1 Module Overview 1.1 Features 1.2 Series Comparison 1.3 Applications 2 Block Diagram 3 Pin Definitions 3.1 Pin Layout 3.2 Pin Description 4 Boot Configurations 4.1 Chip Boot Mode Control 4.2 ROM Messages Printing Control 4.3 Chip Power-up and Reset 5 Peripherals 5.1 Peripheral Overview 5.2 Peripheral Description 5.2.1 Connectivity Interface 5.2.1.1 UART Controller 5.2.1.2 SPI Controller 5.2.1.3 I2C Controller 5.2.1.4 I2S Controller 5.2.1.5 USB Serial/JTAG Controller 5.2.1.6 Two-wire Automotive Interface 5.2.1.7 LED PWM Controller 5.2.1.8 Remote Control Peripheral 5.2.2 Analog Signal Processing 5.2.2.1 SAR ADC 5.2.2.2 Temperature Sensor 6 Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 DC Characteristics (3.3 V, 25 °C) 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode 6.4.2 Current Consumption in Other Modes 6.5 Memory Specifications 7 RF Characteristics 7.1 Wi-Fi Radio 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 7.2 Bluetooth 5 (LE) Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 8 Module Schematics 9 Peripheral Schematics 10 Physical Dimensions 10.1 Module Dimensions 10.2 Dimensions of External Antenna Connector 11 PCB Layout Recommendations 11.1 PCB Land Pattern 11.2 Module Placement for PCB Design 12 Product Handling 12.1 Storage Conditions 12.2 Electrostatic Discharge (ESD) 12.3 Reflow Profile 12.4 Ultrasonic Vibration Datasheet Versioning Related Documentation and Resources Revision History ESP32-C3-MINI-1 ESP32-C3-MINI-1U Datasheet Version 2.1 Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth ® 5 module Built around ESP32-C3 series of SoCs, RISC-V single-core microprocessor 4 MB flash in chip package 15 GPIOs On-board PCB antenna or external antenna connector ESP32-C3-MINI-1 ESP32-C3-MINI-1U www.espressif.com 1 Module Overview 1 Module Overview Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-c3-mini-1_datasheet_en.pdf 1.1 Features CPU and On-Chip Memory • ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz • 384 KB ROM • 400 KB SRAM (16 KB for cache) • 8 KB SRAM in RTC • 4 MB flash in chip package Wi-Fi • IEEE 802.11 b/g/n-compliant • Center frequency range of operating channel: 2412 ~ 2484 MHz • Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz band • 1T1R mode with data rate up to 150 Mbps • Wi-Fi Multimedia (WMM) • TX/RX A-MPDU, TX/RX A-MSDU • Immediate Block ACK • Fragmentation and defragmentation • Transmit opportunity (TXOP) • Automatic Beacon monitoring (hardware TSF) • 4 × virtual Wi-Fi interfaces • Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when the chip scans in Station mode, the SoftAP channel will change along with the Station channel • 802.11mc FTM Bluetooth ® • Bluetooth LE: Bluetooth 5, Bluetooth mesh • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps • Advertising extensions • Multiple advertisement sets • Channel selection algorithm #2 • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals • Up to 15 GPIOs – 3 strapping GPIOs • SPI, UART, I2C, I2S, remote control peripheral, LED PWM controller, general DMA controller, TWAI ® controller (compatible with ISO 11898-1, i.e. CAN Specification 2.0), USB Serial/JTAG controller, temperature sensor, SAR ADC, general-purpose timers, watchdog timers Note: * Please refer to ESP32-C3 Series Datasheet for detailed information about the module peripherals. Integrated Components on Module • 40 MHz crystal oscillator Antenna Options • ESP32-C3-MINI-1: On-board PCB antenna Espressif Systems 2 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 1 Module Overview • ESP32-C3-MINI-1U: External antenna via a connector Operating Conditions • Operating voltage/Power supply: 3.0 ~ 3.6 V • Operating ambient temperature: – 85 °C version module: –40 ~ 85 °C – 105 °C version module: –40 ~ 105 °C Certification • RF certification: See certificates • Green certification: RoHS/REACH Test • HTOL/HTSL/uHAST/TCT/ESD/Latch-up 1.2 Series Comparison ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. ESP32-C3-MINI-1 comes with a PCB antenna. ESP32-C3-MINI-1U comes with an external antenna connector. A wide selection of module variants are available as shown in Table 1-1 and 1-2. The series comparison for the two modules is as follows: Table 1-1. ESP32-C3-MINI-1 (ANT) Series Comparison 1 Ambient Temp. 2 Embedded Size 3 Ordering Code 5 Flash 4 (°C) Chip Revision 6 (mm) ESP32-C3-MINI-1-N4X (Recommended) 4 MB (Quad SPI) –40 ∼ 85 v1.1 13.2 × 16.6 × 2.4 ESP32-C3-MINI-1-H4X (Recommended) –40 ∼ 105 v1.1 ESP32-C3-MINI-1-N4 (NRND) –40 ∼ 85 v0.4 ESP32-C3-MINI-1-H4 (NRND) –40 ∼ 105 v0.4 ESP32-C3-MINI-1-H4-AZ (NRND) –40 ∼ 105 v0.4 1 This table shares the same notes presented in Table 1-2 below. Espressif Systems 3 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 1 Module Overview Table 1-2. ESP32-C3-MINI-1U (CONN) Series Comparison Ambient Temp. 2 Embedded Size 3 Ordering Code 5 Flash 4, 7 (°C) Chip Revision 6 (mm) ESP32-C3-MINI-1U-N4X (Recommended) 4 MB (Quad SPI) –40 ∼ 85 v1.1 13.2 × 12.5 × 2.4ESP32-C3-MINI-1U-H4X (Recommended) –40 ∼ 105 v1.1 ESP32-C3-MINI-1U-N4 (NRND) –40 ∼ 85 v0.4 ESP32-C3-MINI-1U-H4 (NRND) –40 ∼ 105 v0.4 2 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espres- sif module. 3 For details, refer to Section 10.1 Module Dimensions. 4 The flash is integrated in the chip’s package. For specifications, refer to Section 6.5 Memory Specifications. 5 All modules can be pre-programmed with AWS IoT ExpressLink firmware. Modules with such firmware have suffix ”-A” in their ordering codes, e.g. ESP32-C3-MINI-1-N4-A. Since AWS IoT ExpressLink firmware enables flash encryption and secure boot, joint download boot mode will be disabled, and it will no longer be possible to program firmware through the UART or USB port into the modules. 6 All chip revisions have the same SRAM size, but chip revision v1.1 has around 10 KB more available space for users than chip revision v0.4. Chip revision v1.1 depends on specific ESP-IDF versions, as detailed in Compatibility Advisory for ESP32-C3 Chip Revision v1.1. For how to identify chip revisions, please refer to ESP32-C3 Series SoC Errata. 7 By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does not support the auto suspend feature. If you have a requirement for a higher flash clock frequency of 120 MHz or if you need the flash auto suspend feature, please contact us. Both ESP32-C3-MINI-1 and ESP32-C3-MINI-1U has two operating ambient temperature options: –40 ∼ 85 °C variants and –40 ∼ 105 °C variants, all embedded with the ESP32-C3FH4 chip. ESP32-C3-MINI-1 has one more variant: ESP32-C3-MINI-1-H4-AZ embedded with the ESP32-C3FH4AZ chip. For this chip, SPI0/SPI1 pins for flash connection are not bonded. For more information about the differences between chips embedded, please refer to Section Chip Series Comparison in ESP32-C3 Series Datasheet. 