1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 SDIO Sampling and Driving Clock Edge Control 4.3 ROM Messages Printing Control 4.4 JTAG Signal Source Control 4.5 Chip Power-up and Reset 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interface 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 I2S Controller 5.2.1.5 Pulse Count Controller 5.2.1.6 USB Serial/JTAG Controller 5.2.1.7 Two-wire Automotive Interface 5.2.1.8 SDIO Slave Controller 5.2.1.9 LED PWM Controller 5.2.1.10 Motor Control PWM 5.2.1.11 Remote Control Peripheral 5.2.1.12 Parallel IO Controller 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 6.5 Memory Specifications 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 7.2 Bluetooth 5 (LE) Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 7.3 802.15.4 Radio 7.3.1 802.15.4 RF Transmitter (TX) Characteristics 7.3.2 802.15.4 RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Reflow Profile 12.4 Ultrasonic Vibration Datasheet Versioning Related Documentation and Resources Revision History ESP32-C6-MINI-1 ESP32-C6-MINI-1U Datasheet Version 1.4 Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth ® 5 (LE), Zigbee and Thread (802.15.4) Built around ESP32-C6 series of SoCs, 32-bit RISC-V single-core microprocessor Flash up to 8 MB in chip package 22 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector ESP32-C6-MINI-1 ESP32-C6-MINI-1U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/documentation/esp32-c6-mini-1_mini-1u_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to 160 MHz • ROM: 320 KB • HP SRAM: 512 KB • LP SRAM: 16 KB • Flash up to 8 MB in chip package Wi-Fi • 1T1R in 2.4 GHz band • Operating frequency: 2412 ~ 2484 MHz • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~ MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multiple input, multiple output) to increase network capacity – Beamformee that improves signal quality – Channel quality indication (CQI) – DCM (dual carrier modulation) to improve link robustness – Spatial reuse to maximize parallel transmissions – Target wake time (TWT) that optimizes power saving mechanisms • Fully compatible with IEEE 802.11b/g/n protocol – 20 MHz and 40 MHz bandwidth – Data rate up to 150 Mbps – Wi-Fi Multimedia (WMM) – TX/RX A-MPDU, TX/RX A-MSDU – Immediate Block ACK – Fragmentation and defragmentation – Transmit opportunity (TXOP) – Automatic Beacon monitoring (hardware TSF) – 4 × virtual Wi-Fi interfaces – Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when ESP32-C6 scans in Station mode, the SoftAP channel will change along with the Station channel – 802.11mc FTM Bluetooth ® • Bluetooth LE: Bluetooth 5.3 certified • Bluetooth mesh • High power mode (20 dBm) • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • Advertising extensions • Multiple advertisement sets Espressif Systems 2 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 1 Module Overview • Channel selection algorithm #2 • LE power control • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna IEEE 802.15.4 • Compliant with IEEE 802.15.4-2015 protocol • OQPSK PHY in 2.4 GHz band • Data rate: 250 Kbps • Thread 1.3 • Zigbee 3.0 Peripherals • GPIO, SPI, parallel IO interface, UART, I2C, I2S, RMT (TX/RX), pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO slave controller, GDMA, TWAI ® controller, on-chip debug functionality via JTAG, event task matrix, ADC, temperature sensor, system timer, general-purpose timers, and watchdog timers Integrated Components on Module • 40 MHz crystal oscillator Antenna Options • On-board PCB antenna (ESP32-C6-MINI-1) • External antenna via a connector (ESP32-C6-MINI-1U) Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: – 85 °C version module: –40 ~ 85 °C – 105 °C version module: –40 ~ 105 °C Certification • RF certification: See certificates • Green certification: RoHS/REACH Test • HTOL/HTSL/uHAST/TCT/ESD 1.2 Series Comparison ESP32-C6-MINI-1 and ESP32-C6-MINI-1U are two powerful, general-purpose Wi-Fi, IEEE 802.15.4, and Bluetooth LE modules. The rich set of peripherals and high performance make the module an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. ESP32-C6-MINI-1 comes with a PCB antenna. ESP32-C6-MINI-1U comes with a connector for an external antenna. They both feature an SPI flash up to 8 MB. Espressif Systems 3 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 1 Module Overview The series comparison for the two modules is as follows: Table 1-1. ESP32-C6-MINI-1 (ANT) Series Comparison 1 Ambient Temp. 4 Size 5 Ordering Code Flash 2,3 (°C) (mm) ESP32-C6-MINI-1-N4 4 MB (Quad SPI) –40 ~ 85 13.2 × 16.6 × 2.4ESP32-C6-MINI-1-H4 –40 ~ 105 ESP32-C6-MINI-1-H8 8 MB (Quad SPI) 1 This table shares the same notes presented in Table 1-2 below. Table 1-2. ESP32-C6-MINI-1U (CONN) Series Comparison Ambient Temp. 4 Size 5 Ordering Code Flash 2,3 (°C) (mm) ESP32-C6-MINI-1U-N4 4 MB (Quad SPI) –40 ~ 85 13.2 × 12.5 × 2.4ESP32-C6-MINI-1U-H4 –40 ~ 105 ESP32-C6-MINI-1U-H8 8 MB (Quad SPI) 2 By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does not support the auto suspend feature. If you need the flash auto suspend feature, please contact us. 3 The flash is integrated in the chip’s package. For specifications, refer to Section 6.5 Memory Specifications. 4 Ambient temperature specifies the recommended temperature range of the environ- ment immediately outside the Espressif module. 5 For details, refer to Section 10.1 Module Dimensions. At the core of the modules is ESP32-C6FH4/ESP32-C6FH8, a 32-bit RISC-V single-core processor. For more information on ESP32-C6FH4/ESP32-C6FH8, please refer to ESP32-C6 Series Datasheet. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Audio Devices • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers Espressif Systems 4 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 10 4 Boot Configurations 12 4.1 Chip Boot Mode Control 13 4.2 SDIO Sampling and Driving Clock Edge Control 14 4.3 ROM Messages Printing Control 14 4.4 JTAG Signal Source Control 15 4.5 Chip Power-up and Reset 16 5 Peripherals 17 5.1 Peripheral Overview 17 5.2 Peripheral Description 17 5.2.1 Connectivity Interface 17 5.2.1.1 UART Controller 17 5.2.1.2 SPI Controller 18 5.2.1.3 I2C Controller 19 5.2.1.4 I2S Controller 19 5.2.1.5 Pulse Count Controller 20 5.2.1.6 USB Serial/JTAG Controller 20 5.2.1.7 Two-wire Automotive Interface 21 5.2.1.8 SDIO Slave Controller 21 5.2.1.9 LED PWM Controller 22 5.2.1.10 Motor Control PWM 22 5.2.1.11 Remote Control Peripheral 23 5.2.1.12 Parallel IO Controller 24 5.2.2 Analog Signal Processing 24 5.2.2.1 SAR ADC 24 5.2.2.2 Temperature Sensor 25 6 Electrical Characteristics 26 6.1 Absolute Maximum Ratings 26 6.2 Recommended Operating Conditions 26 6.3 DC Characteristics (3.3 V, 25 °C) 26 6.4 Current Consumption Characteristics 27 Espressif Systems 5 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Contents 6.4.1 Current Consumption in Active Mode 27 6.4.2 Current Consumption in Other Modes 29 6.5 Memory Specifications 29 7 RF Characteristics 31 7.1 Wi-Fi Radio 31 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 