ESP-Packaging Choose target... Choose version... Chip Packaging Information Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP32-S2 Series Packaging Information Download PDF ESP32-S2 Series Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP32-S2 series of products, including the product silk marking, dry-packing requirements, and product packing. Chip Packaging Information Chip Silk Marking Marking Convention Flash Code and PSRAM Code Conventions No Flash, No PSRAM In-package Flash, No PSRAM In-package PSRAM, No Flash In-package Flash, In-package PSRAM Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Module Packaging Information Module Silk Marking Marking Convention Specification Identifier Convention Data Matrix Convention Module Product Packing Tape Module Placement and Tape Direction Reel Pizza Box Dry Packing Requirement Disclaimer and Copyright Next Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP32-S2 Chip Packaging Information Download PDF ESP32-S2 Chip Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP32-S2 series of chips, including the chip silk marking, dry-packing requirements, and chip product packing. Chip Silk Marking Marking Convention Flash Code and PSRAM Code Conventions No Flash, No PSRAM In-package Flash, No PSRAM In-package PSRAM, No Flash In-package Flash, In-package PSRAM Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP32-S2 Chip Packaging Information Dry Packing Requirement Download PDF Dry Packing Requirement [中文] All Espressif chip’s moisture sensitivity level (MSL) is 3, thus must be dry-packed. Dry packing usually consists of desiccant material, a humidity-indicator card (HIC), as well as a Moisture Sensitivity Caution Label sealed with the populated reel inside a moisture barrier bag (MBB). Moisture Sensitivity Caution Label Humidity-indicator Card Desiccant Note The figure(s) above is for illustration purposes only. Actual product may vary. The floor life (the allowable period of time, after removal from a moisture barrier bag, dry storage or dry bake and before the reflow soldering process) is shown in the table below. Level Floor life (out of bag) at factory ambient ≤ 30℃/60% RH, or as stated 3 168 hours Products require bake, before mounting, if: The humidity-indicator card reads > 10%, when reading at 23 ± 5℃; Or the period of time after removal from a moisture barrier bag or dry storage or dry bake and before the reflow soldering process is larger than the value listed in table above. If baking is required, make sure that the products are taken out of the tape, and IPC/JEDEC J-STD-033 is followed during the bake procedure. Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Module Packaging Information Module Silk Marking Marking Convention Specification Identifier Convention Data Matrix Convention Module Product Packing Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP32-S2 Module Packaging Information Module Silk Marking Download PDF Module Silk Marking [中文] Espressif module silk marking provides information such as module name, flash size, and operating temperature. Marking Convention Module Silk Marking Diagram Company Logo: ESPRESSIF logo. Module Name: Espressif module name. Certification ID: Indicates the certification this module has passed. Company Name: Espressif Systems (Shanghai) Co., Ltd (in Chinese). Specification Identifier: See Specification Identifier Convention below. Data Matrix: See Data Matrix Convention below. Specification Identifier Convention The Specification Identifier is defined by Espressif to indicate the product status, operating temperature, and the memory inside Espressif modules. Module Specification Identifier Diagram Product Status (2 characters): XX or MN: mass production Others: NPI product See details in the Note below. Temperature (1 character): N: 85 °C/65 °C H: 105 °C Flash Size (1 character or 2 characters): 2: 2 MB 4: 4 MB 8: 8 MB 16: 16 MB 32: 32 MB PSRAM (1 character): R: PSRAM inside PSRAM Size (1 character): 2: 2 MB 8: 8 MB Reserved: 2 characters: for customized product 0 character: mass production product Note Product Status: XX is used for products launched earlier; MN is commonly used for newly launched products or products with new chip revisions launched. For example, M0, M1 or MA, MB…. Examples of other possible codes can be E1, D2, and P3, indicating this is an NPI product under development or in trail run. Note The PSRAM and PSRAM Size fields only exist if this module comes with PSRAM. For example, XXN4: indicates the module comes with 4 MB flash and no PSRAM. XXN4R2: indicates the module comes with 4 MB flash and 2 MB PSRAM. Data Matrix Convention Scanning the Data Matrix on Espressif modules returns you an 18-character code. The convention for this code is described below: Character (from left to right) Description Character 1 and Character 2 Reserved for Espressif use Character 3 to Character 6 The production Date Code (YYWW), indicating the WW week of YYYY year Character 7 to Character 18 Module MAC ID Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Packaging ESP32-S2 Chip Packaging Information Chip Packing Download PDF Chip Packing [中文] Espressif chips are packed on tape and reel. Then the reel is packed in an aluminum moisture barrier bag (MBB) in vacuum state to protect chips from absorbing moisture during transportation and storage. At last, the MBB is packed into a pizza box. Espressif Product Packing Method Note The figure(s) above is for illustration purposes only. Actual product may vary. Tape This section introduces the dimensions of the carrier tape. Carrier Tape Dimensions (Unit: mm) Package Carrier Width (W) Cavity Pitch (P 1) Cavity Width (A 0) Cavity Length (B 0) 7 * 7 16.0 ± 0.30 12.0 ± 0.10 7.30 ± 0.10 7.30 ± 0.10 Note The surface resistance of the carrier tape is 10 4 ~ 10 11 ohms. Pin1 Location Pin 1 Orientation of Chips in Carrier Tape Reel This section introduces the dimensions of the reel. Reel Dimensions Package Reel Size Quantity Per Reel 7 * 7 13’’ 2,000 Note The surface resistance of the carrier tape is 10 4 ~ 10 11 ohms. Pizza Box Inside of the pizza box of typical Espressif chips, together with the tape and reel, product label and dry-packing related items are also packed. This section describes the product label. For information about dry packing related items, please go to Section Dry Packing Requirement. Note Espressif has updated the product label style starting from 2026. For details, please refer to PCN202600201. During the transition period, the same product you receive may carry either of two label styles (Style 1 (New) or Style 2 (Legacy)). Please note that this is purely an update to label layout and a few field names — product specifications and quality remain unchanged. Espressif Chip Label — Style 1 (New, from 2026) Espressif Chip Label — Style 2 (Legacy) The field descriptions below are based on Style 1 (New); Style 2 (Legacy) is identical except for the country information (see COA and COD below). ESPRESSIF logo: Company logo and name CPN: Espressif part number, e.g. ESP32-D0WDQ6 MPN: Manufactured part number LOT1: Number of mother lot LOT2: Number of combined lot QTY1: Quantity of mother lot QTY2: Quantity of combined lot D/C 1: Assembly date code for LOT1 D/C 2: Assembly date code for LOT2 Test ID: Test information DATE: Packing date, MM-DD-YYYY, DATE “03-29-2016” stands for Mar 29th in 2016 COA: Country of Assembly. On Style 2 (Legacy), this field is shown as Origin (e.g. Origin: CHINA). COD: Country of Diffusion. Not present on Style 2 (Legacy). Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Marking Convention Flash Code and PSRAM Code Conventions No Flash, No PSRAM In-package Flash, No PSRAM In-package PSRAM, No Flash In-package Flash, In-package PSRAM Chip Product Packing Dry Packing Requirement Module Packaging Information Disclaimer and Copyright ESP-Pac