ESP-Packaging Choose target... Choose version... Chip Packaging Information Disclaimer and Copyright ESP-Packaging ESP32-P4 Series Packaging Information Download PDF ESP32-P4 Series Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP32-P4 series of products, including the product silk marking, dry-packing requirements, and product packing. Chip Packaging Information Chip Silk Marking Marking Convention Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Disclaimer and Copyright Next Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Marking Convention Chip Product Packing Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP32-P4 Chip Packaging Information Chip Silk Marking Download PDF Chip Silk Marking [中文] Espressif chip silk marking provides information such as chip name, flash size, and operating temperature. Marking Convention Chip Silk Marking Diagram Pin 1: Position of Pin 1. Espressif Logo: Company logo. Product Name: Specifies the chip name. Product Specification is a code that indicates: Operating temperature: N = Up to 85 °C H = Up to 105 °C (Optional) Flash and PSRAM configuration: F = In-package flash R = In-package PSRAM (Optional) Voltage level and interface: No letter = 3.3 V Quad SPI V = 1.8 V Octal SPI W = 1.8 V Hex SPI (Optional) Flash or PSRAM size. Examples: NRW16: The chip supports up to 85 °C operating temperature, and includes in-package 1.8 V Hex SPI PSRAM (16 MB). NR4: The chip supports up to 85 °C operating temperature, and includes in-package 3.3 V Quad SPI PSRAM (4 MB). Manufacturing Code: Identifies the chip revision. Espressif Tracking Information: Identifies the chip lot number. Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP32-P4 Chip Packaging Information Chip Packing Download PDF Chip Packing [中文] Espressif chips are packed on tape and reel. Then the reel is packed in an aluminum moisture barrier bag (MBB) in vacuum state to protect chips from absorbing moisture during transportation and storage. At last, the MBB is packed into a pizza box. Espressif Product Packing Method Note The figure(s) above is for illustration purposes only. Actual product may vary. Tape This section introduces the dimensions of the carrier tape. Carrier Tape Dimensions (Unit: mm) Package Carrier Width (W) Cavity Pitch (P 1) Cavity Width (A 0) Cavity Length (B 0) 10 * 10 24.0 ± 0.30 16.0 ± 0.10 10.30 ± 0.10 10.30 ± 0.10 Note The surface resistance of the carrier tape is 10 4 ~ 10 11 ohms. Pin1 Location Pin 1 Orientation of Chips in Carrier Tape Reel This section introduces the dimensions of the reel. Reel Dimensions Package Reel Size Quantity Per Reel 10 * 10 13’’ 2,000 Note The surface resistance of the carrier tape is 10 4 ~ 10 11 ohms. Pizza Box Inside of the pizza box of typical Espressif chips, together with the tape and reel, product label and dry-packing related items are also packed. This section describes the product label. For information about dry packing related items, please go to Section Dry Packing Requirement. Note Espressif has updated the product label style starting from 2026. For details, please refer to PCN202600201. During the transition period, the same product you receive may carry either of two label styles (Style 1 (New) or Style 2 (Legacy)). Please note that this is purely an update to label layout and a few field names — product specifications and quality remain unchanged. Espressif Chip Label — Style 1 (New, from 2026) Espressif Chip Label — Style 2 (Legacy) The field descriptions below are based on Style 1 (New); Style 2 (Legacy) is identical except for the country information (see COA and COD below). ESPRESSIF logo: Company logo and name CPN: Espressif part number, e.g. ESP32-D0WDQ6 MPN: Manufactured part number LOT1: Number of mother lot LOT2: Number of combined lot QTY1: Quantity of mother lot QTY2: Quantity of combined lot D/C 1: Assembly date code for LOT1 D/C 2: Assembly date code for LOT2 Test ID: Test information DATE: Packing date, MM-DD-YYYY, DATE “03-29-2016” stands for Mar 29th in 2016 COA: Country of Assembly. On Style 2 (Legacy), this field is shown as Origin (e.g. Origin: CHINA). COD: Country of Diffusion. Not present on Style 2 (Legacy). Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Disclaimer and Copyright ESP-Packaging Disclaimer and Copyright Notice Download PDF Disclaimer and Copyright Notice [中文] Information in this document, including URL references, is subject to change without notice. All third party’s information in this document is provided as is with no warranties to its authenticity and accuracy. No warranty is provided to this document for its merchantability, non-infringement, fitness for any particular purpose, nor does any warranty otherwise arising out of any proposal, specification or sample. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP32-P4 Chip Packaging Information Dry Packing Requirement Download PDF Dry Packing Requirement [中文] All Espressif chip’s moisture sensitivity level (MSL) is 3, thus must be dry-packed. Dry packing usually consists of desiccant material, a humidity-indicator card (HIC), as well as a Moisture Sensitivity Caution Label sealed with the populated reel inside a moisture barrier bag (MBB). Moisture Sensitivity Caution Label Humidity-indicator Card Desiccant Note The figure(s) above is for illustration purposes only. Actual product may vary. The floor life (the allowable period of time, after removal from a moisture barrier bag, dry storage or dry bake and before the reflow soldering process) is shown in the table below. Level Floor life (out of bag) at factory ambient ≤ 30℃/60% RH, or as stated 3 168 hours Products require bake, before mounting, if: The humidity-indicator card reads > 10%, when reading at 23 ± 5℃; Or the period of time after removal from a moisture barrier bag or dry storage or dry bake and before the reflow soldering process is larger than the value listed in table above. If baking is required, make sure that the products are taken out of the tape, and IPC/JEDEC J-STD-033 is followed during the bake procedure. Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme. ESP-Packaging Choose target... Choose version... Chip Packaging Information Chip Silk Marking Chip Product Packing Dry Packing Requirement Disclaimer and Copyright ESP-Packaging ESP32-P4 Chip Packaging Information Download PDF ESP32-P4 Chip Packaging Information [中文] This document summarizes the packaging requirements of Espressif’s ESP32-P4 series of chips, including the chip silk marking, dry-packing requirements, and chip product packing. Chip Silk Marking Marking Convention Chip Product Packing Tape Pin1 Location Reel Pizza Box Dry Packing Requirement Next Previous Suggestion on this document? Provide feedback Need more information? Check ESP forum Sales Questions Technical Inquiries © Copyright 2024 - 2026, Espressif Systems (Shanghai) Co., Ltd Built with Sphinx using a theme based on Read the Docs Sphinx Theme.