1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 4.3 JTAG Signal Source Control 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interfaces 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 I2S Controller 5.2.1.5 Pulse Count Controller 5.2.1.6 USB Serial/JTAG Controller 5.2.1.7 Two-wire Automotive Interface 5.2.1.8 LED PWM Controller 5.2.1.9 Motor Control PWM 5.2.1.10 Remote Control Peripheral 5.2.1.11 Parallel IO Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 5.2.2.3 Analog PAD Voltage Comparator 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 7 RF Characteristics 7.1 Bluetooth 5 (LE) Radio 7.1.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.1.2 Bluetooth LE RF Receiver (RX) Characteristics 7.2 802.15.4 Radio 7.2.1 802.15.4 RF Transmitter (TX) Characteristics 7.2.2 802.15.4 RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Soldering Profile 12.3.1 Reflow Profile 12.4 Ultrasonic Vibration Related Documentation and Resources Datasheet Versioning Revision History ESP32-H2-MINI-1 ESP32-H2-MINI-1U Datasheet Version 1.4 Bluetooth ® Low Energy and IEEE 802.15.4 module Built around ESP32-H2 series of SoCs, RISC-V single-core 32-bit microprocessor 2 MB or 4 MB flash in chip package 19 GPIOs On-board PCB antenna or external antenna connector ESP32-H2-MINI-1 ESP32-H2-MINI-1U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/documentation/esp32-h2-mini-1_mini-1u_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-H2 embedded, RISC-V single-core 32-bit microprocessor, up to 96 MHz • 128 KB ROM • 320 KB SRAM • 4 KB LP Memory • 2 MB or 4 MB in-package flash Bluetooth ® • Bluetooth Low Energy (Bluetooth 5.3 certified) • Bluetooth mesh • Bluetooth Low Energy long range (Coded PHY, 125 Kbps and 500 Kbps) • Bluetooth Low Energy high speed (2 Mbps) • Bluetooth Low Energy advertising extensions and multiple advertising sets • Simultaneous operation of Broadcaster, Observer, Central, and Peripheral devices • Multiple connections • LE power control IEEE 802.15.4 • IEEE Standard 802.15.4-2015 compliant • Supports 250 Kbps data rate in 2.4 GHz band and OQPSK PHY • Supports Thread 1.4 • Supports Zigbee 3.0 • Supports Matter • Supports other application-layer protocols (HomeKit, MQTT, etc) Peripherals • Up to 19 GPIOs – 3 strapping pins • I2C, I2S, SPI, UART, ADC, LED PWM, ETM, GDMA, PCNT, PARLIO, RMT, TWAI ® , MCPWM, USB Serial/JTAG, temperature sensor, general-purpose timers, system timer, watchdog timer Integrated Components on Module • 32 MHz crystal oscillator Antenna Options • ESP32-H2-MINI-1: On-board PCB antenna • ESP32-H2-MINI-1U: External antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0∼3.6 V • Operating ambient temperature: 40∼105 °C Certification • RF certification: See certificates Espressif Systems 2 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 1 Module Overview 1.2 Series Comparison ESP32-H2-MINI-1 and ESP32-H2-MINI-1U are two powerful, generic Bluetooth ® Low Energy and IEEE 802.15.4 combo module that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics, etc. ESP32-H2-MINI-1 comes with a PCB antenna. ESP32-H2-MINI-1U comes with a connector for an external antenna. The series comparison for the two modules is as follows: Table 1: ESP32-H2-MINI-1 Series Comparison 1 Ambient Temp. 2 Size 3 Ordering Code Flash 4 (°C) (mm) ESP32-H2-MINI-1-H2S 2 MB (Quad SPI) –40∼105 ESP32-H2-MINI-1-H4S 4 MB (Quad SPI) –40∼105 13.2 × 16.6 × 2.4 1 This table shares the same notes presented in Table 2 below. Table 2: ESP32-H2-MINI-1U Series Comparison Ambient Temp. 2 Size 3 Ordering Code Flash 4 (°C) (mm) ESP32-H2-MINI-1U-H2S 2 MB (Quad SPI) –40∼105 ESP32-H2-MINI-1U-H4S 4 MB (Quad SPI) –40∼105 13.2 × 12.5 × 2.4 2 Ambient temperature specifies the recommended temperature range of the environ- ment immediately outside the Espressif module. 3 For details, refer to Section 10.1 Module Dimensions. 4 The flash is integrated in the chip’s package. The flash supports: - More than 100,000 program/erase cycles - More than 20 years data retention time At the core of this module is ESP32-H2, a 32-bit RISC-V single-core CPU that operates at up to 96 MHz. Note: * For more information on ESP32-H2, please refer to ESP32-H2 Series Datasheet. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • Matter Solutions • Wearables • Service Robot • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers Espressif Systems 3 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 3 2 Block Diagram 8 3 Pin Definitions 9 3.1 Pin Layout 9 3.2 Pin Description 9 4 Boot Configurations 11 4.1 Chip Boot Mode Control 12 4.2 ROM Messages Printing Control 13 4.3 JTAG Signal Source Control 13 5 Peripherals 15 5.1 Peripheral Overview 15 5.2 Peripheral Description 15 5.2.1 Connectivity Interfaces 15 5.2.1.1 UART Controller 15 5.2.1.2 SPI Controller 16 5.2.1.3 I2C Controller 17 5.2.1.4 I2S Controller 17 5.2.1.5 Pulse Count Controller 18 5.2.1.6 USB Serial/JTAG Controller 18 5.2.1.7 Two-wire Automotive Interface 19 5.2.1.8 LED PWM Controller 19 5.2.1.9 Motor Control PWM 20 5.2.1.10 Remote Control Peripheral 21 5.2.1.11 Parallel IO Controller 22 5.2.2 Analog Signal Processing 22 5.2.2.1 SAR ADC 22 5.2.2.2 Temperature Sensor 23 5.2.2.3 Analog PAD Voltage Comparator 23 6 Electrical Characteristics 24 6.1 Absolute Maximum Ratings 24 6.2 Recommended Operating Conditions 24 6.3 DC Characteristics (3.3 V, 25 °C) 24 6.4 Current Consumption Characteristics 25 6.4.1 Current Consumption in Active Mode 25 6.4.2 Current Consumption in Other Modes 26 Espressif Systems 4 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 Contents 7 RF Characteristics 27 7.1 Bluetooth 5 (LE) Radio 27 7.1.1 Bluetooth LE RF Transmitter (TX) Characteristics 27 7.1.2 Bluetooth LE RF Receiver (RX) Characteristics 29 7.2 802.15.4 Radio 31 7.2.1 802.15.4 RF Transmitter (TX) Characteristics 31 7.2.2 802.15.4 RF Receiver (RX) Characteristics 31 8 Module Schematics 32 9 Peripheral Schematics 34 10 Physical