1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 Internal LDO (VDD_SDIO) Voltage Control 4.3 U0TXD Printing Control 4.4 Timing Control of SDIO Slave 4.5 JTAG Signal Source Control 4.6 Chip Power-up and Reset 5 Peripherals 5.1 Peripheral Overview 5.2 Digital Peripherals 5.2.1 General Purpose Input / Output Interface (GPIO) 5.2.2 Serial Peripheral Interface (SPI) 5.2.3 Universal Asynchronous Receiver Transmitter (UART) 5.2.4 I2C Interface 5.2.5 I2S Interface 5.2.6 Remote Control Peripheral 5.2.7 Pulse Counter Controller (PCNT) 5.2.8 LED PWM Controller 5.2.9 Motor Control PWM 5.2.10 SD/SDIO/MMC Host Controller 5.2.11 SDIO/SPI Slave Controller 5.2.12 TWAI Controller 5.2.13 Ethernet MAC Interface 5.3 Analog Peripherals 5.3.1 Analog-to-Digital Converter (ADC) 5.3.2 Digital-to-Analog Converter (DAC) 5.3.3 Touch Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption in Active Mode 6.5 Memory Specifications 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 7.2 Bluetooth Radio 7.2.1 Receiver – Basic Data Rate 7.2.2 Transmitter – Basic Data Rate 7.2.3 Receiver – Enhanced Data Rate 7.2.4 Transmitter – Enhanced Data Rate 7.3 Bluetooth LE Radio 7.3.1 Bluetooth LE RF Receiver (RX) Characteristics 7.3.2 Bluetooth LE RF Transmitter (TX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Reflow Profile 12.4 Ultrasonic Vibration Datasheet Versioning Related Documentation and Resources Revision History ESP32-MINI-1 ESP32-MINI-1U Datasheet Version 1.7 2.4 GHz Wi-Fi + Bluetooth ® + Bluetooth LE module Built around ESP32 series of SoC, Xtensa ® dual-core 32-bit LX6 microprocessor 4 MB flash 28 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector ESP32-MINI-1 ESP32-MINI-1U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/sites/default/files/documentation/esp32-mini-1_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-U4WDH embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM • 520 KB SRAM • 16 KB SRAM in RTC Wi-Fi • 802.11b/g/n • Bit rate: 802.11n up to 150 Mbps • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support • Center frequency range of operating channel: 2412 ~ 2484 MHz Bluetooth ® • Bluetooth v4.2 BR/EDR and Bluetooth LE specification • Class-1, class-2, and class-3 transmitter • AFH • CVSD and SBC Peripherals • Up to 28 GPIOs – 5 strapping GPIOs – 6 GPIOs used for in-package flash – 6 input-only GPIOs • SD card, UART, SPI, SDIO, I2C, LED PWM, motor PWM, I2S, infrared remote controller, pulse counter, GPIO, touch sensor, ADC, DAC, Ethernet, TWAI ® (compatible with ISO 11898-1, i.e. CAN Specification 2.0) Integrated Components on Module • 40 MHz crystal oscillator • 4 MB SPI flash Antenna Options • ESP32-MINI-1: On-board PCB antenna • ESP32-MINI-1U: external antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: – 85 °C version module: –40 ~ 85 °C – 105 °C version module: –40 ~ 105 °C Certification • RF certification: See Certificates • Green certification: REACH/RoHS Test • Reliability: HTOL/HTSL/uHAST/TCT/ESD Espressif Systems 2 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 1 Module Overview 1.2 Series Comparison ESP32-MINI-1 and ESP32-MINI-1U are highly-integrated, small-sized Wi-Fi + Bluetooth + Bluetooth LE MCU modules that have a rich set of peripherals. The modules are ideal choices for a wide variety of IoT applications, ranging from home automation, smart building, consumer electronics to industrial control, especially suitable for applications within a compact space, such as bulbs, switches and sockets. ESP32-MINI-1 comes with an on-board PCB antenna, and ESP32-MINI-1U with a connector for external antenna. They both feature a 4 MB flash integrated in the chip’s package. Both ESP32-MINI-1 and ESP32-MINI-1U come in two versions: • 85 °C version • 105 °C version The two versions only vary in maximum ambient temperature. In this datasheet unless otherwise stated, ESP32-MINI-1 refers to both ESP32-MINI-1-N4 and ESP32-MINI-1-H4, whereas ESP32-MINI-1U refers to both ESP32-MINI-1U-N4 and ESP32-MINI-1U-H4. The series comparison for ESP32-MINI-1 and ESP32-MINI-1U is as follows: Table 1: ESP32-MINI-1 Series Comparison 1 Ambient Temp. 2 Size 3 Ordering Code Flash (°C) (mm) ESP32-MINI-1-N4 4 MB –40 ~ 85 13.2 × 19.0 × 2.4 ESP32-MINI-1-H4 4 MB –40 ~ 105 1 This table shares the same notes presented in Table 2 below. Table 2: ESP32-MINI-1U Series Comparison Ambient Temp. 2 Size 3 Ordering Code Flash 4 (°C) (mm) ESP32-MINI-1U-N4 4 MB –40 ~ 85 13.2 × 13.5 × 2.4 ESP32-MINI-1U-H4 4 MB –40 ~ 105 2 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espressif module. 3 For details, refer to Section 10.1 Module Dimensions. 4 For specifications, refer to Section 6.5 Memory Specifications. At the core of this module is ESP32-U4WDH, an Xtensa 32-bit LX6 CPU that operates at up to 240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or exceeding of thresholds. Note: • For more information on ESP32-U4WDH, please refer to ESP32 Series Datasheet. • For chip revision identification, ESP-IDF release that supports a specific chip revision, and other information on chip revisions, please refer to ESP32 Series SoC Errata > Section Chip Revision. Espressif Systems 3 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 1 Module Overview 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Audio Devices • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers • Cameras for Video Streaming • Speech Recognition • Image Recognition • SDIO Wi-Fi + Bluetooth Networking Card Espressif Systems 4 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 11 4 Boot Configurations 13 4.1 Chip Boot Mode Control 14 4.2 Internal LDO (VDD_SDIO) Voltage Control 15 4.3 U0TXD Printing Control 16 4.4 Timing Control of SDIO Slave 16 4.5 JTAG Signal Source Control 16 4.6 Chip Power-up and Reset 16 5 Peripherals 18 5.1 Peripheral Overview 18 5.2 Digital Peripherals 18 5.2.1 General Purpose Input / Output Interface (GPIO) 18 5.2.2 Serial Peripheral Interface (SPI) 18 5.2.3 Universal Asynchronous Receiver Transmitter (UART) 19 5.2.4 I2C Interface 19 5.2.5 I2S Interface 20 5.2.6 Remote Control Peripheral 20 5.2.7 Pulse Counter Controller (PCNT) 21 5.2.8 LED PWM Controller 21 5.2.9 Motor Control PWM 22 5.2.10 SD/SDIO/MMC Host Controller 23 5.2.11 SDIO/SPI Slave Controller 23 5.2.12 TWAI ® Controller 24 5.2.13 Ethernet MAC Interface 24 5.3 Analog Peripherals 25 5.3.1 Analog-to-Digital Converter (ADC) 25 5.3.2 Digital-to-Analog Converter (DAC) 26 5.3.3 Touch Sensor 26 6 Electrical Characteristics 28 6.1 Absolute Maximum Ratings 28 6.2 Recommended Operating Conditions 28 Espressif Systems 5 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Contents 6.3 DC Characteristics (3.3 V, 25 °C) 28 6.4 Current Consumption in Active Mode 29 6.5 Memory Specifications 30 7 RF Characteristics 31 7.1 Wi-Fi Radio 31 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 31 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 32 7.2 Bluetooth Radio 33 7.2.1 Receiver – Basic Data Rate 33 7.2.2 Transmitter – Basic Data Rate 34 7.2.3 Receiver – Enhanced Data Rate 34 7.2.4 Transmitter – Enhanced Data Rate 35 7.3 Bluetooth LE Radio 35 7.3.1 Bluetooth LE