1.3 Applications • Smart Home • Industrial Automation • Health Care • Consumer Electronics • Smart Agriculture • POS Machines • Service Robot • Audio Devices • Generic Low-power IoT Sensor Hubs • Generic Low-power IoT Data Loggers Espressif Systems 4 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Contents Contents 1 Module Overview 2 1.1 Features 2 1.2 Series Comparison 3 1.3 Applications 4 2 Block Diagram 9 3 Pin Definitions 10 3.1 Pin Layout 10 3.2 Pin Description 10 4 Boot Configurations 12 4.1 Chip Boot Mode Control 13 4.2 ROM Messages Printing Control 14 4.3 Chip Power-up and Reset 14 5 Peripherals 16 5.1 Peripheral Overview 16 5.2 Peripheral Description 16 5.2.1 Connectivity Interface 16 5.2.1.1 UART Controller 16 5.2.1.2 SPI Controller 16 5.2.1.3 I2C Controller 17 5.2.1.4 I2S Controller 18 5.2.1.5 USB Serial/JTAG Controller 18 5.2.1.6 Two-wire Automotive Interface 19 5.2.1.7 LED PWM Controller 19 5.2.1.8 Remote Control Peripheral 20 5.2.2 Analog Signal Processing 20 5.2.2.1 SAR ADC 20 5.2.2.2 Temperature Sensor 20 6 Electrical Characteristics 22 6.1 Absolute Maximum Ratings 22 6.2 Recommended Operating Conditions 22 6.3 DC Characteristics (3.3 V, 25 °C) 22 6.4 Current Consumption Characteristics 23 6.4.1 Current Consumption in Active Mode 23 6.4.2 Current Consumption in Other Modes 24 6.5 Memory Specifications 24 7 RF Characteristics 26 7.1 Wi-Fi Radio 26 Espressif Systems 5 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Contents 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics 26 7.1.2 Wi-Fi RF Receiver (RX) Characteristics 27 7.2 Bluetooth 5 (LE) Radio 28 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics 28 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics 30 8 Module Schematics 33 9 Peripheral Schematics 35 10 Physical Dimensions 36 10.1 Module Dimensions 36 10.2 Dimensions of External Antenna Connector 37 11 PCB Layout Recommendations 39 11.1 PCB Land Pattern 39 11.2 Module Placement for PCB Design 40 12 Product Handling 41 12.1 Storage Conditions 41 12.2 Electrostatic Discharge (ESD) 41 12.3 Reflow Profile 41 12.4 Ultrasonic Vibration 42 Datasheet Versioning 43 Related Documentation and Resources 44 Revision History 45 Espressif Systems 6 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 List of Tables List of Tables 1-1 ESP32-C3-MINI-1 (ANT) Series Comparison 1 3 1-2 ESP32-C3-MINI-1U (CONN) Series Comparison 4 3-1 Pin Definitions 11 4-1 Default Configuration of Strapping Pins 12 4-2 Description of Timing Parameters for the Strapping Pins 13 4-3 Chip Boot Mode Control 13 4-4 UART0 ROM Message Printing Control 14 4-5 USB Serial/JTAG ROM Message Printing Control 14 4-6 Description of Timing Parameters for Power-up and Reset 15 6-1 Absolute Maximum Ratings 22 6-2 Recommended Operating Conditions 22 6-3 DC Characteristics (3.3 V, 25 °C) 22 6-4 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 23 6-5 Current Consumption for Bluetooth LE in Active Mode 23 6-6 Current Consumption in Modem-sleep Mode 24 6-7 Current Consumption in Low-Power Modes 24 6-8 Flash Specifications 24 7-1 Wi-Fi RF Characteristics 26 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 26 7-3 TX EVM Test 1 26 7-4 RX Sensitivity 27 7-5 Maximum RX Level 28 7-6 RX Adjacent Channel Rejection 28 7-7 Bluetooth LE RF Characteristics 28 7-8 Bluetooth LE - Transmitter Characteristics - 1 Mbps 29 7-9 Bluetooth LE - Transmitter Characteristics - 2 Mbps 29 7-10 Bluetooth LE - Transmitter Characteristics - 125 Kbps 29 7-11 Bluetooth LE - Transmitter Characteristics - 500 Kbps 30 7-12 Bluetooth LE - Receiver Characteristics - 1 Mbps 30 7-13 Bluetooth LE - Receiver Characteristics - 2 Mbps 31 7-14 Bluetooth LE - Receiver Characteristics - 125 Kbps 31 7-15 Bluetooth LE - Receiver Characteristics - 500 Kbps 31 Espressif Systems 7 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 List of Figures List of Figures 2-1 ESP32-C3-MINI-1 Block Diagram 9 2-2 ESP32-C3-MINI-1U Block Diagram 9 3-1 Pin Layout (Top View) 10 4-1 Visualization of Timing Parameters for the Strapping Pins 13 4-2 Visualization of Timing Parameters for Power-up and Reset 15 8-1 ESP32-C3-MINI-1 Schematics 33 8-2 ESP32-C3-MINI-1U Schematics 34 9-1 Peripheral Schematics 35 10-1 ESP32-C3-MINI-1 Physical Dimensions 36 10-2 ESP32-C3-MINI-1U Physical Dimensions 36 10-3 Dimensions of External Antenna Connector 37 11-1 ESP32-C3-MINI-1 Recommended PCB Land Pattern 39 11-2 ESP32-C3-MINI-1U Recommended PCB Land Pattern 40 12-1 Reflow Profile 41 Espressif Systems 8 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 2 Block Diagram 2 Block Diagram SPI Flash RF Matching 40 MHz Crystal 3V3 ESP32-C3-MINI-1 EN GPIOs Antenna ESP32-C3FH4 SPI Flash 40 MHz Crystal 3V3 ESP32-C3-MINI-1U EN GPIOs ESP32-C3FH4 RF Matching Antenna Figure 2-1. ESP32-C3-MINI-1 Block Diagram SPI Flash RF Matching 40 MHz Crystal 3V3 ESP32-C3-MINI-1 EN GPIOs Antenna ESP32-C3FH4 SPI Flash 40 MHz Crystal 3V3 ESP32-C3-MINI-1U EN GPIOs ESP32-C3FH4 RF Matching Antenna Figure 2-2. ESP32-C3-MINI-1U Block Diagram Note: For the pin mapping between the chip and the in-package flash, please refer to ESP32-C3 Series Datasheet > Table Pin Mapping Between Chip and In-package Flash. Espressif Systems 9 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure 10.1 Module Dimensions. Pin 49 GND GND GND GND GNDGND GND GND GND Pin 1 Pin 2 Pin 3 Pin 4 Pin 6 Pin 5 Pin 7 Pin 8 Pin 9 Pin 10 Pin 11 Pin 53 GND Pin 52 GND Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 Pin 21 Pin 22 Pin 23 Pin 24 Pin 25 Pin 51 GND Pin 26 Pin 27 Pin 28 Pin 29 Pin 30 Pin 31 Pin 32 Pin 33 Pin 34 Pin 35 Pin 50 GND Pin 36 Pin 37 Pin 38 Pin 39 Pin 40 Pin 41 Pin 42 Pin 43 Pin 44 Pin 45 Pin 46 Pin 47 Pin 48 GND GND 3V3 NC IO2 IO3 NC EN NC NC GND IO0 IO1 GND NC IO10 NC IO4 IO5 IO6 IO7 IO8 IO9 NC NC IO18 IO19 NC NC RXD0 TXD0 NC NC NC NC GND GND GND GND GND GND GND GND GND GND GND GND GND Keepout Zone A Figure 3-1. Pin Layout (Top View) Note A: The zone marked with dotted lines is the antenna keepout zone. The pin diagram is applicable to ESP32-C3-MINI-1 and ESP32-C3-MINI-1U, but the latter has no antenna keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP32-C3 Hardware Design Guidelines > Section General Principles of PCB Layout for Modules. 3.2 Pin Description The module has 53 pins. See pin definitions in Table 3-1 Pin Definitions. For peripheral pin configurations, please refer to Section 5.2 Peripheral Description. Espressif Systems 10 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 3 Pin Definitions Table 3-1. Pin Definitions Name No. Type 1 Function GND 1, 2, 11, 14, 36-53 P Ground 3V3 3 P Power supply NC 4, 7, 9, 10, 15, 17, 24, 25, 28, 29, 32-35 — NC IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, ADC1_CH3 EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO0 12 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P IO1 13 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N IO10 16 I/O/T GPIO10, FSPICS0 IO4 18 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS IO5 19 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI IO6 20 I/O/T GPIO6, FSPICLK, MTCK IO7 21 I/O/T GPIO7, FSPID, MTDO IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO18 26 I/O/T GPIO18, USB_D- IO19 27 I/O/T GPIO19, USB_D+ RXD0 30 I/O/T GPIO20, U0RXD TXD0 31 I/O/T GPIO21, U0TXD 1 P: power supply; I: input; O: output; T: high impedance. Espressif Systems 11 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 4 Boot Configurations 4 Boot Configurations Note: The content below is excerpted from ESP32-C3 Series Datasheet > Section Boot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter 8 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse parameters at power-up or a hardware reset, without microcontroller interaction. • Chip boot mode – Strapping pins: GPIO2, GPIO8, and GPIO9 • ROM message printing – Strapping pin: GPIO8 – eFuse parameters: EFUSE_UART_PRINT_CONTROL and EFUSE_USB_PRINT_CHANNEL The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to program eFuse bits, please refer to ESP32-C3 Technical Reference Manual > Chapter eFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4-1. Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO2 Floating – GPIO8 Floating – GPIO9 Weak pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-C3 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At Chip Reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. For details on Chip Reset, see ESP32-C3 Technical Reference Manual > Chapter Reset and Clock. The timing of signals connected to the strapping pins should adhere to the setup time and hold time specifications in Table 4-2 and Figure 4-1. Espressif Systems 12 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 4 Boot Configurations Table 4-2. Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) t SU Setup time is the time reserved for the power rails to stabilize before the CHIP_EN pin is pulled high to activate the chip. 0 t H Hold time is the time reserved for the chip to read the strapping pin values after CHIP_EN is already high and before these pins start operating as regular IO pins. 3 Strapping pin VIL_nRST VIH t SU t H CHIP_EN Figure 4-1. Visualization of Timing Parameters for the Strapping Pins 4.1 Chip Boot Mode Control GPIO2, GPIO8, and GPIO9 control the boot mode after the reset is released. See Table 4-3 Chip Boot Mode Control. Table 4-3. Chip Boot Mode Control Boot Mode GPIO2 2 GPIO8 GPIO9 SPI boot mode 1 Any value 1 Joint download boot mode 3 1 1 0 1 Bold marks the default value and configuration. 2 GPIO2 actually does not determine SPI Boot and Joint Down- load Boot mode, but it is recommended to pull this pin up due to glitches. 3 Joint Download Boot mode supports the following download methods: • USB-Serial-JTAG Download Boot • UART Download Boot In SPI Boot mode, the ROM bootloader loads and executes the program from SPI flash to boot the system. Espressif Systems 13 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 4 Boot Configurations In Joint Download Boot mode, users can download binary files into flash using UART0 or USB interface. It is also possible to download binary files into SRAM and execute it from SRAM. In addition to SPI Boot and Joint Download Boot modes, ESP32-C3 also supports SPI Download Boot mode. For details, please see ESP32-C3 Technical Reference Manual > Chapter Chip Boot Control. 4.2 ROM Messages Printing Control During the boot process, the messages by the ROM code can be printed to: • (Default) UART0 and USB Serial/JTAG controller • UART0 • USB Serial/JTAG controller EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing to UART0 as shown in Table 4-4 UART0 ROM Message Printing Control. Table 4-4. UART0 ROM Message Printing Control UART0 ROM Code Printing EFUSE_UART_PRINT_CONTROL GPIO8 Enabled 0 Ignored 1 0 2 1 Disabled 1 1 2 0 3 Ignored 1 Bold marks the default value and configuration. EFUSE_USB_PRINT_CHANNEL controls the printing to USB Serial/JTAG controller as shown in Table 4-5 USB Serial/JTAG ROM Message Printing Control. Table 4-5. USB Serial/JTAG ROM Message Printing Control USB Serial/JTAG ROM Code Printing EFUSE_DIS_USB_SERIAL_JTAG 2 EFUSE_USB_PRINT_CHANNEL Enabled 0 0 Disabled 0 1 1 Ignored 1 Bold marks the default value and configuration. 2 EFUSE_DIS_USB_SERIAL_JTAG controls whether to disable USB Serial/JTAG. 4.3 Chip Power-up and Reset Once the power is supplied to the chip, its power rails need a short time to stabilize. After that, CHIP_EN – the pin used for power-up and reset – is pulled high to activate the chip. For information on CHIP_EN as well as power-up and reset timing, see Figure 4-2 and Table 4-6. Espressif Systems 14 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 4 Boot Configurations V IL_nRST t ST BL t RST 2.8 V VDDA, VDD3P3, VDD3P3_RTC, VDD3P3_CPU CHIP_EN Figure 4-2. Visualization of Timing Parameters for Power-up and Reset Table 4-6. Description of Timing Parameters for Power-up and Reset Parameter Description Min (µs) t ST BL Time reserved for the power rails of VDDA, VDD3P3, VDD3P3_RTC, and VDD3P3_CPU to stabilize before the CHIP_EN pin is pulled high to activate the chip 50 t RST Time reserved for CHIP_EN to stay below V IL_nRST to reset the chip (see Table 6-3) 50 Espressif Systems 15 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 5 Peripherals 5 Peripherals 5.1 Peripheral Overview ESP32-C3FH4 integrates a rich set of peripherals including SPI, UART, I2C, I2S, remote control peripheral, LED PWM controller, TWAI ® controller, USB Serial/JTAG controller, temperature sensor, SAR ADC To learn more about on-chip components, please refer to ESP32-C3 Series Datasheet > Section Functional Description. Note: The content below is sourced from ESP32-C3 Series Datasheet > Section Peripherals. Some information may not be applicable to ESP32-C3-MINI-1 and ESP32-C3-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer to ESP32-C3 Technical Reference Manual > Section Peripheral Signal List. 5.2 Peripheral Description This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality. 5.2.1 Connectivity Interface This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks. 5.2.1.1 UART Controller ESP32-C3 has two UART interfaces, i.e. UART0 and UART1, which support IrDA and asynchronous communication (RS232 and RS485) at a speed of up to 5 Mbps. The UART controller provides hardware flow control (CTS and RTS signals) and software flow control (XON and XOFF). Both UART interfaces connect to GDMA via UHCI0, and can be accessed by the GDMA controller or directly by the CPU. For details, see ESP32-C3 Technical Reference Manual > Chapter UART Controller (UART, LP_UART). Pin Assignment The pins connected to transmit and receive signals (U0TXD and U0RXD) for UART0 are multiplexed with GPIO21 ~ GPIO20 via IO MUX. Other signals can be routed to any GPIOs via the GPIO matrix. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.2 SPI Controller ESP32-C3 has the following SPI interfaces: • SPI0 used by ESP32-C3’s GDMA controller and cache to access in-package or off-package flash • SPI1 used by the CPU to access in-package or off-package flash Espressif Systems 16 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 5 Peripherals • SPI2 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller Features of SPI0 and SPI1 • Supports Single SPI, Dual SPI, and Quad SPI, QPI modes • Configurable clock frequency with a maximum of 120 MHz in Single Transfer Rate (STR) mode • Data transmission is in bytes Features of SPI2 • Supports operation as a master or slave • Connects to a DMA channel allocated by the GDMA controller • Supports Single SPI, Dual SPI, and Quad SPI, QPI • Configurable clock polarity (CPOL) and phase (CPHA) • Configurable clock frequency • Data transmission is in bytes • Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first • As a master – Supports 2-line full-duplex communication with clock frequency up to 80 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz – Provides six SPI_CS pins for connection with six independent SPI slaves – Configurable CS setup time and hold time • As a slave – Supports 2-line full-duplex communication with clock frequency up to 60 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz For details, see ESP32-C3 Technical Reference Manual > Chapter SPI Controller (SPI). Pin Assignment For SPI0/1, the pins are multiplexed with GPIO12 ~ GPIO17 via the IO MUX. For SPI2, the pins are multiplexed with GPIO2, GPIO4 ~ GPIO7, GPIO10, and JTAG interface via the IO MUX. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.3 I2C Controller ESP32-C3 has an I2C bus interface which is used for I2C master mode or slave mode, depending on your configuration. The I2C interface supports: • standard mode (100 Kbit/s) Espressif Systems 17 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 5 Peripherals • fast mode (400 Kbit/s) • up to 800 Kbit/s (constrained by SCL and SDA pull-up strength) • 7-bit and 10-bit addressing mode • double addressing mode • 7-bit broadcast address For details, see ESP32-C3 Technical Reference Manual > Chapter I2C Controller (I2C). Pin Assignment The pins for I2C can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.4 I2S Controller ESP32-C3 includes a standard I2S interface. This interface can operate as a master or a slave in full-duplex mode or half-duplex mode, and can be configured for 8-bit, 16-bit, 24-bit, or 32-bit serial communication. BCK clock frequency, from 10 kHz up to 40 MHz, is supported. The I2S interface connects to the GDMA controller. The interface supports TDM PCM, TDM MSB alignment, TDM standard, and PDM standard. For details, see ESP32-C3 Technical Reference Manual > Chapter I2S Controller (I2S). Pin Assignment The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.5 USB Serial/JTAG Controller ESP32-C3 integrates a USB Serial/JTAG controller. This controller has the following features: • CDC-ACM virtual serial port and JTAG adapter functionality • USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not support the faster 480 Mbit/s high-speed transfer mode) • programming in-package/off-package flash • CPU debugging with compact JTAG instructions • a full-speed USB PHY integrated in the chip For details, see ESP32-C3 Technical Reference Manual > Chapter USB Serial/JTAG Controller (USB_SERIAL_JTAG). Espressif Systems 18 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 5 Peripherals Pin Assignment The pins for the USB Serial/JTAG Controller are multiplexed with GPIO18 ~ GPIO19. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.6 Two-wire Automotive Interface ESP32-C3 has a TWAI ® controller with the following features: • compatible with ISO 11898-1 protocol (CAN Specification 2.0) • standard frame format (11-bit ID) and extended frame format (29-bit ID) • bit rates from 1 Kbit/s to 1 Mbit/s • multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required) • 64-byte receive FIFO • acceptance filter (single and dual filter modes) • error detection and handling: error counters, configurable error interrupt threshold, error code capture, arbitration lost capture For details, see ESP32-C3 Technical Reference Manual > Chapter Two-wire Automotive Interface. Pin Assignment The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.1.7 LED PWM Controller The LED PWM controller can generate independent digital waveform on six channels. The LED PWM controller: • Can generate digital waveform with configurable periods and duty cycle. The resolution of duty cycle can be up to 14 bits. • Has multiple clock sources, including APB clock and external main crystal clock. • Can operate when the CPU is in Light-sleep mode. • Supports gradual increase or decrease of duty cycle, which is useful for the LED RGB color-gradient generator. For details, see ESP32-C3 Technical Reference Manual > Chapter LED PWM Controller. Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. Espressif Systems 19 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 5 Peripherals 5.2.1.8 Remote Control Peripheral The Remote Control Peripheral (RMT) supports two channels of infrared remote transmission and two channels of infrared remote reception. By controlling pulse waveform through software, it supports various infrared and other single wire protocols. All four channels share a 192 × 32-bit memory block to store transmit or receive waveform. For more details, see ESP32-C3 Technical Reference Manual > Chapter Remote Control Peripheral (RMT). Pin Assignment The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2 Analog Signal Processing This subsection describes components on the chip that sense and process real-world data. 5.2.2.1 SAR ADC ESP32-C3 integrates two 12-bit SAR ADCs. • ADC1 supports measurements on 5 channels, and is factory-calibrated. • ADC2 supports measurements on 1 channel, and is not factory-calibrated. Note: ADC2 of some chip revisions is not operable. For details, please refer to ESP32-C3 Series SoC Errata. For more details, see ESP32-C3 Technical Reference Manual > Chapter On-Chip Sensors and Analog Signal Processing. Pin Assignment The pins for the SAR ADC are multiplexed with GPIO0 ~ GPIO5, JTAG interface, SPI2 interface, and pins for external crystal or oscillator. For more information about the pin assignment, see ESP32-C3 Series Datasheet > Section IO Pins and ESP32-C3 Technical Reference Manual > Chapter IO MUX and GPIO Matrix. 5.2.2.2 Temperature Sensor The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted via an ADC into a digital value. The temperature sensor has a range of –40 °C to 125 °C. It is designed primarily to sense the temperature changes inside the chip. The temperature value depends on factors like microcontroller clock frequency or I/O load. Generally, the chip’s internal temperature is higher than the operating ambient temperature. Espressif Systems 20 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 5 Peripherals For more details, see ESP32-C3 Technical Reference Manual > Chapter On-Chip Sensors and Analog Signal Processing. Espressif Systems 21 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 6 Electrical Characteristics 6 Electrical Characteristics 6.1 Absolute Maximum Ratings Stresses above those listed in Table 6-1 Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table 6-2 Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 6-1. Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V T ST ORE Storage temperature –40 105 °C 6.2 Recommended Operating Conditions Table 6-2. Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V I V DD Current delivered by external power supply 0.5 — — A T A Operating ambient temperature 85 °C version –40 — 85 °C 105 °C version 105 6.3 DC Characteristics (3.3 V, 25 °C) Table 6-3. DC Characteristics (3.3 V, 25 °C) Parameter Description Min Typ Max Unit C IN Pin capacitance — 2 — pF V IH High-level input voltage 0.75 × VDD 1 — VDD 1 + 0.3 V V IL Low-level input voltage –0.3 — 0.25 × VDD 1 V I IH High-level input current — — 50 nA I IL Low-level input current — — 50 nA V OH 2 High-level output voltage 0.8 × VDD 1 — — V V OL 2 Low-level output voltage — — 0.1 × VDD 1 V I OH High-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA I OL Low-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3) — 28 — mA R P U Internal weak pull-up resistor — 45 — kΩ R P D Internal weak pull-down resistor — 45 — kΩ Espressif Systems 22 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 6 Electrical Characteristics V IH_nRST Chip reset release voltage CHIP_EN voltage is within the specified range) 0.75 × VDD 1 — VDD 1 + 0.3 V V IL_nRST Chip reset voltage (CHIP_EN voltage is within the specified range) –0.3 — 0.25 × VDD 1 V 1 VDD – voltage from a power pin of a respective power domain. 2 V OH and V OL are measured using high-impedance load. 6.4 Current Consumption Characteristics 6.4.1 Current Consumption in Active Mode The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 6-4. Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work mode Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, @20.5 dBm 350 802.11g, 54 Mbps, @18 dBm 295 802.11n, HT20, MCS7, @17.5 dBm 290 802.11n, HT40, MCS7, @17 dBm 290 RX 802.11b/g/n, HT20 82 802.11n, HT40 84 Table 6-5. Current Consumption for Bluetooth LE in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX Bluetooth LE @ 20.0 dBm 340 Bluetooth LE @ 9.0 dBm 190 Bluetooth LE @ 0 dBm 170 Bluetooth LE @ –15.0 dBm 100 RX Bluetooth LE 86 Espressif Systems 23 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 6 Electrical Characteristics Note: The content below is excerpted from Section Power Consumption in Other Modes in ESP32-C3 Series Datasheet. 6.4.2 Current Consumption in Other Modes Table 6-6. Current Consumption in Modem-sleep Mode Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA) 1 Modem-sleep 2,3 160 CPU is running 23 28 CPU is idle 16 21 80 CPU is running 17 22 CPU is idle 13 18 1 In practice, the current consumption might be different depending on which peripherals are enabled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 6-7. Current Consumption in Low-Power Modes Mode Description Typ (µA) Light-sleep VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance 130 Deep-sleep RTC timer + RTC memory 5 Power off CHIP_EN is set to low level, the chip is powered off 1 6.5 Memory Specifications The data below is sourced from the memory vendor datasheet. These values are guaranteed through design and/or characterization but are not fully tested in production. Devices are shipped with the memory erased. Table 6-8. Flash Specifications Parameter Description Min Typ Max Unit VCC Power supply voltage (1.8 V) 1.65 1.80 2.00 V Power supply voltage (3.3 V) 2.7 3.3 3.6 V F C Maximum clock frequency 80 — — MHz — Program/erase cycles 100,000 — — cycles T RET Data retention time 20 — — years T P P Page program time — 0.8 5 ms T SE Sector erase time (4 KB) — 70 500 ms T BE1 Block erase time (32 KB) — 0.2 2 s T BE2 Block erase time (64 KB) — 0.3 3 s Cont’d on next page Espressif Systems 24 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 6 Electrical Characteristics Table 6-8 – cont’d from previous page Parameter Description Min Typ Max Unit T CE Chip erase time (16 Mb) — 7 20 s Chip erase time (32 Mb) — 20 60 s Chip erase time (64 Mb) — 25 100 s Chip erase time (128 Mb) — 60 200 s Chip erase time (256 Mb) — 70 300 s Espressif Systems 25 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics 7 RF Characteristics This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and Test Guide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7.1 Wi-Fi Radio Table 7-1. Wi-Fi RF Characteristics Name Description Center frequency range of operating channel 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics Table 7-2. TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 20.5 — 802.11b, 11 Mbps — 20.5 — 802.11g, 6 Mbps — 20.0 — 802.11g, 54 Mbps — 18.0 — 802.11n, HT20, MCS0 — 19.0 — 802.11n, HT20, MCS7 — 17.5 — 802.11n, HT40, MCS0 — 18.5 — 802.11n, HT40, MCS7 — 17.0 — Table 7-3. TX EVM Test 1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, @20.5 dBm — –24.5 –10 802.11b, 11 Mbps, @20.5 dBm — –25.0 –10 802.11g, 6 Mbps, @20 dBm — –23.0 –5 802.11g, 54 Mbps, @18 dBm — –28.0 –25 Cont’d on next page Espressif Systems 26 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics Table 7-3 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11n, HT20, MCS0, @19 dBm — –23.5 –5 802.11n, HT20, MCS7, @17.5 dBm — –30.5 –27 802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5 802.11n, HT40, MCS7, @17 dBm — –30.5 –27 1 EVM is measured at the corresponding typical TX power provided in Table 7-2 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 7.1.2 Wi-Fi RF Receiver (RX) Characteristics For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n. Table 7-4. RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.0 — 802.11b, 2 Mbps — –96.0 — 802.11b, 5.5 Mbps — –93.0 — 802.11b, 11 Mbps — –88.6 — 802.11g, 6 Mbps — –92.8 — 802.11g, 9 Mbps — –91.8 — 802.11g, 12 Mbps — –90.8 — 802.11g, 18 Mbps — –88.4 — 802.11g, 24 Mbps — –85.4 — 802.11g, 36 Mbps — –82.0 — 802.11g, 48 Mbps — –77.8 — 802.11g, 54 Mbps — –76.2 — 802.11n, HT20, MCS0 — –92.6 — 802.11n, HT20, MCS1 — –90.6 — 802.11n, HT20, MCS2 — –88.0 — 802.11n, HT20, MCS3 — –84.8 — 802.11n, HT20, MCS4 — –81.6 — 802.11n, HT20, MCS5 — –77.4 — 802.11n, HT20, MCS6 — –75.6 — 802.11n, HT20, MCS7 — –74.4 — 802.11n, HT40, MCS0 — –90.0 — 802.11n, HT40, MCS1 — –87.6 — 802.11n, HT40, MCS2 — –84.8 — 802.11n, HT40, MCS3 — –81.8 — 802.11n, HT40, MCS4 — –78.4 — 802.11n, HT40, MCS5 — –74.2 — Cont’d on next page Espressif Systems 27 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics Table 7-4 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11n, HT40, MCS6 — –72.6 — 802.11n, HT40, MCS7 — –71.2 — Table 7-5. Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — Table 7-6. RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 13 — 802.11n, HT40, MCS0 — 19 — 802.11n, HT40, MCS7 — 8 — 7.2 Bluetooth 5 (LE) Radio 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics Table 7-7. Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel 2402 ~ 2480 MHz RF transmit power range –24.0 ~ 20.0 dBm Espressif Systems 28 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics Table 7-8. Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –37.62 — dBm F = F0 ± 3 MHz — –41.95 — dBm F = F0 ± > 3 MHz — –44.48 — dBm Modulation characteristics ∆ f1 avg — 245.00 — kHz ∆ f2 max — 208.00 — kHz ∆ f2 avg /∆ f1 avg — 0.93 — — Carrier frequency offset — — –9.00 — kHz Carrier frequency drift |f 0 − f n | n=2, 3, 4, ..k — 1.17 — kHz |f 1 − f 0 | — 0.30 — kHz |f n − f n−5 | n=6, 7, 8, ..k — 4.90 — kHz Table 7-9. Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 4 MHz — –43.55 — dBm F = F0 ± 5 MHz — –45.26 — dBm F = F0 ± > 5 MHz — –47.00 — dBm Modulation characteristics ∆ f1 avg — 497.00 — kHz ∆ f2 max — 398.00 — kHz ∆ f2 avg /∆ f1 avg — 0.95 — — Carrier frequency offset — — –9.00 — kHz Carrier frequency drift |f 0 − f n | n =2 , 3 , 4 , ..k — 0.46 — kHz |f 1 − f 0 | — 0.70 — kHz |f n − f n−5 | n=6, 7, 8, ..k — 6.80 — kHz Table 7-10. Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –37.90 — dBm F = F0 ± 3 MHz — –41.00 — dBm F = F0 ± > 3 MHz — –42.50 — dBm Modulation characteristics ∆ f1 avg — 252.00 — kHz ∆ f1 max — 200.00 — kHz Carrier frequency offset — — –13.70 — kHz Carrier frequency drift |f 0 − f n | n=1, 2, 3, ..k — 1.52 — kHz |f 0 − f 3 | — 0.65 — kHz |f n − f n−3 | n=7, 8, 9, ..k — 0.70 — kHz Espressif Systems 29 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics Table 7-11. Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –37.90 — dBm F = F0 ± 3 MHz — –41.30 — dBm F = F0 ± > 3 MHz — –42.80 — dBm Modulation characteristics ∆ f2 avg — 220.00 — kHz ∆ f2 max — 205.00 — kHz Carrier frequency offset — — –11.90 — kHz Carrier frequency drift |f 0 − f n | n=1, 2, 3, ..k — 1.37 — kHz |f 0 − f 3 | — 1.09 — kHz |f n − f n−3 | n=7, 8, 9, ..k — 0.51 — kHz 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics Table 7-12. Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –96 — dBm Maximum received signal @30.8% PER — — 10 — dBm Co-channel C/I — — 8 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –4 — dB F = F0 – 1 MHz — –3 — dB F = F0 + 2 MHz — –32 — dB F = F0 – 2 MHz — –36 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –39 — dB Image frequency — — –29 — dB Adjacent channel to image frequency F = F image + 1 MHz — –38 — dB F = F image – 1 MHz — –34 — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –9 — dBm 2003 MHz ~ 2399 MHz — –18 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –6 — dBm Intermodulation — — –44 — dBm 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Espressif Systems 30 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics Table 7-13. Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –93 — dBm Maximum received signal @30.8% PER — — 0 — dBm Co-channel C/I — — 10 — dB Adjacent channel selectivity C/I F = F0 + 2 MHz — –7 — dB F = F0 – 2 MHz — –7 — dB F = F0 + 4 MHz (1) — — — dB F = F0 – 4 MHz — –34 — dB F ≥ F0 + 6 MHz — –39 — dB F ≤ F0 – 6 MHz — –39 — dB Image frequency — — –27 — dB Adjacent channel to image frequency F = F image + 2 MHz — –39 — dB F = F image – 2 MHz (2) — — — dB Out-of-band blocking performance 30 MHz ~ 2000 MHz — –17 — dBm 2003 MHz ~ 2399 MHz — –19 — dBm 2484 MHz ~ 2997 MHz — –16 — dBm 3000 MHz ~ 12.75 GHz — –22 — dBm Intermodulation — — –40 — dBm 1 Refer to the value of Image frequency. 2 Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz. Table 7-14. Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –104 — dBm Maximum received signal @30.8% PER — — 10 — dBm Co-channel C/I — — 2 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –6 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –40 — dB F = F0 – 2 MHz — –42 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –46 — dB Image frequency — — –34 — dB Adjacent channel to image frequency F = F image + 1 MHz — –44 — dB F = F image – 1 MHz — –37 — dB 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Table 7-15. Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –99 — dBm Cont’d on next page Espressif Systems 31 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 7 RF Characteristics Table 7-15 – cont’d from previous page Parameter Description Min Typ Max Unit Maximum received signal @30.8% PER — — 10 — dBm Co-channel C/I — — 3 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –5 — dB F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –39 — dB F = F0 – 2 MHz — –40 — dB F ≥ F0 + 3 MHz (1) — — — dB F ≤ F0 – 3 MHz — –40 — dB Image frequency — — –34 — dB Adjacent channel to image frequency F = F image + 1 MHz — –43 — dB F = F image – 1 MHz — –38 — dB 1 Refer to the value of Adjacent channel to image frequency when F = F image – 1 MHz. Espressif Systems 32 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 8 Module Schematics 8 Module Schematics This is the reference design of the module. 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. R1 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-C3-MINI-1(pin-out) NC: No component. 50 ohm Impedance Control GND VDD33 GND GND GNDGND GND GND GND GND VDD33 GND GNDGND VDD33 VDD33 GND GND GND GND VDD_SPI VDD33 GND GND GND VDD33 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary <02_ESP32-C3-MINI-1> V1.1 ESP32-C3-MINI-1 A4 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary <02_ESP32-C3-MINI-1> V1.1 ESP32-C3-MINI-1 A4 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary <02_ESP32-C3-MINI-1> V1.1 ESP32-C3-MINI-1 A4 2 2Thursday, January 23, 2025 U2 ESP32-C3FH4 LNA_IN 1 VDD3P3 2 VDD3P3 3 XTAL_32K_P 4 XTAL_32K_N 5 GPIO2 6 CHIP_EN 7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17 VDD_SPI 18 SPIHD 19 SPIWP 20 SPICS0 21 SPICLK 22 SPID 23 SPIQ 24 U0RXD 27 U0TXD 28 XTAL_N 29 XTAL_P 30 GND 33 GPIO3 8 VDDA 32 VDDA 31 GPIO19 26 GPIO18 25 ESP32-C3-MINI-1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 NC 9 NC 10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 IO19 27 IO7 21 IO8 22 IO0 12 IO1 13 GND 52 IO6 20 NC 35 NC 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 C6 0.1uF ANT1 PCB_ANT 1 2 C8 TBD U1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 D1 ESD C5 10uF C11 1uF R1 0 C7 0.1uF C4 10nF C2 TBD L1 2.0nH C3 1uF C10 0.1uF R2 499 L2 TBD C12 0.1uF C9 TBD C1 TBD R8 10K(NC) GPIO19 CHIP_EN GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 U0RXD GPIO18 LNA_IN GPIO9 GPIO10 GPIO0 GPIO1 SPICS0 GPIO2 GPIO3 RF_ANT U0TXD GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO10 GPIO6 GPIO7 GPIO8 GPIO9 GPIO18 GPIO19 U0RXD U0TXD GPIO4 GPIO5 Figure 8-1. ESP32-C3-MINI-1 Schematics Espressif Systems 33 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 8 Module Schematics 5 5 4 4 3 3 2 2 1 1 D D C C B B A A The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. R1 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-C3-MINI-1U(pin-out) NC: No component. 