Dimensions 35 10.1 Module Dimensions 35 10.2 Dimensions of External Antenna Connector 36 11 PCB Layout Recommendations 38 11.1 PCB Land Pattern 38 11.2 Module Placement for PCB Design 39 12 Product Handling 40 12.1 Storage Conditions 40 12.2 Electrostatic Discharge (ESD) 40 12.3 Soldering Profile 40 12.3.1 Reflow Profile 40 12.4 Ultrasonic Vibration 41 Related Documentation and Resources 42 Datasheet Versioning 43 Revision History 44 Espressif Systems 5 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 List of Tables List of Tables 1 ESP32-H2-MINI-1 Series Comparison 1 3 2 ESP32-H2-MINI-1U Series Comparison 3 3 Pin Definitions 10 4 Default Configuration of Strapping Pins 11 5 Description of Timing Parameters for the Strapping Pins 12 6 Chip Boot Mode Control 12 7 UART0 ROM Message Printing Control 13 8 USB Serial/JTAG ROM Message Printing Control 13 9 JTAG Signal Source Control 14 10 Absolute Maximum Ratings 24 11 Recommended Operating Conditions 24 12 DC Characteristics (3.3 V, 25 °C) 24 13 Current Consumption for Bluetooth LE in Active Mode 25 14 Current Consumption for 802.15.4 in Active Mode 25 15 Current Consumption in Modem-sleep Mode 26 16 Current Consumption in Low-Power Modes 26 17 Bluetooth LE RF Characteristics 27 18 Bluetooth LE - Transmitter Characteristics - 1 Mbps 27 19 Bluetooth LE - Transmitter Characteristics - 2 Mbps 27 20 Bluetooth LE - Transmitter Characteristics - 125 Kbps 28 21 Bluetooth LE - Transmitter Characteristics - 500 Kbps 28 22 Bluetooth LE - Receiver Characteristics - 1 Mbps 29 23 Bluetooth LE - Receiver Characteristics - 2 Mbps 29 24 Bluetooth LE - Receiver Characteristics - 125 Kbps 30 25 Bluetooth LE - Receiver Characteristics - 500 Kbps 30 26 802.15.4 RF Characteristics 31 27 802.15.4 Transmitter Characteristics - 250 Kbps 31 28 802.15.4 Receiver Characteristics - 250 Kbps 31 Espressif Systems 6 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 List of Figures List of Figures 1 ESP32-H2-MINI-1 Block Diagram 8 2 ESP32-H2-MINI-1U Block Diagram 8 3 Pin Layout (Top View) 9 4 Visualization of Timing Parameters for the Strapping Pins 12 5 ESP32-H2-MINI-1 Schematics 32 6 ESP32-H2-MINI-1U Schematics 33 7 Peripheral Schematics 34 8 ESP32-H2-MINI-1 Physical Dimensions 35 9 ESP32-H2-MINI-1U Physical Dimensions 35 10 Dimensions of External Antenna Connector 36 11 ESP32-H2-MINI-1 Recommended PCB Land Pattern 38 12 ESP32-H2-MINI-1U Recommended PCB Land Pattern 39 13 Reflow Profile 40 Espressif Systems 7 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 2 Block Diagram 2 Block Diagram SPI Flash ESP32-H2 RF Matching 32 MHz Crystal 3V3 ESP32-H2-MINI-1 EN GPIOs Antenna SPI Flash ESP32-H2 (Beta) RF Matching 32 MHz Crystal 3V3 ESP32-H2-HP-MINI-1 EN GPIOs Antenna Figure 1: ESP32-H2-MINI-1 Block Diagram SPI Flash ESP32-H2 RF Matching 32 MHz Crystal 3V3 ESP32-H2-MINI-1U EN GPIOs Antenna Figure 2: ESP32-H2-MINI-1U Block Diagram Espressif Systems 8 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10.1 Module Dimensions. Pin 10 Pin 1 Pin 8 Pin 5 Pin 4 Pin 12 Pin 15 Pin 14 Pin 17 Pin 29 Pin 45 3V3 IO0 IO4 IO14 IO5 IO8 IO10 IO9 IO27 NC NC Pin 50 GND Pin 2 Pin 20 Pin 9 Pin 13 GND Pin 16 IO2 Pin 22 IO13 Pin 21 Pin 18 Pin 51 GND Pin 24 Pin 33 Pin 30 Pin 32 Pin 34 Pin 36 Pin 40 Pin 47 Pin 44 Pin 7 NC EN IO3 Pin 6 Pin 3 Pin 53 GND Pin 11 GND Pin 52 GND IO1 NC IO11 IO25 IO12 IO26 NC Pin 19 Pin 23 Pin 25 NC RXD0 Pin 26 GND TXD0 Pin 27 GND NC Pin 28 Pin 31 GND GND GND Pin 35 GND GND GND GND Pin 38 GND GND Pin 37 Pin 39 Pin 41 Pin 42 Pin 43 GND NC Pin 46 Pin 48 GND VBAT IO22 NC GND GND Pin 49 GND GND GND GND GND GND GND GND GND A Figure 3: Pin Layout (Top View) Note A: The zone marked with dotted lines is the antenna keepout zone. The pin diagram is applicable to ESP32-H2-MINI-1 and ESP32-H2-MINI-1U, but the latter has no antenna keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP32-H2 Hardware Design Guidelines > Section Positioning a Module on a Base Board. 3.2 Pin Description The module has 53 pins. See pin definitions in Table 3 Pin Description. For peripheral pin configurations, please refer to ESP32-H2 Series Datasheet. Espressif Systems 9 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 3 Pin Definitions Table 3: Pin Definitions Name No. Type 1 Function GND 1, 2, 11, 14, 36~53 P Ground 3V3 3 P Power supply NC 4, 7, 17, 28, 29, 32~35 — NC IO2 5 I/O/T GPIO2, FSPIWP, ADC1_CH1, MTMS IO3 6 I/O/T GPIO3, FSPIHD, ADC1_CH2, MTDO EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO0 9 I/O/T GPIO0, FSPIQ IO1 10 I/O/T GPIO1, FSPICS0, ADC1_CH0 GND 11 P Ground IO13 12 I/O/T GPIO13, XTAL_32K_P IO14 13 I/O/T GPIO14, XTAL_32K_N GND 14 P Ground VBAT 15 P Connected to internal 3V3 power supply (Default) or external battery power supply (3.0 ~ 3.6 V). IO12 16 I/O/T GPIO12 IO4 18 I/O/T GPIO4, FSPICLK, ADC1_CH3, MTCK IO5 19 I/O/T GPIO5, FSPID, ADC1_CH4, MTDI IO10 20 I/O/T GPIO10, ZCD0 IO11 21 I/O/T GPIO11, ZCD1 IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO22 24 I/O/T GPIO22 IO25 25 I/O/T GPIO25, FSPICS3 IO26 26 I/O/T GPIO26, FSPICS4, USB_D- IO27 27 I/O/T GPIO27, FSPICS5, USB_D+ RXD0 30 I/O/T GPIO23, FSPICS1, U0RXD TXD0 31 I/O/T GPIO24, FSPICS2, U0TXD 1 P: power supply; I: input; O: output; T: high impedance. Espressif Systems 10 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32-H2 Series Datasheet > Section Boot Configurations via Strapping Pins and eFuses. For the strapping pin mapping between the chip and modules, please refer to Chapter 10 Physical Dimensions. The chip allows for configuring the following boot parameters through strapping pins, eFuse bits, and registers at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO8 and GPIO9 • ROM message printing – Strapping pin: GPIO8 – eFuse bits: EFUSE_UART_PRINT_CONTROL and EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT – Register: LP_AON_STORE4_REG[0] • JTAG signal source – Strapping pin: GPIO25 – eFuse bits: EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_JTAG_SEL_ENABLE