Changed products listed in Para 1 are compatible w 文件编号Document No.ESP-07-2-007-03文件名称Document Name产品/工艺变更通知Product/Process Change Notice(PCN)文件版本Document Version1.4保存期限Retention Period5 年5 yearswww.espressif.com Page1/9ESP32 系列产品的芯片版本升级Upgrade Chip Revision of ESP32 Series ProductsPCN编号PCN No.PCN20220901提出日期Issue Date of PCN2022/10/25变更日期Proposed Date of Change2022/12/25预计变更后产品首次出货日期Proposed Date of FirstShipment After Change2023/01/25PCN 类型 / PCN Category客户需要批准/ Customer Approval Required客户通知/ Customer Notification1.影响产品/ Affected Products1)分类1:ESP32原芯片版本为v1.0的芯片及对应的模组、开发板产品,具体产品清单参见附录I。Category 1: Products with ESP32 chip revision v1.0 before change, related product list see Appendix I.2)分类2:ESP32原芯片版本为v3.0及对应的模组、开发板产品,具体产品清单参见附录I。Category 2: Products with ESP32 chip revision v3.0 before change, related product list see Appendix I.注:芯片版本说明参见《关于芯片版本(Chip Revision)编码方式的兼容性公告》Note: For description of chip revision see Compatibility Advisory for Chip Revision Numbering Scheme2. 变更原因/ Reason for Change为进一步扩大 ESP32 系列产品的应用范围,适应更多复杂高温场景,升级 ESP32 系列产品的芯片版本,并同步调整 ESP32 高温 (–40 ℃ ~ 105 ℃) 模组产品上晶振的串联电阻规格。To broaden the product application realm and ensure stable operating under more complicated and hightemperature circumstances, the chip revision of ESP32 series of chips will be upgraded. The series resistanceof the crystal on the ESP32 high temperature version (–40 ℃ ~ 105 ℃) modules will also be changed.3.变更描述/ Description of Change升级ESP32系列产品的芯片版本,原芯片版本为v1.0的ESP32产品,由v1.0升级到v1.1;原芯片版本为v3.0的ESP32产品,由v3.0升级到v3.1。同时ESP32高温(–40℃~ 105℃)模组上晶振的串联电阻规格由0 Ω变更为100 Ω。Upgrade the chip revision v1.0 on the ESP32 series products to v1.1, and chip revision v3.0 to v3.1. Changethe crystal’s series resistance on the ESP32 high temperature version (–40℃~ 105℃) modules from 0 Ω to100 Ω. www.espressif.com Page2/94. 变更对比/ Change Comparison请见附录 I:变更对比。Please refer to Appendix I: Change Comparison.识别方式/ Identification Method:芯片产品通过 eFuse 及产品丝印。Chip products: Identified by eFuse bits and chip marking.模组产品通过主芯片的 eFuse,产品丝印的产品规格标识位,或产品外箱标签中的 PW 号。Module products: Identified by the chip eFuse, module marking or PW No. on product carton box.开发板产品通过主芯片的 eFuse,模组丝印的产品规格标识位,或产品外箱标签中的 PW 号。Development board product:Identified by the chip eFuse, module shield marking or PW No. on carton box.5. 变更影响/ Impact of Change1) 品质和性能/ Quality & Performance: 无影响/ No impact2) 交期/ Delivery: 无影响/ No impact3) 生产料号/ Material Part Numbers (MPN):客户可以继续使用原有的产品名称下单。Customers can continue using the existing product name to place orders.4) 认证/ Certification: 无影响/ No impact5) 软件/ IDF:当前的乐鑫 IDF 版本兼容段落 1 列出的变更后的产品,客户可继续使用现有的软件版本进行变更后产品的生产。Changed products listed in Para 1 are compatible with the current version of ESP-IDF. Customers can stilluse the current version for the changed products.6.变更前后产品处理/ How to Deal with ProductsFIFO7. 相关报告/ Report(s) Attached:Related ECN No.ECN-2022-005 & ECN-2022-015 & ECN-2022-036射频性能验证/ RF Performance Verification: Pass模组高温验证/ Module Verification: Pass www.espressif.com Page3/9Appendix I 变更对比/ Change Comparison一.