50 ohm Impedance Control GND VDD33 GND GND GNDGND GND GND GND GND VDD33 GND GND VDD33 VDD33 GND GND GND GND VDD_SPI VDD33 GND GND GND GND VDD33 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary <02_ESP32-C3-MINI-1U> V1.2 ESP32-C3-MINI-1U A4 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary <02_ESP32-C3-MINI-1U> V1.2 ESP32-C3-MINI-1U A4 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary <02_ESP32-C3-MINI-1U> V1.2 ESP32-C3-MINI-1U A4 2 2Thursday, January 23, 2025 C1 TBD D1 ESD C9 TBD R8 10K(NC) ANT1 CONN 1 4 2 3 ESP32-C3-MINI-1U GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 NC 9 NC 10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 IO19 27 IO7 21 IO8 22 IO0 12 IO1 13 GND 52 IO6 20 NC 35 NC 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 R1 0 C12 0.1uF C3 1uF C10 0.1uF R2 499 C8 TBD C2 TBD L1 2.0nH C6 0.1uF C5 10uF L2 TBD C7 0.1uF C4 10nF U2 ESP32-C3FH4 LNA_IN 1 VDD3P3 2 VDD3P3 3 XTAL_32K_P 4 XTAL_32K_N 5 GPIO2 6 CHIP_EN 7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17 VDD_SPI 18 SPIHD 19 SPIWP 20 SPICS0 21 SPICLK 22 SPID 23 SPIQ 24 U0RXD 27 U0TXD 28 XTAL_N 29 XTAL_P 30 GND 33 GPIO3 8 VDDA 32 VDDA 31 GPIO19 26 GPIO18 25 C11 1uF U1 40MHz(±10ppm) XIN 1 GND 2 XOUT 3 GND 4 GPIO19 CHIP_EN GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 U0RXD GPIO18 LNA_IN GPIO9 GPIO10 GPIO0 GPIO1 SPICS0 GPIO2 GPIO3 RF_ANT U0TXD GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO10 GPIO6 GPIO7 GPIO8 GPIO9 GPIO18 GPIO19 U0RXD U0TXD GPIO4 GPIO5 Figure 8-2. ESP32-C3-MINI-1U Schematics Espressif Systems 34 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 9 Peripheral Schematics 9 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). 5 5 4 4 3 3 2 2 1 1 D D C C B B A A NC: No component. ESP32-C3-MINI-1 ESP32-C3-MINI-1U IO4 IO5 IO6 IO7 IO8 IO2 IO3 EN IO9 IO0 IO1 IO10 RXD0 TXD0 EN TMS TDI TCK TDO IO19 IO18 USB_D- USB_D+ GND VDD33 GND GND GND GND GND VDD33 GND GND GNDGND VDD33 GND C3 TBD R7 NC C6 TBD C4 0.1uF R2 0 R9 10K JP2 Boot Option 1 1 2 2 U1 GND 1 3V3 3 IO9 23 NC 4 IO2 5 IO3 6 NC 7 NC 9 NC 10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 IO19 27 IO7 21 IO8 22 IO0 12 IO1 13 GND 52 IO6 20 NC 35 NC 24 EPAD 49 GND 2 GND 53 GND 51 GND 50 EN 8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND 11 NC 25 R6 0 JP3 USB 1 1 2 2 C1 10uF C8 12pF(NC) C2 0.1uF C7 12pF(NC) SW1 JP4 UART 1 1 2 2 3 3 4 4 X1 32.768kHz(NC) 12 JP1 JTAG 1 1 2 2 3 3 4 4 R6 0(NC) R8 10KR5 0(NC) R1 TBD R4 0 C5 TBD Figure 9-1. Peripheral Schematics • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor. • To ensure that the power supply to the ESP32-C3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-C3’s power-up and reset sequence timing diagram, please refer Section 4.3 Chip Power-up and Reset. • UART0 is used to download firmware and log output. When using the AT firmware, note that the UART GPIO is already configured. It is recommended to use the default configuration. Please refer to ESP-AT User Guide for ESP32-C3 > Section Hardware Connection. Espressif Systems 35 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 10 Physical Dimensions 10 Physical Dimensions 10.1 Module Dimensions 5.4 16.6±0.15 0.813.2±0.15 Top view Side view Bottom view 2.4±0.15 11.2 0.6 1.45 1.45 8.4 9.2 10 11.2 12.6 6.8 7.6 8.4 9 10.6 0.62 0.62 11.95 9.95 0.6 5.4 9.2 11 Ø0.5 Unit: mm Figure 10-1. ESP32-C3-MINI-1 Physical Dimensions 5.4 12.5±0.15 0.813.2±0.15 Top view Side view Bottom view 0.6 1.45 1.45 8.4 9.2 10 11.2 12.6 6.8 7.6 8.4 9 10.6 12.25 0.6 5.4 9.2 11 Unit: mm 1.55 1.7 8.7 0.47 0.48 9.18 11.55 2.4±0.15 0.85 5.6 Figure 10-2. ESP32-C3-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to ESP32-C3 Module Packaging Information. Espressif Systems 36 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 10 Physical Dimensions 10.2 Dimensions of External Antenna Connector ESP32-C3-MINI-1U uses the third generation external antenna connector as shown in Figure 10-3 Dimensions of External Antenna Connector. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMC connector from Amphenol SECTION: A-A SCALE: 1:1 A 1.7 1.7 0.85 2.05±0.10 1.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mm Tolerance: +/-0.1 mm HOUSING CONTACT SHELL Figure 10-3. Dimensions of External Antenna Connector The external antenna used for ESP32-C3-MINI-1U during certification testing is the third generation monopole antenna, with material code TFPD08H10060011. The module does not include an external antenna upon shipment. If needed, select a suitable external antenna Espressif Systems 37 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 10 Physical Dimensions based on the product’s usage environment and performance requirements. It is recommended to select an antenna that meets the following requirements: • 2.4 GHz band • 50 Ω impedance • The maximum gain does not exceed 2.33 dBi, the gain of the antenna used for certification • The connector matches the specifications shown in Figure 10-3 Dimensions of External Antenna Connector Note: If you use an external antenna of a different type or gain, additional testing, such as EMC, may be required beyond the existing antenna test reports for Espressif modules. Specific requirements depend on the certification type. Espressif Systems 38 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 11 PCB Layout Recommendations 11 PCB Layout Recommendations 11.1 PCB Land Pattern This section provides the following resources for your reference: • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11-1 ESP32-C3-MINI-1 Recommended PCB Land Pattern and Figure 11-2 ESP32-C3-MINI-1U Recommended PCB Land Pattern. • Source files of recommended PCB land patterns to measure dimensions not covered in Figure 11-1 and Figure 11-2. You can view the source files for ESP32-C3-MINI-1 and ESP32-C3-MINI-1U with Autodesk Viewer. • 3D models of ESP32-C3-MINI-1 and ESP32-C3-MINI-1U. Please make sure that you download the 3D model file in .STEP format. Beware that some browsers might add .txt. 1.6 Antenna Area Pin 1 11.2 0.6 9.9 5.4 11.9 1.6 13.2 16.6 1.45 5.4 1.450.6 11.8 9.8 Unit: mm Pad 48 x 0.4 48 x 0.8 4 x 0.7 4 x 0.70.8 Via for thermal pad Figure 11-1. ESP32-C3-MINI-1 Recommended PCB Land Pattern Espressif Systems 39 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 11 PCB Layout Recommendations 1.6 Pin 1 12.5 0.6 9.9 5.4 11.9 1.6 13.2 1.45 5.4 1.450.6 11.8 9.8 48 x 0.4 48 x 0.8 4 x 0.7 4 x 0.70.8 5.6 Unit: mm Pad Via for thermal pad Figure 11-2. ESP32-C3-MINI-1U Recommended PCB Land Pattern 11.2 Module Placement for PCB Design If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer to ESP32-C3 Hardware Design Guidelines > Section General Principles of PCB Layout for Modules. Espressif Systems 40 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 12 Product Handling 12 Product Handling 12.1 Storage Conditions The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked. 12.2 Electrostatic Discharge (ESD) • Human body model (HBM): ±2000 V • Charged-device model (CDM): ±500 V 12.3 Reflow Profile Solder the module in a single reflow. 