The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to program eFuse bits, please refer to ESP32-H2 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO8 Floating — GPIO9 Weak pull-up 1 GPIO25 Floating — To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-H2 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 5 and Figure 4. Espressif Systems 11 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_EN pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_EN is already high and before these pins start operating as regular IO pins. 3 Strapping pin V IH_nRST V IH t SU t H CHIP_EN Figure 4: Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode 1 GPIO8 GPIO9 SPI Boot Any value 1 Joint Download Boot 2 1 0 1 Bold marks the default value and configura- tion. 2 Joint Download Boot mode supports the fol- lowing download methods: • USB Download Boot: – USB-Serial-JTAG Download Boot • UART Download Boot Espressif Systems 12 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations 4.2 ROM Messages Printing Control During the boot process, ROM message printing is enabled if LP_AON_STORE4_REG[0] is 0 (default), and disabled if LP_AON_STORE4_REG[0] is 1. When ROM message printing is enabled, the messages can be printed to: • (Default) UART0 and USB Serial/JTAG controller • USB Serial/JTAG controller • UART0 EFUSE_UART_PRINT_CONTROL, LP_AON_STORE4_REG[0], and GPIO8 control ROM messages printing to UART0 as shown in Table 7 UART0 ROM Message Printing Control. Table 7: UART0 ROM Message Printing Control UART0 ROM Message Printing 1 LP_AON_STORE4_REG[0] EFUSE_UART_PRINT_CONTROL GPIO8 Enabled 0 0 Ignored 1 0 2 1 Disabled 0 1 1 2 0 3 Ignored 1 Ignored Ignored 1 Bold marks the default value and configuration. EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT controls the printing to USB Serial/JTAG controller as shown in Table 8 USB Serial/JTAG ROM Message Printing Control. Table 8: USB Serial/JTAG ROM Message Printing Control USB Serial/JTAG ROM Mes- sage Printing Control 1 LP_AON_STORE4_REG[0] EFUSE_DIS_USB_SERIAL_JTAG _ROM_PRINT Enabled 0 0 Disabled 0 1 1 Ignored 1 Bold marks the default value and configuration. 4.3 JTAG Signal Source Control The strapping pin GPIO25 can be used to control the source of JTAG signals during the early boot process. This pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that cannot be in a high impedance state. As Table 9 shows GPIO25 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_JTAG_SEL_ENABLE. Espressif Systems 13 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations Table 9: JTAG Signal Source Control JTAG Signal Source 1 EFUSE_DIS_PAD_JTAG EFUSE_DIS_USB_JTAG EFUSE_STRAP_JTAG_SEL_ENABLE GPIO25 USB Serial/JTAG Controller 0 0 0 Ignored JTAG pins 2 1 0 USB Serial/JTAG Controller 1 JTAG pins 2 0 1 Ignored Ignored USB Serial/JTAG Controller 1 0 Ignored Ignored JTAG is disabled 1 1 Ignored Ignored 1 Bold marks the default value and configuration. 2 JTAG pins refer to MTDI, MTCK, MTMS, and MTDO. Espressif Systems 14 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP32-H2 integrates a rich set of peripherals including SPI, I2S, UART, I2C, LED PWM, ADC, TWAI ® , temperature sensor, etc. To learn more about on-chip components, please refer to ESP32-H2 Series Datasheet > Section Functional Description. Note: The content below is sourced from ESP32-H2 Series Datasheet > Section Peripherals. Some information may not be applicable to ESP32-H2-MINI-1 and ESP32-H2-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer to ESP32-H2 Technical Reference Manual > Section Peripheral Signal List. 5.2 Peripheral Description This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality. 5.2.1 Connectivity Interfaces This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks. 5.2.1.1 UART Controller The UART Controller in the ESP32-H2 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It consists of two UARTs in the system. Feature List • Programmable baud rates up to 5 MBaud • 260 x 8 bit RAM shared by TX FIFOs and RX FIFOs • Support for various lengths of data bits and stop bits • Parity bit support • Special character AT_CMD detection • RS485 protocol support • IrDA protocol support • High-speed data communication using GDMA • Receive timeout feature • UART as the wake-up source Espressif Systems 15 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Software and hardware flow control Pin Assignment The pins connected to receive and transmit signals (U0RXD and U0TXD) for UART0 are multiplexed with GPIO23 ~ GPIO24 and FSPICS1 ~ FSPICS2 via IO MUX. Other signals can be routed to any GPIOs via the GPIO matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.2 SPI Controller ESP32-H2 has the following SPI interfaces: • SPI0/SPI1 are reserved for system use. • SPI2 is a general-purpose SPI (GP-SPI) controller with access to general-purpose DMA channels. Features of SPI2 • Supports operation as a master or slave • Support for DMA • Supports Single SPI, Dual SPI, Quad SPI, QPI modes • Configurable clock polarity (CPOL) and phase (CPHA) • Configurable clock frequency • Data transmission is in bytes • Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first • As a master – Supports 2-line full-duplex communication with clock frequency up to 48 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 48 MHz – Provides six FSPICS… pins for connection with six independent SPI slaves – Configurable CS setup time and hold time • As a slave – Supports 2-line full-duplex communication with clock frequency up to 32 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 32 MHz Pin Assignment • Via IO MUX For SPI2, the pins for data and clock signals are multiplexed with GPIO0, GPIO2 ~ GPIO5, and JTAG interface via the IO MUX. The pins for chip select signals are multiplexed with GPIO1, GPIO23 ~ GPIO27, UART0 interface, and USB interface via the IO MUX. Espressif Systems 16 