated the description of TWAI in Section Features Updated Table 14 Recommended Operating Conditions 2021-07-15 v1.0 Added ESP32-PICO-MINI-02U module. Updated the document formatting. 2021-03-16 v0.5 Preliminary release Espressif Systems 51 Submit Documentation Feedback ESP32-PICO-MINI-02 & PICO-MINI-02U Datasheet v1.6 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. 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