RF Receiver (RX) Characteristics 36 7.3.2 Bluetooth LE RF Transmitter (TX) Characteristics 36 8 Module Schematics 37 9 Peripheral Schematics 39 10 Physical Dimensions 40 10.1 Module Dimensions 40 10.2 Dimensions of External Antenna Connector 41 11 PCB Layout Recommendations 43 11.1 PCB Land Pattern 43 11.2 Module Placement for PCB Design 44 12 Product Handling 45 12.1 Storage Conditions 45 12.2 Electrostatic Discharge (ESD) 45 12.3 Reflow Profile 45 12.4 Ultrasonic Vibration 46 Datasheet Versioning 47 Related Documentation and Resources 48 Revision History 49 Espressif Systems 6 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 List of Tables List of Tables 1 ESP32-MINI-1 Series Comparison 1 3 2 ESP32-MINI-1U Series Comparison 3 3 Pin Definitions 11 4 Default Configuration of Strapping Pins 13 5 Description of Timing Parameters for the Strapping Pins 14 6 Chip Boot Mode Control 14 7 U0TXD Printing Control 16 8 Timing Control of SDIO Slave 16 9 Description of Timing Parameters for Power-up and Reset 17 10 ADC Characteristics 25 11 ADC Calibration Results 26 12 Capacitive-Sensing GPIOs Available on ESP32 26 13 Absolute Maximum Ratings 28 14 Recommended Operating Conditions 28 15 DC Characteristics (3.3 V, 25 °C) 28 16 Current Consumption Depending on RF Modes 29 17 Flash Specifications 30 18 Wi-Fi RF Characteristics 31 19 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 31 20 TX EVM Test 1 31 21 RX Sensitivity 32 22 Maximum RX Level 33 23 RX Adjacent Channel Rejection 33 24 Receiver Characteristics – Basic Data Rate 33 25 Transmitter Characteristics – Basic Data Rate 34 26 Receiver Characteristics – Enhanced Data Rate 34 27 Transmitter Characteristics – Enhanced Data Rate 35 28 Bluetooth LE RF Characteristics 36 29 Receiver Characteristics – Bluetooth LE 36 30 Transmitter Characteristics – Bluetooth LE 36 Espressif Systems 7 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 List of Figures List of Figures 1 ESP32-MINI-1 Block Diagram 9 2 ESP32-MINI-1U Block Diagram 9 3 ESP32-MINI-1 Pin Layout (Top View) 10 4 ESP32-MINI-1U Pin Layout (Top View) 11 5 Visualization of Timing Parameters for the Strapping Pins 14 6 Chip Boot Flow 15 7 Visualization of Timing Parameters for Power-up and Reset 16 8 ESP32-MINI-1 Schematics 37 9 ESP32-MINI-1U Schematics 38 10 Peripheral Schematics 39 11 ESP32-MINI-1 Physical Dimensions 40 12 ESP32-MINI-1U Physical Dimensions 40 13 Dimensions of External Antenna Connector 41 14 ESP32-MINI-1 Recommended PCB Land Pattern 43 15 ESP32-MINI-1U PCB Recommended PCB Land Pattern 44 16 Reflow Profile 45 Espressif Systems 8 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 2 Block Diagram 2 Block Diagram SPI Flash ESP32-U4WDH RF Matching 40 MHz Crystal 3V3 ESP32-MINI-1 EN GPIOs Antenna Figure 1: ESP32-MINI-1 Block Diagram SPI Flash ESP32-U4WDH RF Matching 40 MHz Crystal 3V3 ESP32-MINI-1U EN GPIOs Antenna Figure 2: ESP32-MINI-1U Block Diagram Note: For the pin mapping between the chip and the in-package flash/PSRAM, please refer to ESP32 Series Datasheet > Table Pin Mapping Between Chip and In-package Flash/PSRAM. Espressif Systems 9 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagrams below show the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10.1 Module Dimensions. Keepout Zone Pin 55 GND GNDGNDGND GND GND GNDGNDGND GND 3V3 I37 I38 I39 EN I34 I35 IO32 GND I36 IO33 IO25 IO26 IO27 IO14 IO12 IO13 IO15 IO2 IO0 IO4 NC NC IO9 IO10 GND IO23 NC IO19 IO22 IO21 RXD0 TXD0 NC GND GND GND IO18 IO5 GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32 Pin 33 Pin 34 Pin 35 Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 46 Pin 47 Pin 48 Pin 49 Pin 50 Pin 51 Pin 52 Pin 53 Pin 54 Figure 3: ESP32-MINI-1 Pin Layout (Top View) Espressif Systems 10 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 3 Pin Definitions Pin 55 GND GNDGNDGND GND GNDGNDGND GND 3V3 I37 I38 I39 EN I34 I35 IO32 GND I36 IO33 IO25 IO26 IO27 IO14 IO12 IO13 IO15 IO2 IO0 IO4 NC NC IO9 IO10 GND IO23 NC IO19 IO22 IO21 RXD0 TXD0 NC GND GND GND IO18 IO5 GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32 Pin 33 Pin 34 Pin 35 Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 46 Pin 47 Pin 48 Pin 49 Pin 50 Pin 51 Pin 52 Pin 53 Pin 54 Figure 4: ESP32-MINI-1U Pin Layout (Top View) 3.2 Pin Description ESP32-MINI-1 and ESP32-MINI-1U each has 55 pins. See pin definitions in Table 3 Pin Description. For peripheral pin configurations, please refer to Section 5.2 Digital Peripherals. Table 3: Pin Definitions Name No. Type * Function GND 1, 2, 27, 38 ~ 55 P Ground 3V3 3 P Power supply I36 4 I GPIO36, ADC1_CH0, RTC_GPIO0 I37 5 I GPIO37, ADC1_CH1, RTC_GPIO1 I38 6 I GPIO38, ADC1_CH2, RTC_GPIO2 I39 7 I GPIO39, ADC1_CH3, RTC_GPIO3 EN 8 I High: enables the chip Low: the chip shuts down Note: do not leave the pin floating I34 9 I GPIO34, ADC1_CH6, RTC_GPIO4 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 3 Pin Definitions Table 3 – cont’d from previous page Name No. Type Function I35 10 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 11 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 IO33 12 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 IO25 13 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 14 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 15 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 16 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 IO12 17 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 IO13 18 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER IO15 19 I/O GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3 IO2 20 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 IO0 21 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK IO4 22 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER NC 23 - No connect NC 24 - No connect IO9 25 I/O GPIO9, HS1_DATA2, U1RXD, SD_DATA2 IO10 26 I/O GPIO10, HS1_DATA3, U1TXD, SD_DATA3 NC 28 - No connect IO5 29 I/O GPIO5, HS1_DATA6, VSPICS0, EMAC_RX_CLK IO18 30 I/O GPIO18, HS1_DATA7, VSPICLK IO23 31 I/O GPIO23, HS1_STROBE, VSPID IO19 32 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 IO22 33 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO21 34 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 35 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 36 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 NC 37 - No connect * Pins GPIO6, GPIO7, GPIO8, GPIO11, GPIO16, and GPIO17 on the ESP32-U4WDH chip are connected to the SPI flash integrated in the chip and cannot be used for other purposes except for connecting external PSRAM. * P: power supply; I: input; O: output. Highligted cells : Input only pins, output is not supported due to lack of pull-up/pull-down resistors. Espressif Systems 12 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32 Series Datasheet > Section Boot Configurations. For the strapping pin map- ping between the chip and modules, please refer to Chapter 8 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO0 and GPIO2 • Internal LDO (VDD_SDIO) Voltage – Strapping pin: MTDI – eFuse bit: EFUSE_SDIO_FORCE and EFUSE_SDIO_TIEH • U0TXD printing – Strapping pin: MTDO • Timing of SDIO Slave – Strapping pin: MTDO and GPIO5 • JTAG signal source – eFuse bit: EFUSE_DISABLE_JTAG The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to program eFuse bits, please refer to ESP32 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Pull-up 1 GPIO2 Pull-down 0 MTDI Pull-down 0 MTDO Pull-up 1 GPIO5 Pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in Espressif Systems 13 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 4 Boot Configurations any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 5 and Figure 5. Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_PU pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. 1 Strapping pin V IH_nRST V IH t SU t H CHIP_PU Figure 5: Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO0 and GPIO2 control the boot mode after the reset is released. See Table 6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO0 GPIO2 SPI Boot Mode 1 Any value Joint Download Boot Mode 2 0 0 1 Bold marks the default value and configuration. 2 Joint Download Boot mode supports the following download methods: • SDIO Download Boot • UART Download Boot In Joint Download Boot mode, the detailed boot flow of the chip is put below 6. Espressif Systems 14 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 4 Boot Configurations Figure 6: Chip Boot Flow uart_download_dis controls boot mode behaviors: It permanently disables Download Boot mode when uart_download_dis is set to 1 (valid only for ESP32 chip revisions v3.0 and higher). 4.2 Internal LDO (VDD_SDIO) Voltage Control MTDI is used to select the VDD_SDIO power supply voltage at reset: • MTDI = 0 (by default), VDD_SDIO pin is powered directly from VDD3P3_RTC. Typically this voltage is 3.3 V. For more information, see ESP32 Series Datasheet > Section Power Scheme. • MTDI = 1, VDD_SDIO pin is powered from internal 1.8 V LDO. This functionality can be overridden by setting EFUSE_SDIO_FORCE to 1, in which case the EFUSE_SDIO_TIEH determines the VDD_SDIO voltage: • EFUSE_SDIO_TIEH = 0, VDD_SDIO connects to 1.8 V LDO. • EFUSE_SPI_TIEH = 1, VDD_SDIO connects to VDD3P3_RTC. Espressif Systems 15 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 4 Boot Configurations 4.3 U0TXD Printing Control During booting, the strapping pin MTDO can be used to control the U0TXD Printing, as Table 7 shows. Table 7: U0TXD Printing Control U0TXD Printing Control MTDO Enabled 1 1 Disabled 0 1 Bold marks the default value and configuration. 4.4 Timing Control of SDIO Slave The strapping pin MTDO and GPIO5 can be used to control the timing of SDIO slave, see Table 8 Timing Control of SDIO Slave. Table 8: Timing Control of SDIO Slave Edge behavior MTDO GPIO5 Falling edge sampling, falling edge output 0 0 Falling edge sampling, rising edge output 0 1 Rising edge sampling, falling edge output 1 0 Rising edge sampling, rising edge output 1 1 1 Bold marks the default value and configuration. 4.5 JTAG Signal Source Control If EFUSE_DISABLE_JTAG is set to 1, the source of JTAG signals can be disabled. 4.6 Chip Power-up and Reset Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, CHIP_PU – the pin used for power-up and reset – is pulled high to activate the chip. For information on CHIP_PU as well as power-up and reset timing, see Figure 7 and Table 9. V IL_nRST t ST BL t RST VDD3P3_RTC Min VDD CHIP_PU Figure 7: Visualization of Timing Parameters for Power-up and Reset Espressif Systems 16 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 4 Boot Configurations Table 9: Description of Timing Parameters for Power-up and Reset Parameter Description Min (µs) t ST BL Time reserved for the 3.3 V rails to stabilize before the CHIP_PU pin is pulled high to activate the chip 50 t RST Time reserved for CHIP_PU to stay below V IL_nRST to reset the chip (see Table 15) 50 For details, please refer to ESP32 Series Datasheet > Section Chip Power-up and Reset. Espressif Systems 17 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP32-U4WDH chip integrate a rich set of peripherals including SPI, I2S, UART, I2C, pulse count controller, TWAI ® , ADC, DAC, touch sensor, etc. To learn more about on-chip components, please refer to ESP32 Series Datasheet > Section Functional Description. Note: • The content below is sourced from ESP32 Series Datasheet > Section Functional Description. Some information may not be applicable to ESP32-MINI-1 and ESP32-MINI-1U as not all the IO signals are exposed on the module. • To learn more about peripheral signals, please refer to ESP32 Technical Reference Manual > Section Peripheral Signal List. 5.2 Digital Peripherals 5.2.1 General Purpose Input / Output Interface (GPIO) ESP32 has 34 GPIO pins which can be assigned various functions by programming the appropriate registers. There are several kinds of GPIOs: digital-only, analog-enabled, capacitive-touch-enabled, etc. Analog-enabled GPIOs and Capacitive-touch-enabled GPIOs can be configured as digital GPIOs. Most of the digital GPIOs can be configured as internal pull-up or pull-down, or set to high impedance. When configured as an input, the input value can be read through the register. The input can also be set to edge-trigger or level-trigger to generate CPU interrupts. Most of the digital IO pins are bi-directional, non-inverting and tristate, including input and output buffers with tristate control. These pins can be multiplexed with other functions, such as the SDIO, UART, SPI, etc. (More details can be found in ESP32 Series Datasheet > Appendix, Table IO_MUX. ) For low-power operations, the GPIOs can be set to hold their states. 5.2.2 Serial Peripheral Interface (SPI) ESP32 integrates four SPI controllers which can be used to communicate with external devices that use the SPI protocol. Controller SPI0 is used as a buffer for accessing external memory. Controller SPI1 can be used as a master. Controllers SPI2 and SPI3 can be configured as either a master or a slave. SPI1, SPI2, and SPI3 use signal buses prefixed with SPI, HSPI, and VSPI, respectively. Features of General Purpose SPI (GP-SPI) • Programmable data transfer length, in multiples of 1 byte • Four-line full-duplex/half-duplex communication and three-line half-duplex communication support • Master mode and slave mode • Programmable CPOL and CPHA • Programmable clock Espressif Systems 18 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals Pin Assignment For SPI, the pins are multiplexed with GPIO6 ~ GPIO11 via the IO MUX. For HSPI, the pins are multiplexed with GPIO2, GPIO4, GPIO12 ~ GPIO15 via the IO MUX. For VSPI, the pins are multiplexed with GPIO5, GPIO18 ~ GPIO19, GPIO21 ~ GPIO23 via the IO MUX. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.3 Universal Asynchronous Receiver Transmitter (UART) The UART in the ESP32 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It consists of two UARTs in the main system, and one low-power LP UART. Feature List • Programmable baud rates up to 5 MBaud • RAM shared by TX FIFOs and RX FIFOs • Supports input baud rate self-check • Support for various lengths of data bits and stop bits • Parity bit support • Asynchronous communication (RS232 and RS485) and IrDA support • Supports DMA to communicate data in high speed • Supports UART wake-up • Supports both software and hardware flow control Pin Assignment The pins for UART can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.4 I2C Interface ESP32 has two I2C bus interfaces which can serve as I2C master or slave, depending on the user’s configuration. Feature List • Two I2C controllers: one in the main system and one in the low-power system • Standard mode (100 Kbit/s) • Fast mode (400 Kbit/s) • Up to 5 MHz, yet constrained by SDA pull-up strength Espressif Systems 19 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals • Support for 7-bit and 10-bit addressing, as well as dual address mode • Supports continuous data transmission with disabled Serial Clock Line (SCL) • Supports programmable digital noise filter Users can program command registers to control I2C interfaces, so that they have more flexibility. Pin Assignment For regular I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.5 I2S Interface The I2S Controller in the ESP32 chip provides a flexible communication interface for streaming digital data in multimedia applications, particularly digital audio applications. Feature List • Master mode and slave mode • Full-duplex and half-duplex communications • A variety of audio standards supported • Configurable high-precision output clock • Supports PDM signal input and output • Configurable data transmit and receive modes Pin Assignment The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.6 Remote Control Peripheral The Remote Control Peripheral (RMT) controls the transmission and reception of infrared remote control signals. Feature List • Eight channels for sending and receiving infrared remote control signals • Independent transmission and reception capabilities for each channel • Clock divider counter, state machine, and receiver for each RX channel • Supports various infrared protocols Espressif Systems 20 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals Pin Assignment The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.7 Pulse Counter Controller (PCNT) The pulse counter controller (PCNT) is designed to count input pulses by tracking rising and falling edges of the input pulse signal. Feature List • Eight independent pulse counter units • Each pulse counter unit has a 16-bit signed counter register and two channels • Counter modes: increment, decrement, or disable • Glitch filtering for input pulse signals and control signals • Selection between counting on rising or falling edges of the input pulse signal Pin Assignment The pins for the Pulse Count Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.8 LED PWM Controller The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List • Sixteen independent PWM generators • Maximum PWM duty cycle resolution of 20 bits • Eight independent timers with 20-bit counters, configurable fractional clock dividers and counter overflow values • Adjustable phase of PWM signal output • PWM duty cycle dithering • Automatic duty cycle fading Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. Espressif Systems 21 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals 5.2.9 Motor Control PWM The Pulse Width Modulation (PWM) controller can be used for driving digital motors and smart lights. The controller consists of PWM timers, the PWM operator and a dedicated capture sub-module. Each timer provides timing in synchronous or independent form, and each PWM operator generates a waveform for one PWM channel. The dedicated capture sub-module can accurately capture events with external timing. Feature List • Three PWM timers for precise timing and frequency control – Every PWM timer has a dedicated 8-bit clock prescaler – The 16-bit counter in the PWM timer can work in count-up mode, count-down mode, or count-up-down mode – A hardware sync can trigger a reload on the PWM timer with a phase register. It will also trigger the prescaler’ restart, so that the timer’s clock can also be synced, with selectable hardware synchronization source • Three PWM operators for generating waveform pairs – Six PWM outputs to operate in several topologies – Configurable dead time on rising and falling edges; each set up independently – Modulating of PWM output by high-frequency carrier signals, useful when gate drivers are insulated with a transformer • Fault Detection module – Programmable fault handling in both cycle-by-cycle mode and one-shot mode – A fault condition can force the PWM output to either high or low logic levels • Capture module for hardware-based signal processing – Speed measurement of rotating machinery – Measurement of elapsed time between position sensor pulses – Period and duty cycle measurement of pulse train signals – Decoding current or voltage amplitude derived from duty-cycle-encoded signals of current/voltage sensors – Three individual capture channels, each of which with a 32-bit time-stamp register – Selection of edge polarity and prescaling of input capture signals – The capture timer can sync with a PWM timer or external signals Pin Assignment The pins for the Motor Control PWM can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. Espressif Systems 22 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals 5.2.10 SD/SDIO/MMC Host Controller An SD/SDIO/MMC host controller is available on ESP32. Feature List • Supports two external cards • Supports SD Memory Card standard: version 3.0 and version 3.01) • Supports SDIO Version 3.0 • Supports Consumer Electronics Advanced Transport Architecture (CE-ATA Version 1.1) • Supports Multimedia Cards (MMC version 4.41, eMMC version 4.5 and version 4.51) The controller allows up to 80 MHz clock output in three different data-bus modes: 1-bit, 4-bit, and 8-bit modes. It supports two SD/SDIO/MMC4.41 cards in a 4-bit data-bus mode. It also supports one SD card operating at 1.8 V. Pin Assignment The pins for SD/SDIO/MMC Host Controller are multiplexed with GPIO2, GPIO4, GPIO6 ~ GPIO15 via IO MUX. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.11 SDIO/SPI Slave Controller ESP32 integrates an SD device interface that conforms to the industry-standard SDIO Card Specification Version 2.0, and allows a host controller to access the SoC, using the SDIO bus interface and protocol. ESP32 acts as the slave on the SDIO bus. The host can access the SDIO-interface registers directly and can access shared memory via a DMA engine, thus maximizing performance without engaging the processor cores. Feature List The SDIO/SPI slave controller supports the following features: • SPI, 1-bit SDIO, and 4-bit SDIO transfer modes over the full clock range from 0 to 50 MHz • Configurable sampling and driving clock edge • Special registers for direct access by host • Interrupts to host for initiating data transfer • Automatic loading of SDIO bus data and automatic discarding of padding data • Block size of up to 512 bytes • Interrupt vectors between the host and the slave, allowing both to interrupt each other • Supports DMA for data transfer Espressif Systems 23 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals Pin Assignment The pins for SDIO/SPI Slave Controller are multiplexed with GPIO2, GPIO4, GPIO6 ~ GPIO15 via IO MUX. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.12 TWAI ® Controller The Two-wire Automotive Interface (TWAI ® ) is a multi-master, multi-cast communication protocol designed for automotive applications. The TWAI controller facilitates the communication based on this protocol. Feature List • Compatible with ISO 11898-1 protocol (CAN Specification 2.0) • Standard frame format (11-bit ID) and extended frame format (29-bit ID) • Bit rates: – From 25 Kbit/s to 1 Mbit/s in chip revision v0.0/v1.0/v1.1 – From 12.5 Kbit/s to 1 Mbit/s in chip revision v3.0/v3.1 • Multiple modes of operation: Normal, Listen Only, and Self-Test • 64-byte receive FIFO • Special transmissions: single-shot transmissions and self reception • Acceptance filter (single and dual filter modes) • Error detection and handling: error counters, configurable error interrupt threshold, error code capture, arbitration lost capture Pin Assignment The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.2.13 Ethernet MAC Interface An IEEE-802.3-2008-compliant Media Access Controller (MAC) is provided for Ethernet LAN communications. ESP32 requires an external physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.). The PHY is connected to ESP32 through 17 signals of MII or nine signals of RMII. Feature List • 10 Mbps and 100 Mbps rates • Dedicated DMA controller allowing high-speed transfer between the dedicated SRAM and Ethernet MAC • Tagged MAC frame (VLAN support) • Half-duplex (CSMA/CD) and full-duplex operation Espressif Systems 24 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals • MAC control sublayer (control frames) • 32-bit CRC generation and removal • Several address-filtering modes for physical and multicast address (multicast and group addresses) • 32-bit status code for each transmitted or received frame • Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive FIFO are both 512 words (32-bit) • Hardware PTP (Precision Time Protocol) in accordance with IEEE 1588 2008 (PTP V2) • 25 MHz/50 MHz clock output Pin Assignment For information about the pin assignment of Ethernet MAC Interface, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.3 Analog Peripherals 5.3.1 Analog-to-Digital Converter (ADC) ESP32 integrates two 12-bit SAR ADCs and supports measurements on 18 channels (analog-enabled pins). The ULP coprocessor in ESP32 is also designed to measure voltage, while operating in the sleep mode, which enables low-power consumption. The CPU can be woken up by a threshold setting and/or via other triggers. Table 10 describes the ADC characteristics. Table 10: ADC Characteristics Parameter Description Min Max Unit DNL (Differential nonlinearity) RTC controller; ADC connected to an –7 7 LSB external 100 nF capacitor; DC signal input; INL (Integral nonlinearity) ambient temperature at 25 °C; –12 12 LSB Wi-Fi&Bluetooth off Sampling rate RTC controller — 200 ksps DIG controller — 2 Msps Notes: • When atten = 3 and the measurement result is above 3000 (voltage at approx. 2450 mV), the ADC accuracy will be worse than described in the table above. • To get better DNL results, users can take multiple sampling tests with a filter, or calculate the average value. • The input voltage range of GPIO pins within VDD3P3_RTC domain should strictly follow the DC characteristics provided in Table 15. Otherwise, measurement errors may be introduced, and chip performance may be affected. By default, there are ±6% differences in measured results between chips. ESP-IDF provides couple of calibration methods for ADC1. Results after calibration using eFuse Vref value are shown in Table 11. For higher accuracy, users may apply other calibration methods provided in ESP-IDF, or implement their own. Espressif Systems 25 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals Table 11: ADC Calibration Results Parameter Description Min Max Unit Total error Atten = 0, effective measurement range of 100 ∼ 950 mV –23 23 mV Atten = 1, effective measurement range of 100 ∼ 1250 mV –30 30 mV Atten = 2, effective measurement range of 150 ∼ 1750 mV –40 40 mV Atten = 3, effective measurement range of 150 ∼ 2450 mV –60 60 mV Pin Assignment With appropriate settings, the ADCs can be configured to measure voltage on 18 pins maximum. For detailed information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.3.2 Digital-to-Analog Converter (DAC) Two 8-bit DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The design structure is composed of integrated resistor strings and a buffer. This dual DAC supports power supply as input voltage reference. The two DAC channels can also support independent conversions. Pin Assignment The DAC can be configured by GPIO 25 and GPIO 26. For detailed information about the pin assignment, see ESP32 Series Datasheet > Section Peripheral Pin Configurations and ESP32 Technical Reference Manual > Chapter IO_MUX and GPIO Matrix. 5.3.3 Touch Sensor ESP32 has 10 capacitive-sensing GPIOs, which detect variations induced by touching or approaching the GPIOs with a finger or other objects. The low-noise nature of the design and the high sensitivity of the circuit allow relatively small pads to be used. Arrays of pads can also be used, so that a larger area or more points can be detected. Pin Assignment The 10 capacitive-sensing GPIOs are listed in Table 12. Table 12: Capacitive-Sensing GPIOs Available on ESP32 Capacitive-Sensing Signal Name Pin Name T0 GPIO4 T1 GPIO0 T2 GPIO2 T3 MTDO T4 MTCK T5 MTDI T6 MTMS T7 GPIO27 T8 32K_XN Espressif Systems 26 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 5 Peripherals Capacitive-Sensing Signal Name Pin Name T9 32K_XP Note: ESP32 Touch Sensor has not passed the Conducted Susceptibility (CS) test for now, and thus has limited application scenarios. Espressif Systems 27 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 6 Electrical Characteristics 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Stresses above those listed in Absolute Maximum Ratings Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 14 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 13: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST ORE Storage temperature –40 105 °C * Please see Appendix IO MUX of ESP32 Series Datasheet for IO’s power do- main. 6.2 Recommended Operating Conditions Table 14: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T Operating ambient temperature 85 °C version –40 — 85 °C 105 °C version 105 6.3 DC Characteristics (3.3 V, 25 °C) Table 15: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH High-level output voltage 0.8 × VDD 1 — — V V OL Low-level output voltage — — 0.1 × VDD 1 V Cont’d on next page Espressif Systems 28 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 6 Electrical Characteristics Table 15 – cont’d from previous page Symbol Parameter Min Typ Max Unit I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, output drive strength set to the maximum) VDD3P3_CPU power domain 1, 2 — 40 — mA VDD3P3_RTC power domain 1, 2 — 40 — mA VDD_SDIO power domain 1, 3 — 20 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, output drive strength set to the maximum) — 28 — mA R P U Resistance of internal pull-up resistor — 45 — kΩ R P D Resistance of internal pull-down resistor — 45 — kΩ V IH_nRST Chip reset release voltage (CHIP_PU voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Low-level input voltage of CHIP_PU to shut down the chip — — 0.6 V 1 Please see Appendix IO MUX of ESP32 Series Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power domain of pins. 2 For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, V OH >=2.64 V, as the number of current-source pins increases. 