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Via GPIO Matrix The pins for SPI2 can be chosen from any GPIOs via the GPIO matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.3 I2C Controller The I2C Controller supports communication between the master and slave devices using the I2C bus. Feature List • Two I2C controllers • Communication with multiple external devices • Master and slave modes • Standard mode (100 Kbit/s) and fast mode (400 Kbit/s) • SCL clock stretching in slave mode • Programmable digital noise filtering • Support for 7-bit and 10-bit addressing, as well as dual address mode Pin Assignment The pins used for I2C can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.4 I2S Controller The I2S Controller in the ESP32-H2 chip provides a flexible communication interface for streaming digital data in multimedia applications, particularly digital audio applications. Feature List • Master mode and slave mode • Full-duplex and half-duplex communications • Separate TX and RX units that can work independently or simultaneously • A variety of audio standards supported: – TDM Philips standard – TDM MSB alignment standard – TDM PCM standard – PDM standard • PCM-to-PDM TX interface Espressif Systems 17 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Configurable high-precision BCK clock, with frequency up to 40 MHz – Sampling frequencies can be 8 kHz, 16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz, 128 kHz, etc. • 8-/16-/24-/32-bit data communication • Direct Memory Access (DMA) • A-law and µ-law compression/decompression algorithms for improved signal-to-quantization noise ratio • Flexible data format control Pin Assignment The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.5 Pulse Count Controller The Pulse Count Controller (PCNT) is designed to count input pulses by tracking the rising and falling edges of the input pulse signal. Feature List • Four independent pulse counters with two channels each • Counter modes: increment, decrement, or disable • Glitch filtering for input pulse signals and control signals • Selection between counting on rising or falling edges of the input pulse signal Pin Assignment The pins for the Pulse Count Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix . 5.2.1.6 USB Serial/JTAG Controller The USB Serial/JTAG controller in the ESP32-H2 chip provides an integrated solution for communicating to the chip over a standard USB CDC-ACM serial port as well as a convenient method for JTAG debugging. It eliminates the need for external chips or JTAG adapters, saving space and reducing cost. Feature List • USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not support the faster 480 Mbit/s high-speed transfer mode) • CDC-ACM virtual serial port and JTAG adapter functionality • CDC-ACM: Espressif Systems 18 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals – CDC-ACM adherent serial port emulation (plug-and-play on most modern OSes) – Host controllable chip reset and entry into download mode • JTAG adapter functionality: – Fast communication with CPU debugging core using a compact representation of JTAG instructions • Internal PHY Pin Assignment The pins USB_D+ and USB_D- for the USB Serial/JTAG Controller are multiplexed with GPIO26 ~ GPIO27 and FSPICS4 ~ FSPICS5 via IO MUX. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.7 Two-wire Automotive Interface The Two-wire Automotive Interface (TWAI ® ) is a multi-master, multi-cast communication protocol designed for automotive applications. The TWAI controller facilitates the communication based on this protocol. Feature List • Compatible with ISO 11898-1 protocol (CAN Specification 2.0) • Standard frame format (11-bit ID) and extended frame format (29-bit ID) • Bit rates from 1 Kbit/s to 1 Mbit/s • Multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required) • Special transmissions: Single-shot and Self Reception • Acceptance filter (single and dual filter modes) • Error detection and handling: error counters, configurable error warning limit, error code capture, arbitration lost capture, automatic transceiver standby Pin Assignment The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.8 LED PWM Controller The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List • Six independent PWM generators • Maximum PWM duty cycle resolution of 20 bits Espressif Systems 19 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Four independent timers with 20-bit counters, configurable fractional clock dividers and counter overflow values • Adjustable phase of PWM signal output • PWM duty cycle dithering • Automatic duty cycle fading – Linear duty cycle fading — only one duty cycle range – Gamma curve fading — up to 16 duty cycle ranges for each PWM generator, with independently configured fading direction (increase or decrease), fading amount, number of fades, and fading frequency • PWM signal output in low-power mode (Light-sleep mode) • Event generation and task response achieved by the Event Task Matrix (ETM) Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.9 Motor Control PWM The Motor Control Pulse Width Modulator (MCPWM) is designed for driving digital motors and smart light. The MCPWM is divided into five main modules: PWM timers, PWM operators, Capture module, Fault Detection module, and Event Task Matrix (ETM) module. Feature List • Three PWM timers for precise timing and frequency control – Every PWM timer has a dedicated 8-bit clock prescaler – The 16-bit counter in the PWM timer can work in count-up mode, count-down mode, or count-up-down mode – Hardware or software synchronization to trigger a reload on the PWM timer or the prescaler’s restart, with selectable hardware synchronization source • Three PWM operators for generating waveform pairs – Six PWM outputs to operate in several topologies – The control of the PWM signal can be updated asynchronously – Configurable dead time on rising and falling edges; each set up independently – Modulating of PWM output by high-frequency carrier signals, useful when gate drivers are insulated with a transformer – Period, time stamps, and important control registers have shadow registers with flexible updating methods Espressif Systems 20 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Capture module for hardware-based signal processing – Speed measurement of rotating machinery – Measurement of elapsed time between position sensor pulses – Period and duty cycle measurement of pulse train signals – Decoding current or voltage amplitude derived from duty-cycle-encoded signals of current/voltage sensors – Three individual capture channels, each of which with a 32-bit time-stamp register – Selection of edge polarity and prescaling of input capture signals – The capture timer can sync with a PWM timer or external signals • Fault Detection module – Programmable fault handling in both cycle-by-cycle mode and one-shot mode – A fault condition can force the PWM output to either high or low logic levels • Event generation and task response achieved by the Event Task Matrix (ETM) Pin Assignment The pins for the Motor Control PWM can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.10 Remote Control Peripheral The Remote Control Peripheral (RMT) controls the transmission and reception of infrared remote control signals. Feature List • Four channels for sending and receiving infrared remote control signals • Independent transmission and reception capabilities for each channel • Support for Normal TX/RX mode, Wrap TX/RX mode, Continuous TX mode • Modulation on TX pulses and Demodulation on RX pulses • RX filtering for improved signal reception • Ability to transmit data simultaneously on multiple channels • Clock divider counter, state machine, and transmitter for each TX channel • Clock divider counter, state machine, and receiver for each RX channel • Default allocation of RAM blocks to channels based on channel number • RAM containing 16-bit entries with “level” and “period” fields Espressif Systems 21 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals Pin Assignment The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.11 Parallel IO Controller The Parallel IO Controller (PARLIO) in the ESP32-H2 chip enables data transfer between external devices and internal memory on a parallel bus through GDMA. It consists of a transmitter (TX unit) and a receiver (RX unit), making it a versatile interface for connecting various peripherals. Feature List • 1/2/4/8-bit configurable data bus width • Full-duplex communication with 8-bit data bus width • Bit reordering in 1/2/4-bit data bus width mode • RX unit supports eight receive modes categorized into three major categories: Level Enable mode, Pulse Enable mode, and Software Enable mode • TX unit can generate a valid signal aligned with TXD Pin Assignment The pins for the Parallel IO Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2 Analog Signal Processing This subsection describes components on the chip that sense and process real-world data. 5.2.2.1 SAR ADC ESP32-H2 integrates a Successive Approximation Analog-to-Digital Converter (SAR ADC) to convert analog signals into digital representations. Feature List • 12-bit sampling resolution • Analog voltage sampling from up to five pins • Attenuation of input signals for voltage conversion • Software-triggered one-time sampling • Timer-triggered multi-channel scanning • DMA continuous conversion for seamless data transfer Espressif Systems 22 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Two filters with configurable filter coefficient • Threshold monitoring which helps to trigger an interrupt • Support for Event Task Matrix Pin Assignment The pins for the SAR ADC are multiplexed with GPIO1 ~ GPIO5, JTAG interface, and SPI2 interface. For more information about the pin assignment, see ESP32-H2 Series Datasheet > Section IO Pins and ESP32-H2 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2.2 Temperature Sensor The Temperature Sensor in the ESP32-H2 chip allows for real-time monitoring of temperature changes inside the chip. Feature List • Measurement range: –40°C ~ 125°C • Software triggering, wherein the data can be read continuously once triggered • Hardware automatic triggering and temperature monitoring • Configurable temperature offset based on the environment to improve the accuracy • Adjustable measurement range • Two automatic monitoring wake-up modes: absolute value mode and incremental value mode • Support for Event Task Matrix 5.2.2.3 Analog PAD Voltage Comparator ESP32-H2 integrates two analog voltage comparators. These comparators rely on special pads that support voltage comparison functionality to monitor voltage changes on these pads. Each analog voltage comparator has two pads associated with it, for the main voltage and the reference voltage respectively. The voltage comparison result generated by the analog voltage comparator can be used as Event Task Matrix (ETM) events to drive ETM tasks of other peripherals or trigger interrupts. Feature List • Voltage comparison – Configurable voltage comparison mode – Configurable reference voltage • Interrupt upon changes of voltage comparison result • ETM event generation Pin Assignment The pins for the analog voltage pad comparators are multiplexed with GPIO10 ~ GPIO11. Espressif Systems 23 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Stresses above those listed in Table 10 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 11 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 10: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST OR E Storage temperature –40 105 °C 6.2 Recommended Operating Conditions Table 11: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.35 — — A T A Operating ambient temperature –40 — 105 °C 6.3 DC Characteristics (3.3 V, 25 °C) Table 12: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Pull-up resistor — 45 — kΩ R P D Pull-down resistor — 45 — kΩ V IH_nRST Chip reset release voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage –0.3 — 0.25 × VDD 1 V Espressif Systems 24 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics 1 VDD is the I/O voltage for pins of a particular power domain. 