ESP-Packaging Choose target... Choose version... Chip Packaging Information Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP8266 Series Packaging Information Download PDF ESP8266 Series Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP8266 series of products, including the product silk marking, dry-packing requirements, and product packing. Chip Packaging Information Chip Silk Marking Marking Convention Flash Code and PSRAM Code Conventions No Flash, No PSRAM In-package Flash, No PSRAM Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Module Packaging Information Module Silk Marking Marking Convention Specification Identifier Convention Data Matrix Convention Module Product Packing Tape Module Placement and Tape Direction Reel Pizza Box Dry Packing Requirement Disclaimer and Copyright Next Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2025, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP8266 Chip Packaging Information Download PDF ESP8266 Chip Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP8266 series of chips, including the chip silk marking, dry-packing requirements, and chip product packing. Chip Silk Marking Marking Convention Flash Code and PSRAM Code Conventions No Flash, No PSRAM In-package Flash, No PSRAM Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2025, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Marking Convention Flash Code and PSRAM Code Conventions No Flash, No PSRAM In-package Flash, No PSRAM Chip Product Packing Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP8266 Chip Packaging Information Chip Silk Marking Download PDF Chip Silk Marking [中文] Espressif chip silk marking provides information such as chip name, flash size, and operating temperature. Marking Convention Chip Silk Marking Diagram Pin 1: Position of Pin 1. Espressif Logo: Company logo. Product Name: Specifies the chip name. Date Code: WW is the week number of year YYYY. Example: Date Code “122017” stands for the 12th week of year 2017. Flash Code is a code that indicates: (Optional) Temperature and flash size. The tracking information of the in-package flash. The arrangement of the flash code can vary by product. Please see Flash Code and PSRAM Code Conventions for details. PSRAM Code is a code that indicates: (Optional) Temperature and PSRAM size. The tracking information of the in-package PSRAM. The arrangement of the PSRAM code can vary by product. Please see Flash Code and PSRAM Code Conventions for details. Espressif Tracking Information: The second character of this code correlates to the chip revision. Flash Code and PSRAM Code Conventions Based on the in-package flash or PSRAM, ESP8266 chips can be divided into the following categories. No Flash, No PSRAM This section applies to ESP8266 chips without any in-package flash or PSRAM. For such chips, flash code and PSRAM code are simply left empty. Flash Code and PSRAM Code Diagram - No Flash, No PSRAM In-package Flash, No PSRAM This section applies to ESP8266 chips with only in-package flash. For such chips, only the flash code is used. PSRAM code is left empty. Flash Code and PSRAM Code Diagram - In-package Flash, No PSRAM (Optional) Temperature (1 character): H: 105 °C N: 85 °C (Optional) Size (1 character): 2: 2 MB 4: 4 MB 8: 8 MB Flash Tracking Information (7 characters). Note ESP8285 uses Mbit, instead of MByte, to indicate flash size: Size (2 characters): 08: 8 Mbit 16: 16 Mbit Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2025, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP8266 Chip Packaging Information Chip Packing Download PDF Chip Packing [中文] Espressif chips are packed on tape and reel. Then the reel is packed in an aluminum moisture barrier bag (MBB) in vacuum state to protect chips from absorbing moisture during transportation and storage. At last, the MBB is packed into a pizza box. Espressif Product Packing Method Note The figure(s) above is for illustration purposes only. Actual product may vary. Tape This section introduces the dimensions of the carrier tape. Carrier Tape Dimensions (Unit: mm) Package Carrier Width (W) Cavity Pitch (P 1) Cavity Width (A 0) Cavity Length (B 0) 5 * 5 12.0 ± 0.30 8.0 ± 0.10 5.30 ± 0.10 5.30 ± 0.10 Note The surface resistance of the carrier tape is 10 4 ~ 10 11 ohms. Pin1 Location Pin 1 Orientation of Chips in Carrier Tape Reel This section introduces the dimensions of the reel. Reel Dimensions Package Reel Size Quantity Per Reel 5 * 5 13’’ 5,000 Note The surface resistance of the carrier tape is 10 4 ~ 10 11 ohms. Pizza Box Inside of the pizza box of typical Espressif chips, together with the tape and reel, product label and dry-packing related items are also packed. This section describes the product label. For information about dry packing related items, please go to Section Dry Packing Requirement. Espressif Chip Label - One Espressif Chip Label - Two ESPRESSIF logo: Company logo and name CPN: Espressif product name, e.g. ESP32-D0WDQ6 MPN: Manufacturing product name LOT1: Number of mother lot LOT2: Number of combined lot QTY1: Quantity of mother lot QTY2: Quantity of combined lot D/C 1: Assembly date code for LOT1 D/C 2: Assembly date code for LOT2 Test ID: Test information DATE: Packing date, MM-DD-YYYY, DATE “03-29-2016” stands for Mar 29th in 2016 Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2025, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP8266 Chip Packaging Information Dry Packing Requirement Download PDF Dry Packing Requirement [中文] All Espressif chip’s moisture sensitivity level (MSL) is 3, thus must be dry-packed. Dry packing usually consists of desiccant material, a humidity-indicator card (HIC), as well as a Moisture Sensitivity Caution Label sealed with the populated reel inside a moisture barrier bag (MBB). Moisture Sensitivity Caution Label Humidity-indicator Card Desiccant Note The figure(s) above is for illustration purposes only. Actual product may vary. The floor life (the allowable period of time, after removal from a moisture barrier bag, dry storage or dry bake and before the reflow soldering process) is shown in the table below. Level Floor life (out of bag) at factory ambient ≤ 30℃/60% RH, or as stated 3 168 hours Products require bake, before mounting, if: The humidity-indicator card reads > 10%, when reading at 23 ± 5℃; Or the period of time after removal from a moisture barrier bag or dry storage or dry bake and before the reflow soldering process is larger than the value listed in table above. If baking is required, make sure that the products are taken out of the tape, and IPC/JEDEC J-STD-033 is followed during the bake procedure. Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2025, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Module Packaging Information Module Silk Marking Module Product Packing Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP8266 Module Packaging Information Download PDF ESP8266 Module Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP8266 series of modules, including the module silk marking, dry-packing requirements, and module product packing. Module Silk Marking Marking Convention Specification Identifier Convention Data Matrix Convention Module Product Packing Tape Module Placement and Tape Direction Reel Pizza Box Dry Packing Requirement Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2025, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Module Packaging Information Module Silk Marking Marking Convention Specification Identifier Convention Data Matrix Convention Module Product Packing Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP8266 Module Packaging Information Module Silk Marking Download PDF Module Silk Marking [中文] Espressif module silk marking provides information such as module name, flash size, an