31 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 32 7.2 Bluetooth 5 (LE) Radio 34 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 34 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 35 7.3 802.15.4 Radio 37 7.3.1 802.15.4 RF Transmitter (TX) Characteristics 38 7.3.2 802.15.4 RF Receiver (RX) Characteristics 38 8 Module Schematics 39 9 Peripheral Schematics 41 10 Physical Dimensions 42 10.1 Module Dimensions 42 10.2 Dimensions of External Antenna Connector 43 11 PCB Layout Recommendations 45 11.1 PCB Land Pattern 45 11.2 Module Placement for PCB Design 46 12 Product Handling 47 12.1 Storage Conditions 47 12.2 Electrostatic Discharge (ESD) 47 12.3 Reflow Profile 47 12.4 Ultrasonic Vibration 48 Datasheet Versioning 49 Related Documentation and Resources 50 Revision History 51 Espressif Systems 6 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 List of Tables List of Tables 1-1 ESP32-C6-MINI-1 (ANT) Series Comparison 1 4 1-2 ESP32-C6-MINI-1U (CONN) Series Comparison 4 3-1 Pin Definitions 10 4-1 Default Configuration of Strapping Pins 12 4-2 Description of Timing Parameters for the Strapping Pins 13 4-3 Chip Boot Mode Control 14 4-4 SDIO Input Sampling Edge/Output Driving Edge Control 14 4-5 UART0 ROM Message Printing Control 15 4-6 USB Serial/JTAG ROM Message Printing Control 15 4-7 JTAG Signal Source Control 15 4-8 Description of Timing Parameters for Power-up and Reset 16 6-1 Absolute Maximum Ratings 26 6-2 Recommended Operating Conditions 26 6-3 DC Characteristics (3.3 V, 25 °C) 26 6-4 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 27 6-5 Current Consumption for Bluetooth LE in Active Mode 27 6-6 Current Consumption for 802.15.4 in Active Mode 27 6-7 Current Consumption in Modem-sleep Mode 29 6-8 Current Consumption in Low-Power Modes 29 6-9 Flash Specifications 29 7-1 Wi-Fi RF Characteristics 31 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 31 7-3 TX EVM Test 1 31 7-4 RX Sensitivity 32 7-5 Maximum RX Level 33 7-6 RX Adjacent Channel Rejection 33 7-7 Bluetooth LE RF Characteristics 34 7-8 Bluetooth LE - Transmitter Characteristics - 1 Mbps 34 7-9 Bluetooth LE - Transmitter Characteristics - 2 Mbps 34 7-10 Bluetooth LE - Transmitter Characteristics - 125 Kbps 35 7-11 Bluetooth LE - Transmitter Characteristics - 500 Kbps 35 7-12 Bluetooth LE - Receiver Characteristics - 1 Mbps 35 7-13 Bluetooth LE - Receiver Characteristics - 2 Mbps 36 7-14 Bluetooth LE - Receiver Characteristics - 125 Kbps 37 7-15 Bluetooth LE - Receiver Characteristics - 500 Kbps 37 7-16 802.15.4 RF Characteristics 37 7-17 802.15.4 Transmitter Characteristics - 250 Kbps 38 7-18 802.15.4 Receiver Characteristics - 250 Kbps 38 Espressif Systems 7 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 List of Figures List of Figures 2-1 ESP32-C6-MINI-1 Block Diagram 9 2-2 ESP32-C6-MINI-1U Block Diagram 9 3-1 Pin Layout (Top View) 10 4-1 Visualization of Timing Parameters for the Strapping Pins 13 4-2 Visualization of Timing Parameters for Power-up and Reset 16 8-1 ESP32-C6-MINI-1 Schematics 39 8-2 ESP32-C6-MINI-1U Schematics 40 9-1 Peripheral Schematics 41 10-1 ESP32-C6-MINI-1 Physical Dimensions 42 10-2 ESP32-C6-MINI-1U Physical Dimensions 42 10-3 Dimensions of External Antenna Connector 43 11-1 ESP32-C6-MINI-1 Recommended PCB Land Pattern 45 11-2 ESP32-C6-MINI-1U Recommended PCB Land Pattern 46 12-1 Reflow Profile 47 Espressif Systems 8 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 2 Block Diagram 2 Block Diagram SPI Flash ESP32-C6 RF Matching 40 MHz Crystal GND EN GPIOs Antenna 3V3 Figure 2-1. ESP32-C6-MINI-1 Block Diagram SPI Flash ESP32-C6 RF Matching 40 MHz Crystal GND EN GPIOs Antenna 3V3 Figure 2-2. ESP32-C6-MINI-1U Block Diagram Note: For the pin mapping between the chip and the in-package flash, please refer to ESP32-C6 Series Datasheet > Table Pin Mapping Between Chip and Flash. Espressif Systems 9 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10.1 Module Dimensions. The pin diagram is applicable for ESP32-C6-MINI-1 and ESP32-C6-MINI-1U, but the latter has no keepout zone. Pin Layout (Top View) Pin 49 GND GND GND Pin 10 Pin 1 Pin 8 Pin 5 Pin 4 Pin 12 Pin 15 Pin 14 Pin 17 Pin 29 Pin 45 3V3 IO4 IO13 IO1 IO14 IO8 GND IO15 IO9 IO21 IO22 NC Pin 50 GND Pin 2 Pin 20 Pin 9 Pin 13 GND Pin 16 IO2 Pin 22 IO0 Pin 21 Pin 18 Pin 51 GND Pin 24 Pin 33 Pin 30 Pin 32 Pin 34 Pin 36 Pin 40 GND Pin 47 Pin 44 GND GND GND GND Pin 7 NC EN IO3 Pin 6 Pin 3 Pin 53 GND Pin 11 GND Pin 52 GND IO5 IO12 NC IO19 IO7 IO20 IO23 Pin 19 Pin 23 Pin 25 NC RXD0 Pin 26 GND TXD0 Pin 27 GND NC Pin 28 Pin 31 GND GND GND Pin 35 GND GND GND GND Pin 38 GND GND Pin 37 Keepout Zone Pin 39 Pin 41 Pin 42 Pin 43 GND NC Pin 46 Pin 48 GND IO6 IO18 NC GND GND Figure 3-1. Pin Layout (Top View) 3.2 Pin Description The module has 53 pins. See pin definitions in Table 3-1 Pin Definitions. For peripheral pin configurations, please refer to ESP32-C6 Series Datasheet. Table 3-1. Pin Definitions Name No. Type 1 Function GND 1, 2, 11, 14, 36∼53 P Ground 3V3 3 P Power supply Cont’d on next page Espressif Systems 10 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 3 Pin Definitions Table 3-1 – cont’d from previous page Name No. Type 1 Function NC 4 — NC IO2 5 I/O/T GPIO2, LP_GPIO2, LP_UART_RTSN, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, LP_GPIO3, LP_UART_CTSN, ADC1_CH3 NC 7 — NC EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO4 9 I/O/T MTMS, GPIO4, LP_GPIO4, LP_UART_RXD, ADC1_CH4, FSPIHD IO5 10 I/O/T MTDI, GPIO5, LP_GPIO5, LP_UART_TXD, ADC1_CH5, FSPIWP IO0 12 I/O/T GPIO0, XTAL_32K_P, LP_GPIO0, LP_UART_DTRN, ADC1_CH0 IO1 13 I/O/T GPIO1, XTAL_32K_N, LP_GPIO1, LP_UART_DSRN, ADC1_CH1 IO6 15 I/O/T MTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK IO7 16 I/O/T MTDO, GPIO7, LP_GPIO7, LP_I2C_SCL, FSPID IO12 17 I/O/T GPIO12, USB_D- IO13 18 I/O/T GPIO13, USB_D+ IO14 19 I/O/T GPIO14 IO15 20 I/O/T GPIO15 NC 21 — NC IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO18 24 I/O/T GPIO18, SDIO_CMD, FSPICS2 IO19 25 I/O/T GPIO19, SDIO_CLK, FSPICS3 IO20 26 I/O/T GPIO20, SDIO_DATA0, FSPICS4 IO21 27 I/O/T GPIO21, SDIO_DATA1, FSPICS5 IO22 28 I/O/T GPIO22, SDIO_DATA2 IO23 29 I/O/T GPIO23, SDIO_DATA3 RXD0 30 I/O/T U0RXD, GPIO17, FSPICS1 TXD0 31 I/O/T U0TXD, GPIO16, FSPICS0 NC 32 — NC NC 33 — NC NC 34 — NC NC 35 — NC 1 P: power supply; I: input; O: output; T: high impedance. Espressif Systems 11 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32-C6 Series Datasheet > Chapter Boot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter 8 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse parameters at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pin: GPIO8 and GPIO9 • SDIO Sampling and Driving Clock Edge – Strapping pin: MTMS and MTDI • ROM message printing – Strapping pin: GPIO8 – eFuse parameter: EFUSE_UART_PRINT_CONTROL and EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT • JTAG signal source – Strapping pin: GPIO15 – eFuse parameter: EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_JTAG_SEL_ENABLE The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer to ESP32-C6 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4-1. Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value MTMS Floating – MTDI Floating – GPIO8 Floating – GPIO9 Weak pull-up 1 GPIO15 Floating – To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-C6 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. Espressif Systems 12 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations All strapping pins have latches. At Chip Reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. For details on Chip Reset, see ESP32-C6 Technical Reference Manual > Chapter Reset and Clock. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 4-2 and Figure 4-1. Table 4-2. Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_PU pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. 3 Strapping pin VIL_nRST VIH t SU t H CHIP_PU Figure 4-1. Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 4-3 Chip Boot Mode Control. Espressif Systems 13 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations Table 4-3. Chip Boot Mode Control Boot Mode GPIO8 GPIO9 SPI boot mode Any value 1 Joint download boot mode 2 1 0 1 Bold marks the default value and configuration. 2 Joint Download Boot mode supports the following download methods: • USB-Serial-JTAG Download Boot • UART Download Boot • SDIO Download Boot 4.2 SDIO Sampling and Driving Clock Edge Control The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive output lines. See Table 4-4 SDIO Input Sampling Edge/Output Driving Edge Control. Table 4-4. SDIO Input Sampling Edge/Output Driving Edge Control Edge behavior MTMS MTDI Falling edge sampling, falling edge output 0 0 Falling edge sampling, rising edge output 0 1 Rising edge sampling, falling edge output 1 0 Rising edge sampling, rising edge output 1 1 1 MTMS and MTDI are floating by default, so above are not default configurations. 4.3 ROM Messages Printing Control During the boot process, ROM message printing is enabled if LP_AON_STORE4_REG[0] is 0 (default), and disabled if LP_AON_STORE4_REG[0] is 1. When ROM message printing is enabled, the messages can be printed to: • (Default) UART0 and USB Serial/JTAG controller • USB Serial/JTAG controller • UART0 EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 4-5 UART0 ROM Message Printing Control. Espressif Systems 14 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations Table 4-5. UART0 ROM Message Printing Control UART0 ROM Code Printing EFUSE_UART_PRINT_CONTROL GPIO8 Enabled 0 Ignored 1 0 2 1 Disabled 1 1 2 0 3 Ignored 1 Bold marks the default value and configuration. EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT controls the printing to USB Serial/JTAG controller as shown in Table 4-6 USB Serial/JTAG ROM Message Printing Control. Table 4-6. USB Serial/JTAG ROM Message Printing Control USB Serial/JTAG ROM Code Printing EFUSE_DIS_USB_SERIAL_JTAG 2 EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT Enabled 0 0 Disabled 0 1 1 Ignored 1 Bold marks the default value and configuration. 2 EFUSE_DIS_USB_SERIAL_JTAG controls whether to disable USB Serial/JTAG. 4.4 JTAG Signal Source Control The strapping pin GPIO15 can be used to control the source of JTAG signals during the early boot process. This pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that cannot be in a high impedance state. As Table 4-7 JTAG Signal Source Control shows, GPIO15 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG and EFUSE_JTAG_SEL_ENABLE. Table 4-7. JTAG Signal Source Control JTAG Signal Source EFUSE_DIS_PAD_JTAG EFUSE_DIS_USB_JTAG EFUSE_JTAG_SEL_ENABLE GPIO15 USB Serial/JTAG Controller 0 0 0 Ignored 0 0 1 1 1 0 Ignored Ignored JTAG pins 2 0 0 1 0 0 1 Ignored Ignored JTAG is disabled 1 1 Ignored Ignored 1 Bold marks the default value and configuration. 2 JTAG pins refer to MTDI, MTCK, MTMS, and MTDO. Espressif Systems 15 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 4 Boot Configurations 4.5 Chip Power-up and Reset Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, CHIP_PU – the pin used for power-up and reset – is pulled high to activate the chip. For information on CHIP_PU as well as power-up and reset timing, see Figure 4-2 and Table 4-8. V IL_nRST t ST BL t RST 2.8 V VDDA3P3, VDDPST1, VDDPST2, VDDA1, VDDA2 CHIP_PU Figure 4-2. Visualization of Timing Parameters for Power-up and Reset Table 4-8. Description of Timing Parameters for Power-up and Reset Parameter Description Min (µs) t ST BL Time reserved for the power rails of VDDA3P3, VDDPST1, VD- DPST2, VDDA1 and VDDA2 to stabilize before the CHIP_PU pin is pulled high to activate the chip 50 t RST Time reserved for CHIP_PU to stay below V IL_nRST to reset the chip (see Table 6-3) 50 Espressif Systems 16 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP32-C6FH4/ESP32-C6FH8 integrates a rich set of peripherals including SPI, parallel IO interface, UART, I2C, I2S, RMT (TX/RX), LED PWM, USB Serial/JTAG controller, MCPWM, SDIO slave controller, GDMA, TWAI ® controller, on-chip debug functionality via JTAG, event task matrix, ADC, as well as up to 22 GPIOs, etc. For detailed information about module peripherals, please refer to ESP32-C6 Series Datasheet > Section Functional Description. Note that the ADC measurement range and accuracy in the ESP32-C6 Series Datasheet are applicable to modules manufactured on and after the PW Number PW-2023-06-XXX on packaging labels. For modules manufactured earlier than these PW numbers, please ask our sales team to provide the actual range and accuracy according to batches. Note: The content below is sourced from ESP32-C6 Series Datasheet > Section Peripherals. Some information may not be applicable to ESP32-C6-MINI-1 and ESP32-C6-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer to ESP32-C6 Technical Reference Manual > Section Peripheral Signal List. 5.2 Peripheral Description This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality. 5.2.1 Connectivity Interface This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks. 5.2.1.1 UART Controller The UART Controller in the ESP32-C6 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It consists of two UARTs in the main system, and one low-power LP UART. Feature List • Programmable baud rates up to 5 MBaud • RAM shared by TX FIFOs and RX FIFOs • Support for various lengths of data bits and stop bits • Parity bit support • Special character AT_CMD detection • RS485 protocol support (not supported by LP UART) • IrDA protocol support (not supported by LP UART) Espressif Systems 17 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • High-speed data communication using GDMA (not supported by LP UART) • Receive timeout feature • UART as the wake-up source • Software and hardware flow control Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.2 SPI Controller ESP32-C6 has the following SPI interfaces: • SPI0 used by ESP32-C6’s cache and GDMA to access in-package or off-package flash • SPI1 used by the CPU to access in-package or off-package flash • SPI2 is a general-purpose SPI controller with access to general-purpose DMA channels SPI0 and SPI1 are reserved for