2 V OH and V OL are measured using high-impedance load. 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 13: Current Consumption for Bluetooth LE in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX Bluetooth LE @ 18.0 dBm 112 Bluetooth LE @ 7.0 dBm 55 Bluetooth LE @ –2.0 dBm 35 Bluetooth LE @ –24.0 dBm 26 RX Bluetooth LE 25 Table 14: Current Consumption for 802.15.4 in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.15.4 @ 18.0 dBm 123 802.15.4 @ 7.0 dBm 54 802.15.4 @ –2.0 dBm 38 802.15.4 @ –22.0 dBm 28 RX 802.15.4 29 Espressif Systems 25 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP32-H2 Series Datasheet. 6.4.2 Current Consumption in Other Modes The measurements below are applicable to ESP32-H2FH2S and ESP32-H2FH4S. Table 15: Current Consumption in Modem-sleep Mode Work mode Frequency (MHz) Description Typ 1 (mA) All Peripheral Clocks Disabled Typ 1 (mA) All Peripheral Clocks Enabled Modem-sleep 2 96 CPU running 10 17 CPU in idle 6 13 64 CPU running 8 13 CPU in idle 5 10 48 CPU running 7 11 CPU in idle 5 9 32 CPU running 4 8 CPU in idle 3 7 1 In practice, the current consumption might be different depending on which peripherals are enabled. 2 In Modem-sleep mode, the current consumption might be higher when accessing flash. Table 16: Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep CPU and wireless communication modules are pow- ered down, peripheral clocks are disabled, and all GPIOs are high-impedance 85 CPU, wireless communication modules and periph- erals are powered down, and all GPIOs are high- impedance 25 Deep-sleep LP timer and LP memory are powered on 7 Power off CHIP_EN is set to low level, the chip is powered off 1 Espressif Systems 26 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Bluetooth 5 (LE) Radio Table 17: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402∼2480 MHz RF transmit power range –24∼20 dBm 7.1.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 18: Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 2.3 — kHz Max. |f 0 − f n | n=2, 3, 4, ...k — 1.3 — kHz Max. |f n − f n−5 | n=6, 7, 8, ...k — 1.6 — kHz |f 1 − f 0 | — 0.5 — kHz Modulation characteristics ∆ F 1 avg — 250.3 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 216.3 — kHz ∆ F 2 avg /∆ F 1 avg — 0.91 — — In-band emissions ± 2 MHz offset — –30 — dBm ± 3 MHz offset — –34 — dBm > ± 3 MHz offset — –36 — dBm Table 19: Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 4.7 — kHz Max. |f 0 − f n | n=2, 3, 4, ...k — 1.4 — kHz Max. |f n − f n−5 | n=6, 7, 8, ...k — 1.4 — kHz Cont’d on next page Espressif Systems 27 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 19 – cont’d from previous page Parameter Description Min Typ Max Unit |f 1 − f 0 | — 0.6 — kHz Modulation characteristics ∆ F 1 avg — 502.5 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 491.8 — kHz ∆ F 2 avg /∆ F 1 avg — 0.90 — — In-band emissions ± 4 MHz offset — –32 — dBm ± 5 MHz offset — –33 — dBm > ± 5 MHz offset — –36 — dBm Table 20: Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 1.5 — kHz Max. |f 0 − f n | n=1, 2, 3, ...k — 1.0 — kHz |f 0 − f 3 | — 1.4 — kHz Max. |f n − f n−3 | n=7, 8, 9, ...k — 1.2 — kHz Modulation characteristics ∆ F 1 avg — 251.5 — kHz Min. ∆ F 1 max (for at least 99.9% of all ∆ F 1 max ) — 241.4 — kHz In-band emissions ± 2 MHz offset — –36 — dBm ± 3 MHz offset — –43 — dBm > ± 3 MHz offset — –43 — dBm Table 21: Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 2.5 — kHz Max. |f 0 − f n | n=1, 2, 3, ...k — 0.8 — kHz |f 0 − f 3 | — 0.3 — kHz Max. |f n − f n−3 | n=7, 8, 9, ...k — 1.2 — kHz Modulation characteristics ∆ F 2 avg — 231.7 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 220.0 — kHz In-band emissions ± 2 MHz offset — –30 — dBm ± 3 MHz offset — –34 — dBm > ± 3 MHz offset — –37 — dBm Note that the In-band emissions in Table 18 and Table 21 above are tested at 15 dBm of TX power. However, the test result still meets the Bluetooth SIG standard even if the TX power is increased up to 20 dBm. Espressif Systems 28 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics 7.1.2 Bluetooth LE RF Receiver (RX) Characteristics Table 22: Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –98.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 4 — dB Adjacent channel F = F0 + 1 MHz — 2 — dB F = F0 – 1 MHz — 0 — dB F = F0 + 2 MHz — –29 — dB F = F0 – 2 MHz — –29 — dB F = F0 + 3 MHz — –35 — dB F = F0 – 3 MHz — –36 — dB F ≥ F0 + 4 MHz — –30 — dB F ≤ F0 – 4 MHz — –36 — dB Image frequency — — –30 — dB Adjacent channel to image frequency F = F image + 1 MHz — –32 — dB F = F image – 1 MHz — –35 — dB 30 MHz ~ 2000 MHz — –16 — dBm Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –12 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — 0 — dBm Intermodulation — — –35 — dBm Table 23: Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –95.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 5 — dB Adjacent channel F = F0 + 2 MHz — 1 — dB F = F0 – 2 MHz — –2 — dB F = F0 + 4 MHz — –27 — dB F = F0 – 4 MHz — –32 — dB F = F0 + 6 MHz — –33 — dB F = F0 – 6 MHz — –36 — dB F ≥ F0 + 8 MHz — –36 — dB F ≤ F0 – 8 MHz — –36 — dB Image frequency — — –26 — dB Adjacent channel to image frequency F = F image + 2 MHz — –33 — dB F = F image – 2 MHz — 1 — dB 30 MHz ~ 2000 MHz — –17 — dBm Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –27 — dBm 2484 MHz ~ 2997 MHz — –17 — dBm Cont’d on next page Espressif Systems 29 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 23 – cont’d from previous page Parameter Description Min Typ Max Unit 3000 MHz ~ 12.75 GHz — 0 — dBm Intermodulation — — –27 — dBm Table 24: Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –105.