50 100 0 150 200 250 200 100 50 150 250 Time (s) 217 25 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC305) lead-free solder Temperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 12-1. Reflow Profile Espressif Systems 41 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 12 Product Handling 12.4 Ultrasonic Vibration Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate. Espressif Systems 42 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Datasheet Versioning Datasheet Versioning Datasheet Version Status Watermark Definition v0.1 ~ v0.5 (excluding v0.5) Draft Confidential This datasheet is under development for products in the design stage. Specifications may change without prior notice. v0.5 ~ v1.0 (excluding v1.0) Preliminary release Preliminary This datasheet is actively updated for products in the verification stage. Specifications may change before mass production, and the changes will be documentation in the datasheet’s Revision History. v1.0 and higher Official release — This datasheet is publicly released for products in mass production. Specifications are finalized, and major changes will be communicated via Product Change Notifications (PCN). Any version — Not Recommended for New Design (NRND) 1 This datasheet is updated less frequently for products not recommended for new designs. Any version — End of Life (EOL) 2 This datasheet is no longer mtained for products that have reached end of life. 1 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet are not recommended for new designs. 2 Watermark will be added to the datasheet title page only when all the product variants covered by this datasheet have reached end of life. Espressif Systems 43 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Related Documentation and Resources Related Documentation and Resources Related Documentation • ESP32-C3 Series Datasheet – Specifications of the ESP32-C3 hardware. • ESP32-C3 Technical Reference Manual – Detailed information on how to use the ESP32-C3 memory and peripherals. • ESP32-C3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C3 into your hardware product. • ESP32-C3 Series SoC Errata – Descriptions of known errors in ESP32-C3 series of SoCs. • Certificates https://espressif.com/en/support/documents/certificates • ESP32-C3 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-C3 • ESP32-C3 Advisories – Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-C3 • Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone • ESP-IDF Programming Guide for ESP32-C3 – Extensive documentation for the ESP-IDF development framework. • ESP-IDF and other development frameworks on GitHub. https://github.com/espressif • ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/ • ESP-FAQ – A summary document of frequently asked questions released by Espressif. https://espressif.com/projects/esp-faq/en/latest/index.html • The ESP Journal – Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/ • See the tabs SDKs and Demos, Apps, Tools, AT Firmware. https://espressif.com/en/support/download/sdks-demos Products • ESP32-C3 Series SoCs – Browse through all ESP32-C3 SoCs. https://espressif.com/en/products/socs?id=ESP32-C3 • ESP32-C3 Series Modules – Browse through all ESP32-C3-based modules. https://espressif.com/en/products/modules?id=ESP32-C3 • ESP32-C3 Series DevKits – Browse through all ESP32-C3-based devkits. https://espressif.com/en/products/devkits?id=ESP32-C3 • ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters. https://products.espressif.com/#/product-selector?language=en Contact Us • See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores), Become Our Supplier, Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 44 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Revision History Revision History Date Version Release notes 2025-07-14 v2.1 • Added Section 4.3 Chip Power-up and Reset • Added Section 6.5 Memory Specifications • Section 9 Peripheral Schematics: Added a note about AT communication using UART0 • Section 10.2 Dimensions of External Antenna Connector: Added the external antenna information for certification • Added Datasheet Versioning 2025-04-14 v2.0 According to updates in Compatibility Advisory for ESP32-C3 Chip Revision v1.1, updated SRAM space in note 6 for Table ESP32-C3-MINI-1U (CONN) Series Com- parison 2025-01-24 v1.9 Updated chip in ESP32-C3-MINI-1-N4 and ESP32-C3-MINI-1U-N4 from ESP32-C3FN4 to ESP32-C3FH4 2024-11-20 v1.8 • Table 1-1 ESP32-C3-MINI-1 (ANT) Series Comparison 1 and 1-2 ESP32-C3- MINI-1U (CONN) Series Comparison: – Added the ESP32-C3-MINI-1-N4X, ESP32-C3-MINI-1U-N4X, and ESP32-C3-MINI-1U-H4X variants – Marked the ESP32-C3-MINI-1U-N4 and ESP32-C3-MINI-1U-H4 vari- ants as Not Recommended for New Designs (NRND) • Added Table 6-5 Current Consumption for Bluetooth LE in Active Mode 2024-09-19 v1.7 • Table 1-2 ESP32-C3-MINI-1U (CONN) Series Comparison: Updated flash program/erase cycles, data retention time (note 4) and maximum clock frequency (note 7) • Improved the wording and structure of following sections: – Updated Section ”Strapping Pins” and renamed to 4 Boot Configura- tions – Added Chapter 5 Peripherals – Updated Table ”Wi-Fi RF Standards” and renamed to ”Wi-Fi RF Char- acteristics” – Added Section 11.2 Module Placement for PCB Design – Optimized Figure 12-1 Reflow Profile 2024-07-29 v1.6 Added Compatibility Advisory for ESP32-C3 Chip Revision v1.1 to the notes of Table ESP32-C3-MINI-1U (CONN) Series Comparison 2024-06-05 v1.5 • Added new variant ESP32-C3-MINI-1-H4X • Marked the ESP32-C3-MINI-1-N4, ESP32-C3-MINI-1-H4, and ESP32- C3-MINI-1-H4-AZ variants as Not Recommended for New Designs (NRND) Cont’d on next page Espressif Systems 45 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Revision History Cont’d from previous page Date Version Release notes 2024-05-15 v1.4 • Updated note 5 of Table ESP32-C3-MINI-1 (ANT) Series Comparison 1 and Table ESP32-C3-MINI-1U (CONN) Series Comparison • Updated the formatting of Section 4 Boot Configurations • Updated the maximum value of ”RF power control range” to 20 dBm in Table Bluetooth LE RF Characteristics • Updated the note about solder paste in Section 9 Peripheral Schematics • Updated the markings of dimensions and thermal pad vias in Section 11.1 PCB Land Pattern 2022-11-08 v1.3 • Added a new variant ESP32-C3-MINI-1-H4-AZ • Changed Table Ordering Information to Table ESP32-C3-MINI-1 (ANT) Series Comparison 1 and Table ESP32-C3-MINI-1U (CONN) Series Comparison • Updated test condition descriptions and data in Section 6.4 Current Con- sumption Characteristics • Updated ”RF power control range” in Table Bluetooth LE RF Characteristics • Added descriptions in Section 11.1 PCB Land Pattern 2022-06-30 v1.2 Added Section 12.4 Ultrasonic Vibration 2022-05-16 v1.1 • Added a note under Table Ordering Information • Updated Chapter 8 Module Schematics 2021-06-21 v1.0 • Updated module description on the title page • Deleted Section ”About This Document” • Restructured Section 1.1 Features • Added ordering code in Table Ordering Information • Added descriptions in Section 10.2 Dimensions of External Antenna Con- nector • Updated Section ”Learning Resources” and renamed to Related Documen- tation and Resources • Replaced ”chip family” with ”chip series” following Espressif’s taxonomy 2021-04-16 v0.7 Added information about ESP32-C3-MINI-1U module 2021-02-22 v0.6 Updated the value of C7 to 0.1 µF in Chapter 8 Module Schematics 2021-02-05 v0.5 Preliminary release Espressif Systems 46 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.1 Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com