system use, and only SPI2 is available for users. Features of SPI0 and SPI1 • Supports Single SPI, Dual SPI, Quad SPI (QPI) modes • Data transmission is in bytes Features of SPI2 • Supports operation as a master or slave • Support for GDMA • Supports Single SPI, Dual SPI, Quad SPI (QPI) modes • Configurable clock polarity (CPOL) and phase (CPHA) • Configurable clock frequency • Data transmission is in bytes • Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first • As a master – Supports 2-line full-duplex communication with clock frequency up to 80 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz – Provides six FSPICS… pins for connection with six independent SPI slaves – Configurable CS setup time and hold time • As a slave – Supports 2-line full-duplex communication with clock frequency up to 40 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 40 MHz Espressif Systems 18 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.3 I2C Controller The I2C Controller supports communication between the master and slave devices using the I2C bus. Feature List • Two I2C controllers: one in the main system and one in the low-power system • Communication with multiple external devices • Master and slave modes for I2C, and master mode only for LP I2C • Standard mode (100 Kbit/s) and fast mode (400 Kbit/s) • SCL clock stretching in slave mode • Programmable digital noise filtering • Support for 7-bit and 10-bit addressing, as well as dual address mode Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.4 I2S Controller The I2S Controller in the ESP32-C6 chip provides a flexible communication interface for streaming digital data in multimedia applications, particularly digital audio applications. Feature List • Master mode and slave mode • Full-duplex and half-duplex communications • Separate TX and RX units that can work independently or simultaneously • A variety of audio standards supported: – TDM Philips standard – TDM MSB alignment standard – TDM PCM standard – PDM standard • PCM-to-PDM TX interface • Configurable high-precision BCK clock, with frequency up to 40 MHz – Sampling frequencies can be 8 kHz, 16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz, 128 kHz, 192 kHz, etc. • 8-/16-/24-/32-bit data communication Espressif Systems 19 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals • Direct Memory Access (DMA) • A-law and µ-law compression/decompression algorithms for improved signal-to-quantization noise ratio • Flexible data format control Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.5 Pulse Count Controller The Pulse Count Controller (PCNT) is designed to count input pulses by tracking rising and falling edges of the input pulse signal. Feature List • Four independent pulse counters with two channels each • Counter modes: increment, decrement, or disable • Glitch filtering for input pulse signals and control signals • Selection between counting on rising or falling edges of the input pulse signal Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.6 USB Serial/JTAG Controller The USB Serial/JTAG controller in the ESP32-C6 chip provides an integrated solution for communicating to the chip over a standard USB CDC-ACM serial port as well as a convenient method for JTAG debugging. It eliminates the need for external chips or JTAG adapters, saving space and reducing cost. Feature List • USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not support the faster 480 Mbit/s high-speed transfer mode) • CDC-ACM virtual serial port and JTAG adapter functionality • CDC-ACM: – CDC-ACM adherent serial port emulation (plug-and-play on most modern OSes) – Host controllable chip reset and entry into download mode • JTAG adapter functionality: – Fast communication with CPU debugging core using a compact representation of JTAG instructions • Support for reprogramming of attached flash memory through the ROM startup code • Internal PHY Espressif Systems 20 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.7 Two-wire Automotive Interface The Two-wire Automotive Interface (TWAI ® ) is a multi-master, multi-cast communication protocol designed for automotive applications. The TWAI controller facilitates the communication based on this protocol. Feature List • Compatible with ISO 11898-1 protocol (CAN Specification 2.0) • Standard frame format (11-bit ID) and extended frame format (29-bit ID) • Bit rates from 1 Kbit/s to 1 Mbit/s • Multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required) • Special transmissions: Single-shot and Self Reception • Acceptance filter (single and dual filter modes) • Error detection and handling: error counters, configurable error warning limit, error code capture, arbitration lost capture, automatic transceiver standby Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.8 SDIO Slave Controller The SDIO Slave Controller in the ESP32-C6 chip provides hardware support for the Secure Digital Input/Output (SDIO) device interface. It allows an SDIO host to access the ESP32-C6 via an SDIO bus protocol. Feature List • Compatible with SD Physical Layer Specification V2.00 and SDIO V2.00 specifications • Support for SPI, 1-bit SDIO, and 4-bit SDIO transfer modes • Clock range of 0 ~ 50 MHz • Configurable sample and drive clock edge • Integrated and SDIO-accessible registers for information interaction • Support for SDIO interrupt mechanism • Automatic padding data and discarding the padded data on the SDIO bus • Block size up to 512 bytes • Interrupt vector between the host and slave for bidirectional interrupt • Support DMA for data transfer • Support for wake-up from sleep when connection is retained Espressif Systems 21 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.9 LED PWM Controller The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List • Six independent PWM generators • Maximum PWM duty cycle resolution of 20 bits • Four independent timers with 20-bit counters, configurable fractional clock dividers and counter overflow values • Adjustable phase of PWM signal output • PWM duty cycle dithering • Automatic duty cycle fading – Linear duty cycle fading — only one duty cycle range – Gamma curve fading — up to 16 duty cycle ranges for each PWM generator, with independently configured fading direction (increase or decrease), fading amount, number of fades, and fading frequency • PWM signal output in low-power mode (Light-sleep mode) • Event generation and task response achieved by the Event Task Matrix (ETM) Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.10 Motor Control PWM The Motor Control Pulse Width Modulator (MCPWM) is designed for driving digital motors and smart light. The MCPWM is divided into five main modules: PWM timers, PWM operators, Capture module, Fault Detection module, and Event Task Matrix (ETM) module. Feature List • Three PWM timers for precise timing and frequency control – Every PWM timer has a dedicated 8-bit clock prescaler – The 16-bit counter in the PWM timer can work in count-up mode, count-down mode, or count-up-down mode – Hardware or software synchronization to trigger a reload