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 0 — dB Adjacent channel F = F0 + 1 MHz — –4 — dB F = F0 – 1 MHz — –6 — dB F = F0 + 2 MHz — –31 — dB F = F0 – 2 MHz — –34 — dB F = F0 + 3 MHz — –39 — dB F = F0 – 3 MHz — –48 — dB F ≥ F0 + 4 MHz — –35 — dB F ≤ F0 – 4 MHz — –48 — dB Image frequency — — –39 — dB Adjacent channel to image frequency F = F image + 1 MHz — –38 — dB F = F image – 1 MHz — –39 — dB Table 25: Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –101.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 2 — dB Adjacent channel F = F0 + 1 MHz — –1 — dB F = F0 – 1 MHz — –4 — dB F = F0 + 2 MHz — –28 — dB F = F0 – 2 MHz — –29 — dB F = F0 + 3 MHz — –38 — dB F = F0 – 3 MHz — –41 — dB F ≥ F0 + 4 MHz — –33 — dB F ≤ F0 – 4 MHz — –41 — dB Image frequency — — –33 — dB Adjacent channel to image frequency F = F image + 1 MHz — –36 — dB F = F image – 1 MHz — –38 — dB Espressif Systems 30 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics 7.2 802.15.4 Radio Table 26: 802.15.4 RF Characteristics Name Description Center frequency range of operating channel 2405∼2480 MHz 1 Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from channel 11 to channel 26. 7.2.1 802.15.4 RF Transmitter (TX) Characteristics Table 27: 802.15.4 Transmitter Characteristics - 250 Kbps Parameter Min Typ Max Unit RF transmit power range –24 — 20 dBm EVM — 3.8% — — 7.2.2 802.15.4 RF Receiver (RX) Characteristics Table 28: 802.15.4 Receiver Characteristics - 250 Kbps Parameter Description Min Typ Max Unit Sensitivity @1% PER — — –101.5 — dBm Maximum received signal @1% PER — — 8 — dBm Relative jamming level Adjacent channel F = F0 + 5 MHz — 31 — dB F = F0 – 5 MHz — 43 — dB Alternate channel F = F0 + 10 MHz — 49 — dB F = F0 – 10 MHz — 54 — dB Espressif Systems 31 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 8 Module Schematics 8 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. R4 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-H2-MINI-1(pin-out) When VBAT is powered by external battery, R2 can be NC. 50 ohm Impedance Control LNA_IN GPIO27 GPIO0 GPIO2 GPIO3 GPIO1 GPIO4 GPIO5 VBAT GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 U0RXD U0TXD GPIO25 GPIO26 GPIO22 GPIO0 GPIO1 EN GPIO2 GPIO3 GPIO9 GPIO8 U0TXD U0RXD GPIO4 GPIO5 GPIO12 GPIO22 GPIO25 GPIO26 GPIO27 EN GPIO14 GPIO13 GPIO14 GPIO10 GPIO11 VBAT RF_ANT GND VDD33 GNDGNDGND GNDGND GND GND GNDGND GND GND VDD33 GND GND VDD33 VDD33 GND VDD33 GND GND VDD33 GND VDD33 GND VDD33 GND GND Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ ESP32-H2-MINI-1> V1.2 ESP32-H2-MINI-1 A4 2 2Monday, May 15, 2023 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ ESP32-H2-MINI-1> V1.2 ESP32-H2-MINI-1 A4 2 2Monday, May 15, 2023 Title Size Page Name Re v Date: Sheet o f Confidential and Proprietary <02_ ESP32-H2-MINI-1> V1.2 ESP32-H2-MINI-1 A4 2 2Monday, May 15, 2023 R2 0 C5 1uF C17 0.1uF C11 TBD C13 0.1uF U2 ESP32-H2-MINI-1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 IO0 9 IO1 10 VBAT 15 IO12 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO26 26 NC 29 NC 28 IO27 27 IO11 21 IO8 22 IO13 12 IO14 13 GND 52 IO10 20 NC 35 IO22 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 IO25 25 D1 ESD C19 0.1uF C12 TBD C10 0.1uF R4 TBD R3 499 C8 0.1uF C2 10nF C1 TBD C4 TBD L2 TBD C7 1uF C6 10uF U1 ESP32-H2 VDD3P3 1 VDD3P3 2 GPIO0 3 GPIO1 4 MTMS 5 MTDO 6 MTCK 7 MTDI 8 GPIO8 10 GPIO9 11 GPIO10 12 GPIO11 13 GPIO12 14 XTAL_32K_P 15 XTAL_32K_N 16 GPIO26 25 GPIO27 26 VDD3P3 27 XTAL_N 28 XTAL_P 29 VDD3P3 30 VDD3P3 31 ANT 32 GND 33 VDDPST1 9 GPIO25 24 U0TXD 23 U0RXD 22 GPIO22 21 VDDPST2 20 VDDA_PMU 19 VBAT 18 CHIP_EN 17 Y1 32MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 ANT1 PCB_ANT 1 2 D2 ESD(NC) Figure 5: ESP32-H2-MINI-1 Schematics Espressif Systems 32 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 8 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. R4 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-H2-MINI-1U(pin-out) When VBAT is powered by external battery, R2 can be NC. 50 ohm Impedance Control LNA_IN GPIO27 GPIO0 GPIO2 GPIO3 GPIO1 GPIO4 GPIO5 VBAT GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 U0RXD U0TXD GPIO25 GPIO26 GPIO22 GPIO0 GPIO1 EN GPIO2 GPIO3 GPIO9 GPIO8 U0TXD U0RXD GPIO4 GPIO5 GPIO12 GPIO22 GPIO25 GPIO26 GPIO27 EN GPIO14 GPIO13 GPIO14 GPIO10 GPIO11 VBAT RF_ANT GND VDD33 GNDGND GNDGND GND GND GNDGND GND GND VDD33 GND GND VDD33 VDD33 GND VDD33 GND GND VDD33 GND VDD33 GND VDD33 GND GND GND Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ ESP32-H2-MINI-1U> V1.1 ESP32-H2-MINI-1U A4 2 2Monday, May 15, 2023 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ ESP32-H2-MINI-1U> V1.1 ESP32-H2-MINI-1U A4 2 2Monday, May 15, 2023 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ ESP32-H2-MINI-1U> V1.1 ESP32-H2-MINI-1U A4 2 2Monday, May 15, 2023 R2 0 C5 1uF D1 ESD C2 10nF D2 ESD(NC) C13 0.1uF ANT1 CONN 1 4 2 3 C10 0.1uF C7 1uF C6 10uF L2 TBD U2 ESP32-H2-MINI-1U GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 IO0 9 IO1 10 VBAT 15 IO12 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO26 26 NC 29 NC 28 IO27 27 IO11 21 IO8 22 IO13 12 IO14 13 GND 52 IO10 20 NC 35 IO22 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 IO25 25 C19 0.1uF R3 499 C1 TBD Y1 32MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 U1 ESP32-H2 VDD3P3 1 VDD3P3 2 GPIO0 3 GPIO1 4 MTMS 5 MTDO 6 MTCK 7 MTDI 8 GPIO8 10 GPIO9 11 GPIO10 12 GPIO11 13 GPIO12 14 XTAL_32K_P 15 XTAL_32K_N 16 GPIO26 25 GPIO27 26 VDD3P3 27 XTAL_N 28 XTAL_P 29 VDD3P3 30 VDD3P3 31 ANT 32 GND 33 VDDPST1 9 GPIO25 24 U0TXD 23 U0RXD 22 GPIO22 21 VDDPST2 20 VDDA_PMU 19 VBAT 18 CHIP_EN 17 C17 0.1uF C12 TBD R4 TBD C8 0.1uF C4 TBD C11 TBD Figure 6: ESP32-H2-MINI-1U Schematics Espressif Systems 33 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. X1: ESR = Max. 70 K Optional ESP32-H2-MINI-1 ESP32-H2-MINI-1U IO2TMS IO3TDO IO4TCK IO5TDI IO9 3V3 IO25 USB_D+ EN RXD0 TXD0 IO27 IO26 USB_D- X32K_N X32K_P