分类 1 的产品基本信息/ Category 1 Product Basic Information1. 分类 1 的产品清单/Category 1Product List1) 芯片产品/ Chip Products:ESP32-D0WDQ6, ESP32-D0WD, ESP32-S0WD, ESP32-PICO-D42) 模组产品/ Module Products:Product NameMPNChange DescriptionESP32-WROOM-32ESP32-WROOM-32-N4,ESP32-WROOM-32(M103QH3200PH3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1ESP32-WROOM-32-N8,ESP32-WROOM-32(M103QH6400PH3Q0)ESP32-WROOM-32-N16,ESP32-WROOM-32(M103QH2800PH3Q0)ESP32-WROVERESP32-WROVER-N4R8,ESP32-WROVER(M203QL3264PH3Q0)ESP32-WROVER-I-N4R8,ESP32-WROVER-I(M203QL3264UH3Q0)ESP32-WROVER-N8R8,ESP32-WROVER(M203QL6464PH3Q0)ESP32-WROVER-N16R8,ESP32-WROVER(M203QL2864PH3Q0)ESP32-WROVER-I-N8R8,ESP32-WROVER-I(M203QL6464UH3Q0)ESP32-WROVER-I-N16R8,ESP32-WROVER-I(M203QL2864UH3Q0)ESP32-WROVER-BESP32-WROVER-B-N4R8,ESP32-WROVER-B(M213DH3264PH3Q0)ESP32-WROVER-B-N8R8,ESP32-WROVER-B(M213DH6464PH3Q0)ESP32-WROVER-B-N16R8,ESP32-WROVER-B(M213DH2864PH3Q0)ESP32-WROVER-IB-N4R8,ESP32-WROVER-IB(M213DH3264UH3Q0)ESP32-WROVER-IB-N8R8,ESP32-WROVER-IB(M213DH6464UH3Q0)ESP32-WROVER-IB-N16R8,ESP32-WROVER-IB(M213DH2864UH3Q0)ESP32-WROOM-32DCESP32-WROOM-32DC-N4,ESP32-WROOM-32DC(M113DH3200PH3D0)ESP32-WROOM-32UCESP32-WROOM-32UC-N4,ESP32-WROOM-32UC(M113DH3200UH3D0)ESP32-SOLO-1CESP32-SOLO-1C-N4,ESP32-SOLO-1C(M113SH3200PH3D0)ESP32-WROOM-32SEESP32-WROOM-32SE-N4,ESP32-WROOM-32SE(M123DH3200PH3Q0),ESP32-WROOM-32SE(M123DH3200PH3QC)ESP32-WROOM-32SE-N8,ESP32-WROOM-32SE(M123DH6400PH3QC)ESP32-WROOM-32SE-N16,ESP32-WROOM-32SE(M123DH2800PH3QC)ESP32-WATG-32DESP32-WATG-32D(ATG3DH6400PH3D0)ESP32-WATG-32D(ATG3DH6400PH3D1) www.espressif.com Page4/9Product NameMPNChange DescriptionW1126188 seriesW11261889Chip revision of ESP32 chip on the moduleupgraded to v1.1W11261888ESP32-WROOM-32UESP32-WROOM-32U-N4,ESP32-WROOM-32U(M113DH3200UH3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1ESP32-WROOM-32U-N8,ESP32-WROOM-32U(M113DH6400UH3Q0)ESP32-WROOM-32U-N16,ESP32-WROOM-32U(M113DH2800UH3Q0)ESP32-WROOM-32U-H4,ESP32-WROOM-32U(M113DH3200US3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1;R2 on the module updated from 0 Ω to 100 ΩESP32-WROOM-32DESP32-WROOM-32D-N4,ESP32-WROOM-32D(M113DH3200PH3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1ESP32-WROOM-32D-N8,ESP32-WROOM-32D(M113DH6400PH3Q0)ESP32-WROOM-32D-N16,ESP32-WROOM-32D(M113DH2800PH3Q0)ESP32-WROOM-32D-H4,ESP32-WROOM-32D(M113DH3200PS3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1;R2 on the module updated from 0 Ω to 100 ΩESP32-SOLO-1ESP32-SOLO-1-N4,ESP32-SOLO-1(M113SH3200PH3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1ESP32-SOLO-1-H4,ESP32-SOLO-1(M113SH3200PS3Q0)Chip revision of ESP32 chip on the moduleupgraded to v1.1;R2 on the module updated from 0 Ω to 100 Ω3) 开发板产品 / Development Board Products:Product NameMPNChange DescriptionESP32-DevKitCESP32-DevKitC-32DChip revision of ESP32 chip on the