on the PWM timer or the prescaler’s restart, with selectable hardware synchronization source • Three PWM operators for generating waveform pairs Espressif Systems 22 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals – Six PWM outputs to operate in several topologies – Configurable dead time on rising and falling edges; each set up independently – Modulating of PWM output by high-frequency carrier signals, useful when gate drivers are insulated with a transformer • Capture module for hardware-based signal processing – Speed measurement of rotating machinery – Measurement of elapsed time between position sensor pulses – Period and duty cycle measurement of pulse train signals – Decoding current or voltage amplitude derived from duty-cycle-encoded signals of current/voltage sensors – Three individual capture channels, each of which with a 32-bit time-stamp register – Selection of edge polarity and prescaling of input capture signals – The capture timer can sync with a PWM timer or external signals • Fault Detection module – Programmable fault handling in both cycle-by-cycle mode and one-shot mode – A fault condition can force the PWM output to either high or low logic levels • Event generation and task response achieved by the Event Task Matrix (ETM) Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.11 Remote Control Peripheral The Remote Control Peripheral (RMT) controls the transmission and reception of infrared remote control signals. Feature List • Four channels for sending and receiving infrared remote control signals • Independent transmission and reception capabilities for each channel • Support for Normal TX/RX mode, Wrap TX/RX mode, Continuous TX mode • Modulation on TX pulses and Demodulation on RX pulses • RX filtering for improved signal reception • Ability to transmit data simultaneously on multiple channels • Clock divider counter, state machine, and receiver for each RX channel • Default allocation of RAM blocks to channels based on channel number • RAM containing 16-bit entries with “level” and “period” fields Espressif Systems 23 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.1.12 Parallel IO Controller The Parallel IO Controller (PARLIO) in the ESP32-C6 chip enables data transfer between external devices and internal memory on a parallel bus through GDMA. It consists of a transmitter (TX unit) and a receiver (RX unit), making it a versatile interface for connecting various peripherals. Feature List • 1/2/4/8/16-bit configurable data bus width • Half-duplex communication with 16-bit data bus width and full-duplex communication with 8-bit data bus width • Bit reordering in 1/2/4-bit data bus width mode • RX unit supports 15 receive modes categorized into three major categories: Level Enable mode, Pulse Enable mode, and Software Enable mode • TX unit can generate a valid signal aligned with TX Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.2 Analog Signal Processing This subsection describes components on the chip that sense and process real-world data. 5.2.2.1 SAR ADC ESP32-C6 integrates a Successive Approximation Analog-to-Digital Converter (SAR ADC) to convert analog signals into digital representations. Feature List • 12-bit sampling resolution • Analog voltage sampling from up to seven pins • Attenuation of input signals for voltage conversion • Software-triggered one-time sampling • Timer-triggered multi-channel scanning • DMA continuous conversion for seamless data transfer • Two filters with configurable filter coefficient • Threshold monitoring which helps to trigger an interrupt • Support for Event Task Matrix Espressif Systems 24 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 5 Peripherals Pin Assignment For details, see ESP32-C6 Series Datasheet > Section Peripheral Pin Assignment. 5.2.2.2 Temperature Sensor The Temperature Sensor in the ESP32-C6 chip allows for real-time monitoring of temperature changes inside the chip. Feature List • Measurement range: –40°C ~ 125°C • Software triggering, wherein the data can be read continuously once triggered • Hardware automatic triggering and temperature monitoring • Configurable temperature offset based on the environment to improve the accuracy • Adjustable measurement range • Two automatic monitoring wake-up modes: absolute value mode and incremental value mode • Support for Event Task Matrix Espressif Systems 25 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Stresses above those listed in Table 6-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 6-2 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 6-1. Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST ORE Storage temperature –40 105 °C 6.2 Recommended Operating Conditions Table 6-2. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature 85 °C version –40 — 85 °C 105 °C version 105 6.3 DC Characteristics (3.3 V, 25 °C) Table 6-3. DC Characteristics (3.3 V, 25 °C) Parameter Description Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Internal weak pull-up resistor — 45 — kΩ R P D Internal weak pull-down resistor — 45 — kΩ Espressif Systems 26 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics V IH_nRST Chip reset release voltage CHIP_PU voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage (CHIP_PU voltage is within the specified range) –0.3 — 0.25 × VDD 1 V 1 VDD – voltage from a power pin of a respective power domain. 2 V OH and V OL are measured using high-impedance load. 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 6-4. Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, DSSS @ 20.5 dBm 382 802.11g, 54 Mbps, OFDM @ 19.0 dBm 316 802.11n, HT20, MCS7 @ 18.0 dBm 295 802.11n, HT40, MCS7 @ 17.5 dBm 280 802.11ax, MCS9 @ 15.5 dBm 251 RX 802.11b/g/n, HT20 78 802.11n, HT40 82 802.11ax, HE20 78 Table 6-5. Current Consumption for Bluetooth LE in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX Bluetooth LE @ 19.0 dBm 309 Bluetooth LE @ 9.0 dBm 189 Bluetooth LE @ 0 dBm 131 Bluetooth LE @ –16.0 dBm 94 RX Bluetooth LE 73 Table 6-6. Current Consumption for 802.15.4 in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.15.4 @ 19.0 dBm 305 802.15.4 @ 12.0 dBm 190 802.15.4 @ 0 dBm 120 802.15.4 @ –16.0 dBm 86 Cont’d on next page Espressif Systems 27 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics Table 6-6 – cont’d from previous page Work Mode RF Condition Description Peak (mA) RX 802.15.4 73 Espressif Systems 28 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics Note: The content below is excerpted from Section Current Consumption in Other Modes in ESP32-C6 Series Datasheet. 