IO2 IO3 EN IO0 IO1 IO12 IO4 IO5 IO22 IO8 IO10 IO11 IO13 IO14 VBAT GND VDD33 GND GND GND GND GND GND GND GND VDD33 GND VDD33 GND GND GND R7 TBD JP5 Battery + 1 - 2 X1 32.768KHz 2 1 R8 10K C2 0.1uF R4 0 JP4 UART 1 1 2 2 3 3 4 4 C4 0.1uF R2 0 C3 TBD C1 10uF R5 0(NC) R3 0(NC) C8 12pF U1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 IO0 9 IO1 10 VBAT 15 IO12 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO26 26 NC 29 NC 28 IO27 27 IO11 21 IO8 22 IO13 12 IO14 13 GND 52 IO10 20 NC 35 IO22 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 IO25 25 JP3 USB 1 1 2 2 JP2 Boot Option 1 1 2 2 C7 12pF C6 TBD C5 TBD SW1 R6 0 JP1 JTAG 1 1 2 2 3 3 4 4 R1 TBD Figure 7: Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32-H2 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-H2’s power-up and reset sequence timing diagram, please refer to ESP32-H2 Series Datasheet > Section Power Supply. Espressif Systems 34 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 16.6±0.2 0.813.2±0.2 Top view Side view Bottom view 2.4±0.15 11.2 0.62 0.62 11.95 9.95 Ø0.5 Unit: mm 9.9 5.4 0.6 1.45 1.45 1.6 11.8 11.9 1.6 0.6 5.4 9.8 4 x 0.7 4 x 0.7 48 x 0.4 48 x 0.8 0.8 Bottom view Figure 8: ESP32-H2-MINI-1 Physical Dimensions 12.5±0.2 0.813.2±0.2 12.25 Unit: mm 1.55 1.7 8.7 0.48 9.18 11.55 2.4±0.15 0.85 0.48 9.9 5.4 0.6 1.45 1.45 1.6 11.8 11.9 1.6 0.6 5.4 9.8 4 x 0.7 4 x 0.7 48 x 0.4 48 x 0.8 0.8 Top view Side view Bottom view 5.6 Figure 9: ESP32-H2-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information. Espressif Systems 35 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP32-H2-MINI-1U uses the third generation external antenna connector as shown in Figure 10 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 10: Dimensions of External Antenna Connector The external antenna used for ESP32-H2-MINI-1U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna Espressif Systems 36 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 10 Physical Dimensions based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 10 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 37 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figure 11 ESP32-H2-MINI-1 Recommended PCB Land Pattern and Figure 12 ESP32-H2-MINI-1U Recommended PCB Land Pattern: the recommended PCB land patterns with all the dimensions needed for PCB design. • Source files for ESP32-H2-MINI-1 and ESP32-H2-MINI-1U: the recommended PCB land patterns to measure dimensions not covered in Figure 11 and Figure 12. You can view the source files with Autodesk Viewer. • 3D models of ESP32-H2-MINI-1 and ESP32-H2-MINI-1U: the .STEP format file. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 1.6 Antenna Area Pin 1 11.2 0.6 9.9 5.4 11.9 1.6 13.2 16.6 1.45 5.4 1.450.6 11.8 9.8 Unit: mm Pad 48 x 0.4 48 x 0.8 4 x 0.7 4 x 0.70.8 Via for thermal pad Figure 11: ESP32-H2-MINI-1 Recommended PCB Land Pattern Espressif Systems 38 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 11 PCB Layout Recommendations 1.6 Pin 1 12.5 0.6 9.9 5.4 11.9 1.6 13.2 1.45 5.4 1.450.6 11.8 9.8 48 x 0.4 48 x 0.8 4 x 0.7 4 x 0.70.8 5.6 Unit: mm Pad Via for thermal pad Figure 12: ESP32-H2-MINI-1U Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32-H2 Hardware Design Guidelines > Section Positioning a Module on a Base Board. Espressif Systems 39 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Soldering Profile 12.3.1 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 ℃/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (℃) 180 230 Cooling ＜ 180 °C –5 ~ –1 ℃/s Figure 13: Reflow Profile Espressif Systems 40 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 41 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32-H2 Series Datasheet – Specifications of the ESP32-H2 hardware. • ESP32-H2 Technical Reference Manual – Detailed information on how to use the ESP32-H2 memory and peripherals. • ESP32-H2 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-H2 into your hardware product. • ESP32-H2 Series SoC Errata – Descriptions of known errors in ESP32-H2 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-H2 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-H2 • ESP32-H2 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-H2 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-H2 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-H2 Series SoCs – Browse through all ESP32-H2 SoCs. https://espressif.com/en/products/socs?id=ESP32-H2 • ESP32-H2 Series Modules – Browse through all ESP32-H2-based modules. https://espressif.com/en/products/modules?id=ESP32-H2 • ESP32-H2 Series DevKits – Browse through all ESP32-H2-based devkits. https://espressif.com/en/products/devkits?id=ESP32-H2 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 42 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 43 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 Revision History Revision History Date Version Release notes 2025-10-13 v1.4 • Updated Figure 4 Visualization of Timing Parameters for the Strapping Pins • Updated Section 5.2.2.1 SAR ADC • Updated Table 11 Recommended Operating Conditions • Added Section 12.4 Datasheet Versioning 2025-07-21 v1.3 Section 10.2 Dimensions of External Antenna Connector: Added the external an- tenna information for certification 2025-05-06 v1.2 Updated Table 17 and Table 27 2025-02-28 v1.1 Updated the ordering code in Section 1.2 Series Comparison according to chip revision v1.2 2024-11-08 v1.0 • Official release • Improved the content, formatting, structure, and wording of the whole doc- ument 2023-10-17 v0.6 • Updated the description about Boot Mode Control in Section Strapping Pins. • Updated the descriptions about resources offered in Section 11.1 PCB Land Pattern. • Updated measurements in Table 15 and 16. 2023-05-24 v0.5 Preliminary release Espressif Systems 44 Submit Documentation Feedback ESP32-H2-MINI-1 & MINI-1U Datasheet v1.4 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com