moduleupgraded to v1.1ESP32-DevKitC-32D64ESP32-DevKitC-32UESP32-DevKitC-32U28ESP32-DevKitC-S1ESP32-DevKitC-VBESP32-DevKitC-VIBESP32-DevKitC-VIB64ESP32-DevKitC-SEESP32-DevKitC-SE28ESP-WROVER-KITESP-WROVER-KIT-VBESP-WROVER-KIT-RVBESP32-MeshKit-SenseESP32-MeshKit-SenseESP32-PICO-KITESP32-PICO-KITESP-EYEESP-EYE www.espressif.com Page5/9Product NameMPNChange DescriptionESP32-LyraTD-DSPGESP32-LyraTD-DSPGChip revision of ESP32 chip on the moduleupgraded to v1.1ESP32-Ethernet-KitESP32-Ethernet-KitESP32-Azure-IOT-KitESP32-Azure-IOT-KitESP32-DK-EthernetESP32-DK-Ethernet2. 分类 1 的产品变更对比/ Category 1 Product Change ComparisonNo.项目/ Item变更前/ Before Change变更后/ After Change1Chip Revisionv1.0v1.12RegisterAddress ineFuseEFUSE_BLK0_RDATA5[25]00EFUSE_BLK0_RDATA5[24]01APB_CTRL_DATA[31]00EFUSE_BLK0_RDATA5[20]00EFUSE_BLK0_RDATA3[15]113Chip Marking(Main Die Line)xBxxxxxxxFxxxxxx4Module MPNNo change5Module Marking(Specification Marking Line)XXXXXXMFXXXX6The series resistance of the crystal on theESP32 (–40 ℃ ~ 105 ℃) module0 Ω100 Ω www.espressif.com Page6/9二.分类 2 的产品基本信息/ Category 2 Product Basic Information1. 分类 2 的产品清单/Category 2Product List1) 芯片产品/ Chip Products:ESP32-D0WD-V3, ESP32-D0WDQ6-V3, ESP32-U4WDH, ESP32-D0WDR2-V3,ESP32-PICO-V3, ESP32-PICO-V3-022) 模组产品/ Module Products:Product NameMPNChange DescriptionESP32-WROVER-EESP32-WROVER-E-N4R8,ESP32-WROVER-E(M213EH3264PH3Q0)Chip revision of ESP32 chip on the moduleupgraded to v3.1ESP32-WROVER-E-N8R2,ESP32-WROVER-E(M213EH6416PH3Q0)ESP32-WROVER-E-N8R8,ESP32-WROVER-E(M213EH6464PH3Q0)ESP32-WROVER-E-N16R8,ESP32-WROVER-E(M213EH2864PH3Q0)ESP32-WROVER-IEESP32-WROVER-IE-N4R8,ESP32-WROVER-IE(M213EH3264UH3Q0)ESP32-WROVER-IE-N8R8,ESP32-WROVER-IE(M213EH6464UH3Q0)ESP32-WROVER-IE-N16R8,ESP32-WROVER-IE(M213EH2864UH3Q0)ESP32-DU1906ESP32-DU1906-N8R8,ESP32-DU1906(M403EH6464PH3Q0)ESP32-DU1906-N16R8,ESP32-DU1906(M403EH2864PH3Q0)ESP32-DU1906-UESP32-DU1906-U-N8R8,ESP32-DU1906-U(M403EH6464UH3Q0)ESP32-DU1906-U-N16R8,ESP32-DU1906-U(M403EH2864UH3Q0)ESP32-WROOM-DAESP32-WROOM-DA-N8ESP32-WROOM-DA-N4ESP32-WROOM-DA-N16ESP32-PICO-MINI-02ESP32-PICO-MINI-02-N8R2ESP32-PICO-MINI-02UESP32-PICO-MINI-02U-N8R2ESP32-GRZM32GR300R00EK057IC EK 057-D2-ID5511 A1EK058EK058 MX8PS2ESP32-PICO-V3-ZEROESP32-PICO-V3-ZERO(P103AH0000PH3Q0)ESP32-PICO-V3-ZERO(P103AH0000PH3Q1)ESP32-WROOM-32EESP32-WROOM-32E(M113EH3200PH3QF)Chip revision of ESP32 chip on the moduleupgraded to v3.1ESP32-WROOM-32E-N4,ESP32-WROOM-32E(M113EH3200PH3Q0)ESP32-WROOM-32E-N8,ESP32-WROOM-32E(M113EH6400PH3Q0)ESP32-WROOM-32E-N16,ESP32-WROOM-32E(M113EH2800PH3Q0)ESP32-WROOM-32E-H4,ESP32-WROOM-32E(M113EH3200PS3Q0)Chip revision of ESP32 chip on the moduleupgraded to v3.1;R2 on the module updated from 0 Ω to 100 ΩESP32-WROOM-32E-H8,ESP32-WROOM-32E(M113EH6400PS3Q0) www.espressif.com Page7/9Product NameMPNChange DescriptionESP32-WROOM-32UEESP32-WROOM-32UE-N4,ESP32-WROOM-32UE(M113EH3200UH3Q0)Chip revision of ESP32 chip on the moduleupgraded to