3 Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 6.4 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 16: Current Consumption Depending on RF Modes Work Mode Description Peak (mA) Active (RF working) TX 802.11b, 20 MHz, 1 Mbps, @19.5 dBm 379 802.11g, 20 MHz, 54 Mbps, @15 dBm 276 802.11n, 20 MHz, MCS7, @13 dBm 258 802.11n, 40 MHz, MCS7, @13 dBm 260 RX 802.11b/g/n, 20 MHz 112 802.11n, 40 MHz 118 Owing to the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32 Series Datasheet. Espressif Systems 29 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 6 Electrical Characteristics 6.5 Memory Specifications The data below is sourced from the memory vendor datasheet. These values are guaranteed through design and/or characterization but are not fully tested in production. Devices are shipped with the memory erased. Table 17: Flash Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.65 1.80 2.00 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz — Program/erase cycles 100,000 — — cycles T RET Data retention time 20 — — years T P P Page program time — 0.8 5 ms T SE Sector erase time (4 KB) — 70 500 ms T BE1 Block erase time (32 KB) — 0.2 2 s T BE2 Block erase time (64 KB) — 0.3 3 s T CE Chip erase time (16 Mb) — 7 20 s Chip erase time (32 Mb) — 20 60 s Chip erase time (64 Mb) — 25 100 s Chip erase time (128 Mb) — 60 200 s Chip erase time (256 Mb) — 70 300 s Espressif Systems 30 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio Table 18: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics Table 19: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 19.5 — 802.11b, 11 Mbps — 19.5 — 802.11g, 6 Mbps — 18.0 — 802.11g, 54 Mbps — 14.0 — 802.11n, HT20, MCS0 — 18.0 — 802.11n, HT20, MCS7 — 13.0 — 802.11n, HT40, MCS0 — 18.0 — 802.11n, HT40, MCS7 — 13.0 — Table 20: TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –25.0 –10.0 802.11b, 11 Mbps, CCK — –25.0 –10.0 802.11g, 6 Mbps, OFDM — –24.0 –5.0 802.11g, 54 Mbps, OFDM — –28.0 –25.0 802.11n, HT20, MCS0 — –24.0 –5.0 Cont’d on next page Espressif Systems 31 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 7 RF Characteristics Table 20 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11n, HT20, MCS7 — –30.0 –27.0 802.11n, HT40, MCS0 — –24.0 –5.0 802.11n, HT40, MCS7 — –30.0 –27.0 1 EVM is measured at the corresponding typical TX power provided in Table 19 Wi-Fi RF Transmitter (TX) Characteristics above. 7.1.2 Wi-Fi RF Receiver (RX) Characteristics Table 21: RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –97.0 — 802.11b, 2 Mbps, DSSS — –94.0 — 802.11b, 5.5 Mbps, CCK — –92.0 — 802.11b, 11 Mbps, CCK — –88.0 — 802.11g, 6 Mbps, OFDM — –93.0 — 802.11g, 9 Mbps, OFDM — –91.0 — 802.11g, 12 Mbps, OFDM — –89.0 — 802.11g, 18 Mbps, OFDM — –87.0 — 802.11g, 24 Mbps, OFDM — –84.0 — 802.11g, 36 Mbps, OFDM — –80.0 — 802.11g, 48 Mbps, OFDM — –77.0 — 802.11g, 54 Mbps, OFDM — –75.0 — 802.11n, HT20, MCS0 — –92.0 — 802.11n, HT20, MCS1 — –88.0 — 802.11n, HT20, MCS2 — –86.0 — 802.11n, HT20, MCS3 — -83.0 — 802.11n, HT20, MCS4 — –80.0 — 802.11n, HT20, MCS5 — –76.0 — 802.11n, HT20, MCS6 — –74.0 — 802.11n, HT20, MCS7 — –72.0 — 802.11n, HT40, MCS0 — –89.0 — 802.11n, HT40, MCS1 — –85.0 — 802.11n, HT40, MCS2 — –83.0 — 802.11n, HT40, MCS3 — –80.0 — 802.11n, HT40, MCS4 — –76.0 — 802.11n, HT40, MCS5 — –72.0 — 802.11n, HT40, MCS6 — –71.0 — 802.11n, HT40, MCS7 — –69.0 — Espressif Systems 32 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 7 RF Characteristics Table 22: Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 0 — 802.11g, 54 Mbps — –8 — 802.11n, HT20, MCS0 — 0 — 802.11n, HT20, MCS7 — –8 — 802.11n, HT40, MCS0 — 0 — 802.11n, HT40, MCS7 — –8 — Table 23: RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 35 — 802.11b, 11 Mbps, CCK — 35 — 802.11g, 6 Mbps, OFDM — 27 — 802.11g, 54 Mbps, OFDM — 13 — 802.11n, HT20, MCS0 — 27 — 802.11n, HT20, MCS7 — 12 — 802.11n, HT40, MCS0 — 16 — 802.11n, HT40, MCS7 — 7 — 7.2 Bluetooth Radio 7.2.1 Receiver – Basic Data Rate Table 24: Receiver Characteristics – Basic Data Rate Parameter Conditions Min Typ Max Unit Sensitivity @0.1% BER — –90 –89 –88 dBm Maximum received signal @0.1% BER — 0 — — dBm Co-channel C/I — — +7 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — — –6 dB F = F0 – 1 MHz — — –6 dB F = F0 + 2 MHz — — –25 dB F = F0 – 2 MHz — — –33 dB F = F0 + 3 MHz — — –25 dB F = F0 – 3 MHz — — –45 dB Cont’d on next page Espressif Systems 33 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 7 RF Characteristics Table 24 – cont’d from previous page Parameter Conditions Min Typ Max Unit Out-of-band blocking performance 30 MHz ~ 2000 MHz –10 — — dBm 2000 MHz ~ 2400 MHz –27 — — dBm 2500 MHz ~ 3000 MHz –27 — — dBm 3000 MHz ~ 12.5 GHz –10 — — dBm Intermodulation — –36 — — dBm 7.2.2 Transmitter – Basic Data Rate Table 25: Transmitter Characteristics – Basic Data Rate Parameter Conditions Min Typ Max Unit RF transmit power * — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm +20 dB bandwidth — — 0.9 — MHz Adjacent channel transmit power F = F0 ± 2 MHz — –55 — dBm F = F0 ± 3 MHz — –55 — dBm F = F0 ± > 3 MHz — –59 — dBm ∆ f1 avg — — — 155 kHz ∆ f2 max — 127 — — kHz ∆ f2 avg /∆ f1 avg — — 0.92 — — ICFT — — –7 — kHz Drift rate — — 0.7 — kHz/50 µs Drift (DH1) — — 6 — kHz Drift (DH5) — — 6 — kHz * There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9 dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding transmit power is 0 dBm. 7.2.3 Receiver – Enhanced Data Rate Table 26: Receiver Characteristics – Enhanced Data Rate Parameter Conditions Min Typ Max Unit π/4 DQPSK Sensitivity @0.01% BER — –90 –89 –88 dBm Maximum received signal @0.01% BER — — 0 — dBm Co-channel C/I — — 11 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –7 — dB F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –35 — dB Cont’d on next page Espressif Systems 34 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 7 RF Characteristics Table 26 – cont’d from previous page Parameter Conditions Min Typ Max Unit F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –45 — dB 8DPSK Sensitivity @0.01% BER — –84 –83 –82 dBm Maximum received signal @0.01% BER — — –5 — dBm C/I c-channel — — 18 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 2 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –25 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –38 — dB 7.2.4 Transmitter – Enhanced Data Rate Table 27: Transmitter Characteristics – Enhanced Data Rate Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 25) — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm π/4 DQPSK max w0 — — –0.72 — kHz π/4 DQPSK max wi — — –6 — kHz π/4 DQPSK max |wi + w0| — — –7.42 — kHz 8DPSK max w0 — — 0.7 — kHz 8DPSK max wi — — –9.6 — kHz 8DPSK max |wi + w0| — — –10 — kHz π/4 DQPSK modulation accuracy RMS DEVM — 4.28 — % 99% DEVM — 100 — % Peak DEVM — 13.3 — % 8 DPSK modulation accuracy RMS DEVM — 5.8 — % 99% DEVM — 100 — % Peak DEVM — 14 — % In-band spurious emissions F = F0 ± 1 MHz — –46 — dBm F = F0 ± 2 MHz — –44 — dBm F = F0 ± 3 MHz — –49 — dBm F = F0 +/– > 3 MHz — — –53 dBm EDR differential phase coding — — 100 — % 7.3 Bluetooth LE Radio Espressif Systems 35 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 7 RF Characteristics Table 28: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402 ~ 2480 MHz RF transmit power range –12.0 ~ 9.0 dBm 7.3.1 Bluetooth LE RF Receiver (RX) Characteristics Table 29: Receiver Characteristics – Bluetooth LE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER — –94 –93 –92 dBm Maximum received signal @30.8% PER — 0 — — dBm Co-channel C/I — — +10 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –5 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –35 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –45 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz –10 — — dBm 2000 MHz ~ 2400 MHz –27 — — dBm 2500 MHz ~ 3000 MHz –27 — — dBm 3000 MHz ~ 12.5 GHz –10 — — dBm Intermodulation — –36 — — dBm 7.3.2 Bluetooth LE RF Transmitter (TX) Characteristics Table 30: Transmitter Characteristics – Bluetooth LE Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 25) — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm Adjacent channel transmit power F = F0 ± 2 MHz — –55 — dBm F = F0 ± 3 MHz — –57 — dBm F = F0 ± > 3 MHz — –59 — dBm ∆ f 1 avg — — — 265 kHz ∆ f2 max — 210 — — kHz ∆ f2 avg /∆ f1 avg — — +0.92 — — ICFT — — –10 — kHz Drift rate — — 0.7 — kHz/50 µs Drift — — 2 — kHz Espressif Systems 36 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 8 Module Schematics 8 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C15, L4 and C14 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R2 varies with the actual PCB board. NC: No component. GPIO16:SPICS GPIO17:SPIDO SD_CMD:SPIHD SD_CLK:SPICLK SD_D0:SPIWP SD_D1:SPIDI ESP32-MINI-1(pin-out) EN GPI35 GPI36 GPI37 GPI38 GPI39 GPI34 RF_ANT GPIO32 U0TXD GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 GPIO15 GPIO13 GPIO2 GPIO0 GPIO4 GPIO10 GPIO9 GPIO18 GPIO5 GPIO23 GPIO19 GPIO22 U0RXD GPIO21 LNA_IN GPIO26 GPIO27 GPIO14 GPIO12 GPIO32 GPI35 GPI34 EN GPI39 GPI38 GPI37 GPI36 GPIO15 GPIO2 GPIO0 GPIO4 GPIO13 GPIO19 GPIO22 GPIO21 GPIO9 GPIO10 GPIO5 GPIO18 GPIO23 U0RXD U0TXD GPIO25 GPIO33 GND GND GND GND VDD33 GNDGND GND GND GND GND GND GND GND GND GNDGND GND GND VDD33 VDD33 VDD33 GND VDD_SDIO VDD33 GND GND VDD33 GND Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1> V1.0 A4 2 2Friday, July 16, 2021 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1> V1.0 A4 2 2Friday, July 16, 2021 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1> V1.0 A4 2 2Friday, July 16, 2021 U3 ESP32-MINI-1 GND 1 3V3 3 I36 4 I37 5 I38 6 I39 7 EN 8 I34 9 I35 10 IO32 11 IO33 12 IO25 13 GND 40 NC 37 GND 38 TXD0 36 RXD0 35 IO21 34 IO22 33 IO19 32 IO23 31 IO18 30 IO5 29 IO27 15 IO14 16 IO12 17 IO13 18 IO10 26 GND 27 IO26 14 GND 39 IO15 19 IO2 20 IO0 21 IO4 22 NC 23 NC 24 IO9 25 GND 2 NC 28 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 EPAD 55 C18 1uF R1 20K(5%) C3 100pF C15 TBD C5 10nF/6.3V(10%) C4 0.1uF L5 2.0nH C2 TBD C20 1uF R2 0 C11 1uF L4 TBD C21 NC C6 3.3nF/6.3V(10%) C9 0.1uF C14 TBD ANT1 PCB_ANT 1 2 U1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C19 0.1uF R3 499 C10 0.1uF U2 ESP32-U4WDH VDDA 1 LNA_IN 2 VDD3P3 3 VDD3P3 4 SENSOR_VP 5 SENSOR_CAPP 6 SENSOR_CAPN 7 SENSOR_VN 8 CHIP_PU 9 VDET_1 10 VDET_2 11 32K_XP 12 32K_XN 13 GPIO25 14 GPIO26 15 GPIO27 16 MTMS 17 MTDI 18 VDD3P3_RTC 19 MTCK 20 MTDO 21 GPIO2 22 GPIO0 23 GPIO4 24 VDD_SDIO 26 GPIO16 25 GPIO17 27 SD_DATA_2 28 SD_DATA_3 29 SD_CMD 30 SD_CLK 31 SD_DATA_0 32 GND 49 SD_DATA_1 33 GPIO5 34 GPIO18 35 GPIO19 38 CAP2 47 VDDA 43 XTAL_N 44 XTAL_P 45 GPIO23 36 U0TXD 41 GPIO22 39 GPIO21 42 VDD3P3_CPU 37 CAP1 48 VDDA 46 U0RXD 40 C1 TBD C13 10uF D1 ESD Figure 8: ESP32-MINI-1 Schematics Espressif Systems 37 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 8 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C15, L4 and C14 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R2 varies with the actual PCB board. NC: No component. GPIO16:SPICS GPIO17:SPIDO SD_CMD:SPIHD SD_CLK:SPICLK SD_D0:SPIWP SD_D1:SPIDI ESP32-MINI-1U(pin-out) EN GPI35 GPI36 GPI37 GPI38 GPI39 GPI34 RF_ANT GPIO32 U0TXD GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 GPIO15 GPIO13 GPIO2 GPIO0 GPIO4 GPIO10 GPIO9 GPIO18 GPIO5 GPIO23 GPIO19 GPIO22 U0RXD GPIO21 LNA_IN GPIO26 GPIO27 GPIO14 GPIO12 GPIO32 GPI35 GPI34 EN GPI39 GPI38 GPI37 GPI36 GPIO15 GPIO2 GPIO0 GPIO4 GPIO13 GPIO19 GPIO22 GPIO21 GPIO9 GPIO10 GPIO5 GPIO18 GPIO23 U0RXD U0TXD GPIO25 GPIO33 GND GND GND GND VDD33 GNDGND GND GND GND GND GND GND GND GND GNDGND GND GND VDD33 VDD33 VDD33 GND VDD_SDIO VDD33 GND GND VDD33 GND Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1U> V1.0 A4 2 2Thursday, April 01, 2021 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1U> V1.0 A4 2 2Thursday, April 01, 2021 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1U> V1.0 A4 2 2Thursday, April 01, 2021 R1 20K(5%) C18 1uF U3 ESP32-MINI-1U GND 1 3V3 3 I36 4 I37 5 I38 6 I39 7 EN 8 I34 9 I35 10 IO32 11 IO33 12 IO25 13 GND 40 NC 37 GND 38 TXD0 36 RXD0 35 IO21 34 IO22 33 IO19 32 IO23 31 IO18 30 IO5 29 IO27 15 IO14 16 IO12 17 IO13 18 IO10 26 GND 27 IO26 14 GND 39 IO15 19 IO2 20 IO0 21 IO4 22 NC 23 NC 24 IO9 25 GND 2 NC 28 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 EPAD 55 C3 100pF C15 TBD C5 10nF/6.3V(10%) C4 0.1uF L5 2.0nH C20 1uF C2 TBD C11 1uF R2 0 L4 TBD C6 3.3nF/6.3V(10%) C21 NC C14 TBD C9 0.1uF ANT1 IPEX 1 4 2 3 R3 499 C19 0.1uF U1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 C10 0.1uF D1 ESD C13 10uF C1 TBD U2 ESP32-U4WDH VDDA 1 LNA_IN 2 VDD3P3 3 VDD3P3 4 SENSOR_VP 5 SENSOR_CAPP 6 SENSOR_CAPN 7 SENSOR_VN 8 CHIP_PU 9 VDET_1 10 VDET_2 11 32K_XP 12 32K_XN 13 GPIO25 14 GPIO26 15 GPIO27 16 MTMS 17 MTDI 18 VDD3P3_RTC 19 MTCK 20 MTDO 21 GPIO2 22 GPIO0 23 GPIO4 24 VDD_SDIO 26 GPIO16 25 GPIO17 27 SD_DATA_2 28 SD_DATA_3 29 SD_CMD 30 SD_CLK 31 SD_DATA_0 32 GND 49 SD_DATA_1 33 GPIO5 34 GPIO18 35 GPIO19 38 CAP2 47 VDDA 43 XTAL_N 44 XTAL_P 45 GPIO23 36 U0TXD 41 GPIO22 39 GPIO21 42 VDD3P3_CPU 37 CAP1 48 VDDA 46 U0RXD 40 Figure 9: ESP32-MINI-1U Schematics Espressif Systems 38 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A IO12 should be kept low when the module is powered on.NC: No component. X1: ESR = Max. 70 KΩ ESP32-MINI-1U ESP32-MINI-1 EN IO22 RXD0 TXD0 IO26 IO2 IO15 IO13 IO12 IO27 IO14 I36 TDI TCK TDO TMS IO21 IO19 IO5 IO23 IO9 IO10 I37 I38 I39 I34 I35 IO0 IO4 EN IO18 IO33 IO32 IO25 GND VDD33 GND GND VDD33 GND GND GND GND GND GND SW1 R2 0 C3 TBD X1 32.768kHz(NC) 1 2 JP1 UART 1 1 2 2 3 3 4 4 R1 TBD R5 NC C2 0.1uF JP3 JTAG 1 1 2 2 3 3 4 4 C4 0.1uF C5 12pF(NC) R3 0(NC) R4 0(NC) JP2 Boot Option 1 1 2 2 C6 12pF(NC) U1 GND 1 3V3 3 I36 4 I37 5 I38 6 I39 7 EN 8 I34 9 I35 10 IO32 11 IO33 12 IO25 13 GND 40 NC 37 GND 38 TXD0 36 RXD0 35 IO21 34 IO22 33 IO19 32 IO23 31 IO18 30 IO5 29 IO27 15 IO14 16 IO12 17 IO13 18 IO10 26 GND 27 IO26 14 GND 39 IO15 19 IO2 20 IO0 21 IO4 22 NC 23 NC 24 IO9 25 GND 2 NC 28 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 EPAD 55 C1 22uF Figure 10: Peripheral Schematics • Soldering Pad 55 to the Ground of the base board is not necessary for a satisfactory thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section 4.6 Chip Power-up and Reset. • UART0 is used to download firmware and log output. When using the AT firmware, please note that the UART GPIO is already configured (refer to Hardware Connection). It is recommended to use the default configuration. Espressif Systems 39 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 4 19±0.15 0.813.2±0.15 Top view Side view Bottom view 2.4±0.15 13.6 0.6 1 1 9.2 10 10.8 12.6 8.4 9.2 10 11.3 12.9 0.62 0.62 11.95 12.25 4 0.6 11 Unit: mm Figure 11: ESP32-MINI-1 Physical Dimensions 13.5±0.15 0.813.2±0.15 Top view Side view Bottom view 12.25 Unit: mm 1.55 1.7 9.7 0.48 9.18 12.55 2.4±0.15 0.85 4 13.5 0.6 1 1 9.2 10 10.8 12.6 8.4 9.2 10 11.3 12.9 4 0.6 11 0.48 Figure 12: ESP32-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to ESP32 Module Packaging Information. Espressif Systems 40 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP32-MINI-1U uses the third generation external antenna connector as shown in Figure 13. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 13: Dimensions of External Antenna Connector The external antenna used for ESP32-MINI-1U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna Espressif Systems 41 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 10 Physical Dimensions based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 13 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 42 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 14 ESP32-MINI-1 Recommended PCB Land Pattern and Figure 15 ESP32-MINI-1U PCB Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 14 and Figure 15. You can view the source files for ESP32-MINI-1 and ESP32-MINI-1U with Autodesk Viewer. • 3D models of ESP32-MINI-1 and ESP32-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). Pin 1 13.2 13.6 4 1 10.8 9.2 10 12.6 10 11.3 1 0.6 12.9 4 9.2 8.4 Antenna Area 0.6 11 Unit: mm : Pad Figure 14: ESP32-MINI-1 Recommended PCB Land Pattern Espressif Systems 43 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 11 PCB Layout Recommendations Pin 1 13.2 13.5 4 10.8 1 9.2 10 12.6 10 11.3 1 0.6 12.9 4 9.2 8.4 0.6 11 Unit: mm : Pad Figure 15: ESP32-MINI-1U PCB Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32 Hardware Design Guidelines > Section Positioning a Module on a Base Board. Espressif Systems 44 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Reflow Profile Solder the module in a single reflow. 50 150 0 25 1 ~ 3 ℃/s 0 200 250 200 –1 ~ –5 ℃/s Cooling zone 100 217 50 100 250 Reflow zone 217 ℃ 60 ~ 90 s Temperature (℃) Preheating zone 150 ~ 200 ℃ 60 ~ 120 s Ramp-up zone Peak Temp. 235 ~ 250 ℃ Soldering time > 30 s Time (sec.) Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 16: Reflow Profile Espressif Systems 45 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 46 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 47 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32 Series Datasheet – Specifications of the ESP32 hardware. • ESP32 Technical Reference Manual – Detailed information on how to use the ESP32 memory and peripherals. • ESP32 Hardware Design Guidelines – Guidelines on how to integrate the ESP32 into your hardware product. • ESP32 ECO and Workarounds for Bugs – Correction of ESP32 design errors. • ESP32 Series SoC Errata – Descriptions of known errors in ESP32 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns • ESP32 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32 Series SoCs – Browse through all ESP32 SoCs. https://espressif.com/en/products/socs?id=ESP32 • ESP32 Series Modules – Browse through all ESP32-based modules. https://espressif.com/en/products/modules?id=ESP32 • ESP32 Series DevKits – Browse through all ESP32-based devkits. https://espressif.com/en/products/devkits?id=ESP32 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 48 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Revision History Revision History Date Version Release Notes 2025-10-20 v1.7 • Section 2 Block Diagram: Added a note about pin mapping between the chip and the in-package flash/PSRAM • Updated Figure 5 Visualization of Timing Parameters for the Strapping Pins • Added Section 4.6 Chip Power-up and Reset • Table 15 DC Characteristics (3.3 V, 25 °C): Added V IH_nRST • Added Section 6.5 Memory Specifications • Added Section Datasheet Versioning 2025-07-15 v1.6 • Section 10.2 Dimensions of External Antenna Connector: Added the external antenna information for certification. 2025-03-18 v1.5 • Improved the wording and structure of following sections: – Updated Section Features and Series Comparison – Updated Section ”Strapping Pins” and renamed to Boot Configurations – Added Chapter 5 Peripherals – Section 7 RF Characteristics: * Updated Table ”Wi-Fi RF Standards” and renamed to Wi-Fi RF Characteristics * Added Table 20 Wi-Fi RF Transmitter (TX) Characteristics * Added Table Bluetooth LE RF Characteristics – Section 9 Peripheral Schematics: Added a note about UART – Renamed Chapter ”Physical Dimensions and PCB Land Pattern” to Physical Dimensions and added Chapter 11 PCB Layout Recommen- dations 2024-07-02 v1.4 Table 3 Pin Description: Added a note for input-only GPIO pins 2023-08-28 v1.3 • Table 3 Pin Description: Updated the first note about chip pins connecting flash • Section 9 Peripheral Schematics: Updated the first note about EPAD sol- dering • Section 11.1 PCB Land Pattern: Added the 3D file for ESP32-MINI-1U 2023-01-17 v1.2 Major updates: • Removed contents about hall sensor according to PCN20221202 • Added Section 12.4 Ultrasonic Vibration Other updates: • Added strapping pin timing in Section 4 Boot Configurations • Added source files of PCB land patterns and 3D models of the modules (if available) in Section 11.1 PCB Land Pattern Cont’d on next page Espressif Systems 49 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Revision History Cont’d from previous page Date Version Release notes 2021-11-09 v1.1 Upgraded the module embedded chip from single-core to dual-core 1 Updated the description to TWAI Updated Table 14 Recommended Operating Conditions 2021-07-14 v1.0 Added ESP32-MINI-1U module Updated the document formatting 2020-12-04 v0.5 Pre-release 1 The module embedded chip (ESP32-U4WDH) is upgraded from single-core to dual-core, see PCN-2021-021. Estimated effective date: January 1, 2022. The single-core version coexists with the new dual-core version around January 1, 2022. The physical product is subject to batch tracking. Espressif Systems 50 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.7 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com