6.4.2 Current Consumption in Other Modes Table 6-7. Current Consumption in Modem-sleep Mode Typ (mA) Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled All Peripherals Clocks Enabled 1 Modem-sleep 2, 3 160 CPU is running 27 38 CPU is idle 17 28 80 CPU is running 19 30 CPU is idle 14 25 1 In practice, the current consumption might be different depending on which peripherals are en- abled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. Table 6-8. Current Consumption in Low-Power Modes Mode Description Typ (µA) Light-sleep CPU and wireless communication modules are powered down, pe- ripheral clocks are disabled, and all GPIOs are high-impedance 180 CPU, wireless communication modules and peripherals are pow- ered down, and all GPIOs are high-impedance 35 Deep-sleep RTC timer and LP memory are powered on 7 Power off CHIP_PU is set to low level, the chip is powered off 1 6.5 Memory Specifications The data below is sourced from the memory vendor datasheet. These values are guaranteed through design and/or characterization but are not fully tested in production. Devices are shipped with the memory erased. Table 6-9. Flash Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.65 1.80 2.00 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz — Program/erase cycles 100,000 — — cycles T RET Data retention time 20 — — years T P P Page program time — 0.8 5 ms Cont’d on next page Espressif Systems 29 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 6 Electrical Characteristics Table 6-9 – cont’d from previous page Parameter Description Min Typ Max Unit T SE Sector erase time (4 KB) — 70 500 ms T BE1 Block erase time (32 KB) — 0.2 2 s T BE2 Block erase time (64 KB) — 0.3 3 s T CE Chip erase time (16 Mb) — 7 20 s Chip erase time (32 Mb) — 20 60 s Chip erase time (64 Mb) — 25 100 s Chip erase time (128 Mb) — 60 200 s Chip erase time (256 Mb) — 70 300 s Espressif Systems 30 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio Table 7-1. Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n/ax 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics Table 7-2. TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 20.5 — 802.11b, 11 Mbps, CCK — 20.5 — 802.11g, 6 Mbps, OFDM — 19.5 — 802.11g, 54 Mbps, OFDM — 18.5 — 802.11n, HT20, MCS0 — 18.5 — 802.11n, HT20, MCS7 — 17.5 — 802.11n, HT40, MCS0 — 18.0 — 802.11n, HT40, MCS7 — 17.0 — 802.11ax, HE20, MCS0 — 18.5 — 802.11ax, HE20, MCS9 — 14.0 — Table 7-3. TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –25.0 –10.0 802.11b, 11 Mbps, CCK — –25.0 –10.0 Cont’d on next page Espressif Systems 31 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 7-3 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11g, 6 Mbps, OFDM — –24.0 –5.0 802.11g, 54 Mbps, OFDM — –28.0 –25.0 802.11n, HT20, MCS0 — –27.5 –5.0 802.11n, HT20, MCS7 — –30.0 –27.0 802.11n, HT40, MCS0 — –27.0 –5.0 802.11n, HT40, MCS7 — –29.5 –27.0 802.11ax, HE20, MCS0 — –27.0 –5.0 802.11ax, HE20, MCS9 — –34.0 –32.0 1 EVM is measured at the corresponding typical TX power provided in Table 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 7.1.2 Wi-Fi RF Receiver (RX) Characteristics For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n/ax. Table 7-4. RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –99.0 — 802.11b, 2 Mbps, DSSS — –96.0 — 802.11b, 5.5 Mbps, CCK — –93.2 — 802.11b, 11 Mbps, CCK — –89.4 — 802.11g, 6 Mbps, OFDM — –94.0 — 802.11g, 9 Mbps, OFDM — –92.6 — 802.11g, 12 Mbps, OFDM — –92.0 — 802.11g, 18 Mbps, OFDM — –89.4 — 802.11g, 24 Mbps, OFDM — –86.4 — 802.11g, 36 Mbps, OFDM — –82.6 — 802.11g, 48 Mbps, OFDM — –78.0 — 802.11g, 54 Mbps, OFDM — –77.0 — 802.11n, HT20, MCS0 — –93.6 — 802.11n, HT20, MCS1 — –91.8 — 802.11n, HT20, MCS2 — –88.8 — 802.11n, HT20, MCS3 — –85.6 — 802.11n, HT20, MCS4 — –82.8 — 802.11n, HT20, MCS5 — –78.0 — 802.11n, HT20, MCS6 — –76.6 — 802.11n, HT20, MCS7 — –75.0 — 802.11n, HT40, MCS0 — –91.0 — 802.11n, HT40, MCS1 — –88.6 — Cont’d on next page Espressif Systems 32 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 7-4 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11n, HT40, MCS2 — –85.6 — 802.11n, HT40, MCS3 — –82.6 — 802.11n, HT40, MCS4 — –79.0 — 802.11n, HT40, MCS5 — –74.8 — 802.11n, HT40, MCS6 — –73.0 — 802.11n, HT40, MCS7 — –71.8 — 802.11ax, HE20, MCS0 — –93.8 — 802.11ax, HE20, MCS1 — –91.0 — 802.11ax, HE20, MCS2 — –87.4 — 802.11ax, HE20, MCS3 — –85.0 — 802.11ax, HE20, MCS4 — –81.4 — 802.11ax, HE20, MCS5 — –77.0 — 802.11ax, HE20, MCS6 — –76.0 — 802.11ax, HE20, MCS7 — –74.4 — 802.11ax, HE20, MCS8 — –70.4 — 802.11ax, HE20, MCS9 — –68.2 — Table 7-5. Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 5 — 802.11b, 11 Mbps, CCK — 5 — 802.11g, 6 Mbps, OFDM — 5 — 802.11g, 54 Mbps, OFDM — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — 802.11ax, HE20, MCS0 — 5 — 802.11ax, HE20, MCS9 — 0 — Table 7-6. RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 38 — 802.11b, 11 Mbps, CCK — 38 — 802.11g, 6 Mbps, OFDM — 31 — 802.11g, 54 Mbps, OFDM — 20 — Cont’d on next page Espressif Systems 33 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 7-6 – cont’d from previous page Min Typ Max Rate (dB) (dB) (dB) 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 16 — 802.11n, HT40, MCS0 — 28 — 802.11n, HT40, MCS7 — 10 — 802.11ax, HE20, MCS0 — 25 — 802.11ax, HE20, MCS9 — 2 — 7.2 Bluetooth 5 (LE) Radio Table 7-7. Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402 ~ 2480 MHz RF transmit power range –16.0 ~ 19.0 dBm 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 7-8. Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 1.3 — kHz Max. |f 0 − f n | n=2, 3, 4, ...k — 1.5 — kHz Max. | f n − f n−5 | n=6, 7, 8, ...k — 0.9 — kHz |f 1 − f 0 | — 0.6 — kHz Modulation characteristics ∆ F 1 avg — 249.9 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 212.1 — kHz ∆ F 2 avg /∆ F 1 avg — 0.88 — — In-band emissions ± 2 MHz offset — –29 — dBm ± 3 MHz offset — –36 — dBm > ± 3 MHz offset — –39 — dBm Table 7-9. Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 2.2 — kHz Max. |f 0 − f n | n=2, 3, 4, ...k — 1.1 — kHz Max. |f n − f n−5 | n=6, 7, 8, ...k — 1.1 — kHz |f 1 − f 0 | — 0.5 — kHz Modulation characteristics ∆ F 1 avg — 499.4 — kHz Cont’d on next page Espressif Systems 34 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 7-9 – cont’d from previous page Parameter Description Min Typ Max Unit Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 443.5 — kHz ∆ F 2 avg /∆ F 1 avg — 0.95 — — In-band emissions ± 4 MHz offset — –40 — dBm ± 5 MHz offset — –41 — dBm > ± 5 MHz offset — –42 — dBm Table 7-10. Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 0.7 — kHz Max. |f 0 − f n | n=1, 2, 3, ...k — 0.3 — kHz |f 0 − f 3 | — 0.1 — kHz Max. |f n − f n−3 | n=7, 8, 9, ...k — 0.4 — kHz Modulation characteristics ∆ F 1 avg — 250.0 — kHz Min. ∆ F 1 max (for at least 99.9% of all ∆ F 1 max ) — 238.0 — kHz In-band emissions ± 2 MHz offset — –29 — dBm ± 3 MHz offset — –36 — dBm > ± 3 MHz offset — –39 — dBm Table 7-11. Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max. |f n | n=0, 1, 2, 3, ...k — 0.5 — kHz Max. |f 0 − f n | n=1, 2, 3, ...k — 0.3 — kHz |f 0 − f 3 | — 0.1 — kHz Max. |f n − f n−3 | n=7, 8, 9, ...k — 0.4 — kHz Modulation characteristics ∆ F 2 avg — 230.7 — kHz Min. ∆ F 2 max (for at least 99.9% of all ∆ F 2 max ) — 217.6 — kHz In-band emissions ± 2 MHz offset — –28 — dBm ± 3 MHz offset — –36 — dBm > ± 3 MHz offset — –39 — dBm 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics Table 7-12. Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –98.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm Cont’d on next page Espressif Systems 35 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 7-12 – cont’d from previous page Parameter Description Min Typ Max Unit C/I and receiver selectivity performance Co-channel F = F0 MHz — 7 — dB Adjacent channel F = F0 + 1 MHz — 4 — dB F = F0 – 1 MHz — 3 — dB F = F0 + 2 MHz — –21 — dB F = F0 – 2 MHz — –22 — dB F = F0 + 3 MHz — –28 — dB F = F0 – 3 MHz — –36 — dB F ≥ F0 + 4 MHz — –27 — dB F ≤ F0 – 4 MHz — –36 — dB Image frequency — — –26 — dB Adjacent channel to image frequency F = F image + 1 MHz — –29 — dB F = F image – 1 MHz — –28 — dB 30 MHz ~ 2000 MHz — –16 — dBm Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –24 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –1 — dBm Intermodulation — — –27 — dBm Table 7-13. Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –95.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 8 — dB Adjacent channel F = F0 + 2 MHz — 3 — dB F = F0 – 2 MHz — 2 — dB F = F0 + 4 MHz — –23 — dB F = F0 – 4 MHz — –25 — dB F = F0 + 6 MHz — –31 — dB F = F0 – 6 MHz — –35 — dB F ≥ F0 + 8 MHz — –36 — dB F ≤ F0 – 8 MHz — –36 — dB Image frequency — — –23 — dB Adjacent channel to image frequency F = F image + 2 MHz — –30 — dB F = F image – 2 MHz — 3 — dB 30 MHz ~ 2000 MHz — –18 — dBm Out-of-band blocking performance 2003 MHz ~ 2399 MHz — –28 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –1 — dBm Intermodulation — — –29 — dBm Espressif Systems 36 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics Table 7-14. Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –105.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 2 — dB Adjacent channel F = F0 + 1 MHz — –1 — dB F = F0 – 1 MHz — –3 — dB F = F0 + 2 MHz — –31 — dB F = F0 – 2 MHz — –27 — dB F = F0 + 3 MHz — –33 — dB F = F0 – 3 MHz — –42 — dB F ≥ F0 + 4 MHz — –31 — dB F ≤ F0 – 4 MHz — –48 — dB Image frequency — — –31 — dB Adjacent channel to image frequency F = F image + 1 MHz — –36 — dB F = F image – 1 MHz — –33 — dB Table 7-15. Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –101.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 4 — dB Adjacent channel F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — –1 — dB F = F0 + 2 MHz — –23 — dB F = F0 – 2 MHz — –24 — dB F = F0 + 3 MHz — –33 — dB F = F0 – 3 MHz — –41 — dB F ≥ F0 + 4 MHz — –31 — dB F ≤ F0 – 4 MHz — –41 — dB Image frequency — — –30 — dB Adjacent channel to image frequency F = F image + 1 MHz — –35 — dB F = F image – 1 MHz — –27 — dB 7.3 802.15.4 Radio Table 7-16. 802.15.4 RF Characteristics Name Description Center frequency range of operating channel 2405 ~ 2480 MHz 1 Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from channel 11 to channel 26. Espressif Systems 37 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 7 RF Characteristics 7.3.1 802.15.4 RF Transmitter (TX) Characteristics Table 7-17. 802.15.4 Transmitter Characteristics - 250 Kbps Parameter Min Typ Max Unit RF transmit power range –16.0 — 19.0 dBm EVM — 13% — — 7.3.2 802.15.4 RF Receiver (RX) Characteristics Table 7-18. 802.15.4 Receiver Characteristics - 250 Kbps Parameter Description Min Typ Max Unit Sensitivity @1% PER — — –104.0 — dBm Maximum received signal @1% PER — — 8 — dBm Relative jamming level Adjacent channel F = F0 + 5 MHz — 27 — dB F = F0 – 5 MHz — 32 — dB Alternate channel F = F0 + 10 MHz — 47 — dB F = F0 – 10 MHz — 50 — dB Espressif Systems 38 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 8 Module Schematics 8 Module Schematics This is the reference design of the module. GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO8 GPIO9 U0RXD U0TXD GPIO5 GPIO4 GPIO6 GPIO23 GPIO22 GPIO21 GPIO20 GPIO19 GPIO18 GPIO7 GPIO12 GPIO13 GPIO14 GPIO15 CHIP_EN GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO12 GPIO13 GPIO14 GPIO15 LNA_IN U0RXD U0TXD GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPIO23 RF_ANT VDD33 GND GND GND GND GNDGND VDD33 GND GND GND GND VDD33 VDD33 GND GND GND GND VDD33 GND GNDGND GND ESP32-C6-MINI-1(pin-out) The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. NC: No component. L2 TBD C5 10uF C6 0.1uF Y1 40MHz XIN 1 GND 2 XOUT 3 GND 4 C7 0.1uF R1 0 R3 0 R2 499 C4 10nF U3 ESP32-C6-MINI-1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 IO4 9 IO5 10 IO6 15 IO7 16 IO12 17 IO13 18 IO14 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO20 26 IO23 29 IO22 28 IO21 27 NC 21 IO8 22 IO0 12 IO1 13 GND 52 IO15 20 NC 35 IO18 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 IO19 25 D1 ESD C1 TBD C10 0.1uF L1 2.0nH(0.1nH) U2 ESP32-C6-QFN32 VDDA3P3 2 VDDA3P3 3 GPIO3 9 GPIO12 16 MTMS 10 MTDO 13 MTCK 12 MTDI 11 GPIO13 17 VDDPST1 5 GPIO2 8 GPIO8 14 GPIO9 15 XTAL_32K_P 6 XTAL_32K_N 7 CHIP_PU 4 U0RXD 22 U0TXD 21 SDIO_CLK 24 SDIO_DATA0 25 SDIO_DATA1 26 SDIO_DATA2 27 XTAL_N 30 XTAL_P 31 VDDA1 29 ANT 1 GND 33 GPIO15 19 VDDPST2 20 SDIO_CMD 23 SDIO_DATA3 28 VDDA2 32 GPIO14 18 ANT1 PCB_ANT 1 2 C2 TBD C8 TBD C12 0.1uF C9 TBD C3 1uF Figure 8-1. ESP32-C6-MINI-1 Schematics Espressif Systems 39 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 8 Module Schematics GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO8 GPIO9 U0RXD U0TXD GPIO5 GPIO4 GPIO6 GPIO23 GPIO22 GPIO21 GPIO20 GPIO19 GPIO18 GPIO7 GPIO12 GPIO13 GPIO14 GPIO15 CHIP_EN GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO12 GPIO13 GPIO14 GPIO15 LNA_IN U0RXD U0TXD GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPIO23 RF_ANT VDD33 GND GND GND GND GNDGND VDD33 GND GND GND GND VDD33 VDD33 GND GND GND GND VDD33 GND GND GND GND GND ESP32-C6-MINI-1U(pin-out) The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. NC: No component. L2 TBD C5 10uF C6 0.1uF Y1 40MHz XIN 1 GND 2 XOUT 3 GND 4 C7 0.1uF R1 0 R3 0 R2 499 C4 10nF U3 ESP32-C6-MINI-1U GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 IO4 9 IO5 10 IO6 15 IO7 16 IO12 17 IO13 18 IO14 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO20 26 IO23 29 IO22 28 IO21 27 NC 21 IO8 22 IO0 12 IO1 13 GND 52 IO15 20 NC 35 IO18 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 IO19 25 D1 ESD C1 TBD C10 0.1uF L1 2.0nH(0.1nH) C8 TBD U2 ESP32-C6-QFN32 VDDA3P3 2 VDDA3P3 3 GPIO3 9 GPIO12 16 MTMS 10 MTDO 13 MTCK 12 MTDI 11 GPIO13 17 VDDPST1 5 GPIO2 8 GPIO8 14 GPIO9 15 XTAL_32K_P 6 XTAL_32K_N 7 CHIP_PU 4 U0RXD 22 U0TXD 21 SDIO_CLK 24 SDIO_DATA0 25 SDIO_DATA1 26 SDIO_DATA2 27 XTAL_N 30 XTAL_P 31 VDDA1 29 ANT 1 GND 33 GPIO15 19 VDDPST2 20 SDIO_CMD 23 SDIO_DATA3 28 VDDA2 32 GPIO14 18 C9 TBD C2 TBD D2 ESD(NC) C12 0.1uF ANT1 CONN 1 4 2 3 C3 1uF Figure 8-2. ESP32-C6-MINI-1U Schematics Espressif Systems 40 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). IO3 IO2 EN IO4 IO5 IO1 IO0 IO6 IO7 IO12 IO13 TXD0 RXD0 IO19 IO20 IO21 IO22 IO23 IO18 IO15 IO14 IO8 IO9 USB_D+ USB_D- IO8 IO6TCK IO7TDO TMS IO4 IO5TDI GND VDD33 GND GND GND GND GND VDD33 GND GND GND GND VDD33 GNDGND VDD33 X1: ESR = Max. 70 KΩ NC: No component. ESP32-C6-MINI-1U C7 TBD R3 0(NC) R5 NC SW1 C6 12pF(NC) R2 0 R4 0(NC) R6 TBD R7 TBD C1 22uF JP2 Boot Option 1 1 2 2 JP4 JTAG 1 1 2 2 3 3 4 4 JP1 UART 1 1 2 2 3 3 4 4 C8 TBD JP3 USB 1 1 2 2 U1 ESP32-C6-MINI-1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 IO4 9 IO5 10 IO6 15 IO7 16 IO12 17 IO13 18 IO14 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO20 26 IO23 29 IO22 28 IO21 27 NC 21 IO8 22 IO0 12 IO1 13 GND 52 IO15 20 NC 35 IO18 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 IO19 25 C4 0.1uF C5 12pF(NC) C3 TBD R1 TBD X1 32.768KHz(NC) 2 1 R8 10K C2 0.1uF Figure 9-1. Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32-C6 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-C6’s power-up and reset sequence timing diagram, please refer Section 4.5 Chip Power-up and Reset. Espressif Systems 41 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 16.60±0.2 0.8013.20±0.2 Top view Side view Bottom view 2.40±0.15 11.20 0.62 0.62 11.95 9.95 Ø0.50 Unit: mm 9.90 5.40 0.60 1.45 1.45 1.60 11.80 11.90 1.60 0.60 5.40 9.80 4 x 0.70 4 x 0.70 48 x 0.40 48 x 0.80 0.80 Bottom view Figure 10-1. ESP32-C6-MINI-1 Physical Dimensions 12.50±0.2 0.8013.20±0.2 12.25 Unit: mm 1.55 1.70 8.70 0.48 9.18 11.55 2.40±0.15 0.85 0.48 9.90 5.40 0.60 1.45 1.45 1.60 11.80 11.90 1.60 0.60 5.40 9.80 4 x 0.70 4 x 0.70 48 x 0.40 48 x 0.80 0.80 Top view Side view Bottom view 5.60 Figure 10-2. ESP32-C6-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to ESP32-C6 Module Packaging Information. Espressif Systems 42 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP32-C6-MINI-1U uses the third generation external antenna connector as shown in Figure 10-3 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 10-3. Dimensions of External Antenna Connector The external antenna used for ESP32-C6-MINI-1U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance Espressif Systems 43 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 10 Physical Dimensions • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 10-3 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 44 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11-1 ESP32-C6-MINI-1 Recommended PCB Land Pattern and Figure 11-2 ESP32-C6-MINI-1U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11-1 and Figure 11-2. You can view the source files for ESP32-C6-MINI-1 and ESP32-C6-MINI-1U with Autodesk Viewer. • 3D models of ESP32-C6-MINI-1 and ESP32-C6-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). 1.60 Antenna Area Pin 1 11.20 0.60 9.90 5.40 11.90 1.60 13.20 16.60 1.45 5.40 1.450.60 11.80 9.80 Unit: mm : Pad 48 x 0.40 48 x 0.80 4 x 0.70 4 x 0.700.80 Figure 11-1. ESP32-C6-MINI-1 Recommended PCB Land Pattern Espressif Systems 45 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 11 PCB Layout Recommendations 1.60 Pin 1 12.50 0.60 9.90 5.40 11.90 1.60 13.20 1.45 5.40 1.450.60 11.80 9.80 Unit: mm : Pad 48 x 0.40 48 x 0.80 4 x 0.70 4 x 0.700.80 5.60 Figure 11-2. ESP32-C6-MINI-1U Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32-C6 Hardware Design Guidelines > Section Positioning a Module on a Base Board. Espressif Systems 46 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 12-1. Reflow Profile Espressif Systems 47 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 48 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 49 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32-C6 Series Datasheet – Specifications of the ESP32-C6 hardware. • ESP32-C6 Technical Reference Manual – Detailed information on how to use the ESP32-C6 memory and peripherals. • ESP32-C6 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C6 into your hardware product. • ESP32-C6 Series SoC Errata – Descriptions of known errors in ESP32-C6 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-C6 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-C6 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-C6 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • ESP-FAQ – A summary document of frequently asked questions released by Espressif. https://espressif.com/projects/esp-faq/en/latest/index.html • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-C6 Series SoCs – Browse through all ESP32-C6 SoCs. https://espressif.com/en/products/socs?id=ESP32-C6 • ESP32-C6 Series Modules – Browse through all ESP32-C6-based modules. https://espressif.com/en/products/modules?id=ESP32-C6 • ESP32-C6 Series DevKits – Browse through all ESP32-C6-based devkits. https://espressif.com/en/products/devkits?id=ESP32-C6 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 50 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Revision History Revision History Date Version Release notes 2025-07-16 v1.4 • In Chapter 2 Block Diagram, added a note about pin mapping between the chip and the in-package flash • In Chapter 10.2 Dimensions of External Antenna Connector, added the ex- ternal antenna information for certification • Added Sections 4.5 Chip Power-up and Reset, 6.5 Memory Specifications and Datasheet Versioning 2025-03-21 v1.3 • In Chapter 1 Module Overview, renamed Section 1.2 Description to 1.2 Se- ries Comparison • Improved the structure, formatting, and wording in: – Chapter 4 Boot Configurations (used to be Section 3.3 Strapping Pins) – Chapter 5 Peripherals (used to be Chapter 4 Peripherals) – Chapter 10 Physical Dimensions and Chapter 11 PCB Layout Recom- mendations (used to be Chapter 9 Physical Dimensions and PCB Land Pattern) • In Section 7.1 Wi-Fi Radio, updated data in Table 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards and Table 7-4 RX Sensitivity • Added Section 11.2 Module Placement for PCB Design 2024-08-20 v1.2 • In Section 1.1 Features and 1.2 Series Comparison, updated flash size from 4 MB to up to 8 MB flash • In Section 1.2 Series Comparison, added information about ESP32-C6- MINI-1-H8 and ESP32-C6-MINI-1U-H8, and added a table note about the maximum clock frequency supported by SPI flash • In Section 1.1 Features, 1.2 Series Comparison, and 5.1 Peripheral Overview, added information about ESP32-C6FH8 2024-01-19 v1.1 • In Section 1.1 Features, added information about certification and test • In Section 6.4.1 Current Consumption in Active Mode, updated the minimum RF transmit power for Bluetooth LE and 802.15.4 in active mode from -24 dBm to -16 dBm, and updated the maximum power from 20 dBm to 19 dBm • In Chapter 7 RF Characteristics, updated the RF transmit power range for Bluetooth LE and 802.15.4 from -24 ~ 20 dBm to -16 ~ 19 dBm • In Section 11 PCB Layout Recommendations, added information about the recommended PCB land pattern of ESP32-C6-MINI-1U module, and 3D models of ESP32-C6-MINI-1 and ESP32-C6-MINI-1U modules Cont’d on next page Espressif Systems 51 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Revision History Cont’d from previous page Date Version Release notes 2023-06-27 v1.0 • Added Chapter 5 Peripherals and removed peripheral-related information from 1.2 Series Comparison • Updated Table 10-1 ESP32-C6-MINI-1 Physical Dimensions and Table 10-2 ESP32-C6-MINI-1U Physical Dimensions to change the tolerance in the top view from 0.25 to 0.2 2023-04-17 v0.6 Added information about ESP32-C6-MINI-1U module 2023-02-16 v0.5 Preliminary release Espressif Systems 52 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.4 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com