v3.1ESP32-WROOM-32UE-N8,ESP32-WROOM-32UE(M113EH6400UH3Q0)ESP32-WROOM-32UE-N16,ESP32-WROOM-32UE(M113EH2800UH3Q0)ESP32-WROOM-32UE-H4,ESP32-WROOM-32UE(M113EH3200US3Q0)Chip revision of ESP32 chip on the moduleupgraded to v3.1;R2 on the module updated from 0 Ω to 100 ΩESP32-WROOM-32UE-H8,ESP32-WROOM-32UE(M113EH6400US3Q0)ESP32-MINI-1ESP32-MINI-1-N4Chip revision of ESP32 chip on the moduleupgraded to v3.1ESP32-MINI-1-H4Chip revision of ESP32 chip on the moduleupgraded to v3.1;R2 on the module updated from 0 Ω to 100 ΩESP32-MINI-1UESP32-MINI-1U-N4Chip revision of ESP32 chip on the moduleupgraded to v3.1ESP32-MINI-1U-H4Chip revision of ESP32 chip on the moduleupgraded to v3.1;R2 on the module updated from 0 Ω to 100 ΩESP32-SIG149ESP32-SIG149Chip revision of ESP32 chip on the moduleupgraded to v3.1;R4 on the module updated from 0 Ω to 100 ΩESP32-SIG1711P8ESP32-SIG1711P83) 开发板产品/ Development Board Products:Product NameMPNChange DescriptionESP32-DevKitCESP32-DevKitC-32EChip revision of ESP32 chip on the boardupgraded to v3.1ESP32-DevKitC-32UEESP32-DevKitC-VEESP32-DevKitC-VIEESP32-DevKitC-32E28ESP32-DevKitC-32UE28ESP32-DevKitC-DAESP32-LyraTESP32-LyraTESP32-LyraTD-MSCESP32-LyraTD-MSCESP32-WROVER-KITESP32-WROVER-KIT-VEESP32-LyraT-MiniESP32-LyraT-MiniESP32-LyraTD-SYNAESP32-LyraTD-SYNAESP32-Vaquita-DSPGESP32-Vaquita-DSPGESP32-KorvoESP32-KorvoESP32-Ethernet-KitESP32-Ethernet-Kit-VEESP32-PICO-KIT-1ESP32-PICO-KIT-1ESP32-PICO-DevKitM-2ESP32-PICO-DevKitM-2ESP32-PICO-DevKitM-2U www.espressif.com Page8/9Product NameMPNChange DescriptionESP32-DevKitM-1ESP32-DevKitM-1Chip revision of ESP32 chip on the boardupgraded to v3.1ESP32-DevKitM-1UESP32-PICO-V3-ZERO-DevKitESP32-PICO-V3-ZERO-DevKit2. 分类 2 的产品变更对比/ Category 2 Product Change ComparisonNo.项目/ Item变更前/ Before Change变更后/ After Change1Chip Revisionv3.0v3.12RegisterAddress ineFuseEFUSE_BLK0_RDATA5[25]00EFUSE_BLK0_RDATA5[24]01APB_CTRL_DATA[31]11EFUSE_BLK0_RDATA5[20]11EFUSE_BLK0_RDATA3[15]113Chip Marking(Main Die Line)xExxxxxxxGxxxxxx4Module MPNNo change5Module Marking(Specification Marking Line)XXXXXXMGXXXX6The series resistance of the crystal on theESP32 (–40 ℃ ~ 105 ℃) module0 Ω100 Ω www.espressif.com Page9/9邮件订阅Espressif Email Notifications乐鑫为注册用户提供电子邮件通知服务,用户可通过乐鑫订阅系统接收技术文档更新、新闻通讯、PCN 等邮件通知。Espressif sends email notifications of technical documentation changes, along with newsletters, PCNs andother valuable information, to subscribed customers only. 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Customers would be considered as having acknowledged the PCN if no response isreceived after 14 calendar days.请反馈至 pcn@espressif.com。Please send feedback to pcn@espressif.com.客户批准/确认信息Customer Approval/Acknowledgement and Remarks客户公司全称:Customer’s Company Name:PCN评审结果/ PCN Review Result:批准/确认Accepted/Acknowledged不批准/ Rejected需要分析/ Further Analysis Required客户意见/Comment:公司代表人姓名Representative’s Name:公司代表人职责Representative’s Job Title:公司代表人签名Representative’s Signature:日期Date: